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TECHNICAL PAPERS

High-Temperature Reliability of Advanced Ceramics

[+] Author and Article Information
Tatsuki Ohji

National Industrial Research Institute of Nagoya, Nagoya 463-8687, Japane-mail: tohji@nirin.go.jp

J. Energy Resour. Technol 123(1), 64-69 (Oct 30, 2000) (6 pages) doi:10.1115/1.1347990 History: Received March 15, 2000; Revised October 30, 2000
Copyright © 2001 by ASME
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References

Ohji,  T., and Yamauchi,  Y., 1992, “Long-Term Tensile Creep Testing for Advanced Ceramics,” J. Am. Ceram. Soc., 75, pp. 2304–2307.
Ferber,  M. K., and Jenkins,  M. G., 1992, “Evaluation of the Strength and Creep-Fatigue Behavior of Hot Isostatically Pressed Silicon Nitride,” J. Am. Ceram. Soc., 75, pp. 2453–2462.
Luecke,  W. E., Wiederhorn,  S. M., Hockey,  B. J., Krause,  R. F. , and Long,  G. G., 1995, “Cavitation Contributes Substantially to Tensile Creep of Silicon Nitride,” J. Am. Ceram. Soc., 78, pp. 2085–2096.
Ohji,  T., and Yamauchi,  Y., 1993, “Tensile Creep and Creep Rupture Behaviors of Monolithic and SiC Whisker Reinforced Silicon Nitride Ceramics,” J. Am. Ceram. Soc., 76, pp. 3105–3112.
Quinn,  G. D., 1990, “Fracture Mechanism Maps for Advanced Structural Ceramics, Part 1,” J. Mater. Sci., 25, pp. 4361–4376.
Wiederhorn,  S. M., Hockey,  B. J., Cranmer,  D. C., and Yeckley,  R., 1993, “Transient Creep Behavior of Hot Isostatically Pressed Silicon Nitride,” J. Mater. Sci., 28, pp. 445–453.
Evans,  A. G., and Rana,  A., 1980, “High Temperature Failure Mechanisms in Ceramics,” Acta Metall., 28, pp. 129–141.
Thouless,  M. D., and Evans,  A. G., 1984, “Nucleation of Cavities During Creep of Liquid-Phase-Sintered Materials,” J. Am. Ceram. Soc., 67, pp. 721–727.
Monkman, F. C., and Grant, N. J., 1956, “An Empirical Relationship Between Rupture Life and Minimum Creep Rate in Creep Rupture Tests,” Proc., ASTM, 56 , pp. 593–620.
Marion,  J. D., Evans,  A. G., Drory,  M. D., and Clarke,  D. R., 1983, “High Temperature Failure Initiation in Liquid Phase Sintered Materials,” Acta Metall., 31, pp. 1445–1457.
Ohji,  T., and Yamauchi,  Y., 1994, “Difusional Crack Growth and Creep Rupture of Silicon Carbide Doped With Alumina,” J. Am. Ceram. Soc., 77, pp. 678–682.
Lane,  J. E., Carter,  C. H., and Davis,  R. F., 1988, “Kinetics and Mechanisms of High Temperature Creep in Silicon Carbide: III, Sintered a-Silicon Carbide,” J. Am. Ceram. Soc., 71, pp. 281–295.
Chuang,  T.-J., 1982, “A Diffusive Crack-Growth Model for Creep Fracture,” J. Am. Ceram. Soc., 65, pp. 93–103.
Niihara,  K., 1991, “New Design Concept of Structural Ceramics-Ceramic Nanocomposite-,” J. Ceram. Soc. Jpn., 99, pp. 974–982.
Ohji,  T., Nakahira,  A., Hirano,  T., and Niihara,  K., 1994, “Tensile Creep Behavior of Alumina/Silicon Carbide Nanocomposite,” J. Am. Ceram. Soc., 77, pp. 3259–3262.
Thompson,  A., Chan,  H. M., and Harmer,  M. P., 1997, “Tensile Creep of Alumina-Silicon Carbide “Nanocomposite”, ” J. Am. Ceram. Soc., 80, pp. 2221–2228.
Ohji,  T., Hirano,  T., Nakahira,  A., and Niihara,  K., 1996, “Particle/Matrix Interface and Its Role in Creep Inhibition Alumina/Silicon Carbide Nanocomposite,” J. Am. Ceram. Soc., 79, pp. 33–45.
Ohji,  T., Kusunose,  T., and Niihara,  K., 1998, “Threshold Stress in Creep of Alumina/Silicon Carbide Nanocomposite,” J. Am. Ceram. Soc., 81, pp. 2713–2716.
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Figures

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Comparison of the 1000-h rupture lives of a commercial grade of silicon nitride (NT154) and a CGT silicon nitride (SN C; see the text for details) with a single-crystal high-temperature alloy (CMSX-2)
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Cut view of a ceramic gas turbine developed in the CGT project
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Performance progress of 300-kW metal and ceramic gas turbines
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Temperature dependency of flexure strength for silicon nitride and silicon carbide. The number in parentheses is the year of development. For SN B and SN C, see the text.
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Grain boundaries of SN A (a), and SN C (b)
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Tensile creep curves at 1400°C under 200 and 250 MPa
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Stress dependencies of the creep lives of SN A, SN B, and SN C. Fatigue exponent is typically 3.0 below 200 MPa, and 10.0 above 250 MPa. The arrow indicates the surviving specimen.
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Relationship between time-to-failure and minimum creep rates for the data of SN A, SN B, and SN C. The arrow indicates the surviving specimen.
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Grain boundary of the alumina-doped silicon carbide
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Stress dependency of creep lives of silicon carbide at 1400°C. The curve is based on a diffusive crack growth model. The threshold stress was estimated at 165 MPa from the curve. The arrow indicates the surviving specimen.
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Behavior of an intergranular silicon carbide nano-particle in alumina/silicon carbide nanocomposite after creep
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Stress dependencies of the minimum creep rates of alumina monolith and alumina/17 vol percent silicon carbide nanocomposite at 1200°C
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Stress dependencies of creep lives of alumina monolith and alumina/17 vol percent silicon carbide nanocomposite at 1200°C. The arrow indicates the surviving specimen. The fatigue exponent is 3.0 for both the materials.

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