Holographic particle image velocimetry (PIV) is a novel application of holography that allows for tracking of small particle sized objects in a small volume. Whereas regular PIV allows for the two in-plane components of the velocity field to be measured, and stereoscopic PIV allows for the three-components of the velocity field to be measured in a thin plane, holographic PIV allows for the three-components of the velocity to be measured for each individual particle present in the measuring volume, thus allowing to fully resolve fluid flows that are inherently 3D in nature. There are many examples of three dimensional flows in nature including turbulence flows, but another very interesting application very well suited for this technique involves tracking living microorganisms in order to study their motion and their means of propulsion. As part of this research a micro organism was tracked in three dimensions using a high speed microscopic holographic imaging method. The ability to track organisms in 3D allows better understanding and characterizing of their behavior including their propulsion methods, their feeding methods and their interaction with each other. The time resolved holograms were reconstructed in Matlab using Fast Fourier Transforms. A laser pointer was used as a source of coherent light, and a high speed PIV camera (Photron APX Ultima) was used to capture the images. A beam expander was used to increase the diameter of the laser beam allowing for a larger tracking area. Results with this system will show the trajectories in 3D of microorganisms as well as the three components of the velocity field showing the interaction of the organisms with their environment.
High Speed Micro Holographic PIV Measurements of Microorganisms
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Zarzecki, M, & Diez, FJ. "High Speed Micro Holographic PIV Measurements of Microorganisms." Proceedings of the ASME 2008 International Mechanical Engineering Congress and Exposition. Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C. Boston, Massachusetts, USA. October 31–November 6, 2008. pp. 2029-2033. ASME. https://doi.org/10.1115/IMECE2008-69272
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