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Proceedings Papers

Design Techniques for Minimizing Manufacturing Variations in Surface Micromachined Accelerometers

Stephen F. Bart, Howard R. Samuels
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 427-433, November 17–22, 1996
Paper No: IMECE1996-1385
https://doi.org/10.1115/IMECE1996-1385
View Paper titled, Design Techniques for Minimizing Manufacturing Variations in Surface Micromachined Accelerometers
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Topics: Accelerometers, Engineering design processes, Manufacturing, Micromachining, Etching, Capacitors, Design, Dimensions, Geometry, Sensors
Proceedings Papers

Flow and Heat Transfer Problems in the Semiconductor Manufacturing Processes

Masato Ikegawa
Proc. ASME. IMECE96, Transport Phenomena in Materials Processing and Manufacturing, 183, November 17–22, 1996
Paper No: IMECE1996-1044
https://doi.org/10.1115/IMECE1996-1044
View Paper titled, Flow and Heat Transfer Problems in the Semiconductor Manufacturing Processes
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Topics: Flow (Dynamics), Heat transfer, Integrated circuit fabrication, Semiconductor wafers, Manufacturing, Particulate matter, Chemical reactions, Chemical vapor deposition, Contamination, Etching
Proceedings Papers

A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints

Y.-H. Pao, E. Jih, V. Siddapureddy, X. Song, R. Liu, R. McMillan, J. M. Hu
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 1-12, November 17–22, 1996
Paper No: IMECE1996-0884
https://doi.org/10.1115/IMECE1996-0884
View Paper titled, A Thermal Fatigue Model for Surface Mount Leadless Chip Resistor (LCR) Solder Joints
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Topics: Fatigue, Resistors, Solder joints, Surface mount packaging, Capacitors, Ceramics, Density, Failure, Failure analysis, Fatigue failure
Proceedings Papers

Attaining Nonlinear Hardening Stiffness in Piezoelectric Vibration Applications Using Passive Nonlinear P-N Junction Capacitance

Muhammed Ali Taşkıran, Mehmet Bülent Özer
Proc. ASME. IMECE2022, Volume 5: Dynamics, Vibration, and Control, V005T07A090, October 30–November 3, 2022
Paper No: IMECE2022-94594
https://doi.org/10.1115/IMECE2022-94594
View Paper titled, Attaining Nonlinear Hardening Stiffness in Piezoelectric Vibration Applications Using Passive Nonlinear P-N Junction Capacitance
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Topics: Capacitance, Circuits, Energy harvesting, Hardening, Junctions, Stiffness, Vibration, Vibration isolation, Resonance, Finite element methods
Proceedings Papers

Review of Wave Energy Converter Power Take-Off Systems, Testing Practices, and Evaluation Metrics

Nathan Tom
Proc. ASME. IMECE2022, Volume 6: Energy, V006T08A065, October 30–November 3, 2022
Paper No: IMECE2022-94077
https://doi.org/10.1115/IMECE2022-94077
View Paper titled, Review of Wave Energy Converter Power Take-Off Systems, Testing Practices, and Evaluation Metrics
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Topics: Testing, Wave energy converters, Wave energy, Waves, Design, Energy conversion, Stress, Chain, Batteries, Capacitors
Proceedings Papers

Active Structural Control of Vertical Turning Lathe Vibrations

John E. Miesner, Reza Ghanadan, Stephen D. O’Regan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 105-112, November 16–21, 1997
Paper No: IMECE1997-1082
https://doi.org/10.1115/IMECE1997-1082
View Paper titled, Active Structural Control of Vertical Turning Lathe Vibrations
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Topics: Turning, Vibration, Control equipment, Signals, Accelerometers, Actuators, Capacitors, Chatter, Control systems, Electronic components
Proceedings Papers

Enhanced Piezoelectric Shunt Design

Chul H. Park, Kazuhisa Kabeya, Daniel J. Inman
Proc. ASME. IMECE98, Adaptive Structures and Material Systems, 149-155, November 15–20, 1998
Paper No: IMECE1998-0948
https://doi.org/10.1115/IMECE1998-0948
View Paper titled, Enhanced Piezoelectric Shunt Design
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Topics: Design, Circuits, Vibration, Capacitors, Aluminum, Circuit design, Passive damping, Piezoelectric ceramics, Vibration suppression
Proceedings Papers

A Stiction Study via C-V Plot Electrostatic Actuation/Latching

Gary O’Brien, Liwei Lin, David J. Monk
Proc. ASME. IMECE99, Micro-Electro-Mechanical Systems (MEMS), 275-281, November 14–19, 1999
Paper No: IMECE1999-0280
https://doi.org/10.1115/IMECE1999-0280
View Paper titled, A Stiction Study via C-V Plot Electrostatic Actuation/Latching
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Topics: Stiction, Adhesion, Polysilicon, Elastic constants, Surface energy, Actuators, Capacitance, Capacitors, Microscale devices
Proceedings Papers

Modeling and Compensation of Hysteresis in Piezoceramic Transducers for Vibration Control

Soon-Hong Lee, Thomas J. Royston, Gary Friedman
Proc. ASME. IMECE99, Adaptive Structures and Material Systems, 11-18, November 14–19, 1999
Paper No: IMECE1999-0521
https://doi.org/10.1115/IMECE1999-0521
View Paper titled, Modeling and Compensation of Hysteresis in Piezoceramic Transducers for Vibration Control
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Topics: Modeling, Piezoelectric ceramics, Transducers, Vibration control, Capacitors, Composite materials, Feedforward control
Proceedings Papers

A CMOS-MEMS Micromirror With Large Out-of-Plane Actuation

Huikai Xie, Yingtian Pan, Gary K. Fedder
Proc. ASME. IMECE2001, Micro-Electro-Mechanical Systems (MEMS), 89-92, November 11–16, 2001
Paper No: IMECE2001/MEMS-23813
https://doi.org/10.1115/IMECE2001/MEMS-23813
View Paper titled, A CMOS-MEMS Micromirror With Large Out-of-Plane Actuation
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Topics: Complementary metal oxide semiconductors, Microelectromechanical systems, Mirrors, Silicon, Aluminum, Bonding, Capacitance, Capacitors, Crystals, Displacement
Proceedings Papers

Dynamics of a Nonlinear Mechanical Resonator in Micro-Electro-Mechanical Systems

Albert C. J. Luo, F. Y. Wang
Proc. ASME. IMECE2001, Vibration and Control of Mechanical Systems, 229-235, November 11–16, 2001
Paper No: IMECE2001/DE-23229
https://doi.org/10.1115/IMECE2001/DE-23229
View Paper titled, Dynamics of a Nonlinear Mechanical Resonator in Micro-Electro-Mechanical Systems
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Topics: Dynamics (Mechanics), Microelectromechanical systems, Resonance, Capacitors, Electromagnetic spectrum, Equilibrium (Physics), Transducers
Proceedings Papers

Design of Liquid Cooled Coldplate for the Inverter of the Hybrid Electric Vehicle

C. Edward Jih, K. Chen, T. Abraham, V. Siddapureddy, R. Poulson, V. A. Sankaran
Proc. ASME. IMECE2000, Heat Transfer: Volume 4, 357-363, November 5–10, 2000
Paper No: IMECE2000-1540
https://doi.org/10.1115/IMECE2000-1540
View Paper titled, Design of Liquid Cooled Coldplate for the Inverter of the Hybrid Electric Vehicle
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Topics: Design, Hybrid electric vehicles, Computational fluid dynamics, Fins, Coolants, Flow (Dynamics), Gates (Closures), Heat, Packaging, Pressure drop
Proceedings Papers

Compact Drive Electronics for Solid-State Actuators

Jeffrey S. N. Paine, David S. Bennett, Carlos E. Cuadros
Proc. ASME. IMECE2000, Adaptive Structures and Material Systems, 77-84, November 5–10, 2000
Paper No: IMECE2000-1692
https://doi.org/10.1115/IMECE2000-1692
View Paper titled, Compact Drive Electronics for Solid-State Actuators
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Topics: Actuators, Electronics, Piezoelectric actuators, Piezoelectric materials, Stress, Capacitors, Electronic packages, Energy dissipation
Proceedings Papers

Piezoceramic Hysteresis in the Adaptive Structural Vibration Control Problem

Soon-Hong Lee, M. Bulent Ozer, Thomas J. Royston
Proc. ASME. IMECE2000, Adaptive Structures and Material Systems, 453-460, November 5–10, 2000
Paper No: IMECE2000-1736
https://doi.org/10.1115/IMECE2000-1736
View Paper titled, Piezoceramic Hysteresis in the Adaptive Structural Vibration Control Problem
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Topics: Piezoelectric ceramics, Vibration control, Semiconductor wafers, Capacitors, Equations of motion, Linear systems, Modeling, Simply supported beams
Proceedings Papers

Silicon Micromachined Ultrasonic Transducers

Butrus T. Khuri-Yakub, Ching-Hsiang Cheng, Fahrettin-Levent Degertekin, Sanli Ergun, Sean Hansen, Xue-Cheng Jin, Omer Oralkan
Proc. ASME. IMECE2000, Noise Control and Acoustics, 153-171, November 5–10, 2000
Paper No: IMECE2000-1602
https://doi.org/10.1115/IMECE2000-1602
View Paper titled, Silicon Micromachined Ultrasonic Transducers
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Topics: Micromachining, Silicon, Ultrasonic transducers, Transducers, Capacitors, Piezoelectric transducers, Design, Dimensions, Integrated circuit fabrication, Ultrasonic applications
Proceedings Papers

New Paradigms in Electronics Cooling Engineering

David Copeland
Proc. ASME. IMECE2000, Successfully Managing the Risk and Development of Your Business and Technology, 45, November 5–10, 2000
Paper No: IMECE2000-1179
https://doi.org/10.1115/IMECE2000-1179
View Paper titled, New Paradigms in Electronics Cooling Engineering
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Topics: Computer cooling, Heat sinks, Aluminum, Cooling, Computers, Metals, Electronics, Extruding, Aluminum alloys, Capacitors
Proceedings Papers

Microfluidic Level Sensors

M. Sesterhenn, T. Strobelt, H. Ashauer, G. Raffa, H. Sandmaier, M. Schmitt
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 397-403, November 5–10, 2000
Paper No: IMECE2000-1122
https://doi.org/10.1115/IMECE2000-1122
View Paper titled, Microfluidic Level Sensors
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Topics: Microfluidics, Sensors, Signals, Electrolytes, Resolution (Optics), Bubbles, Capacitors, Design, Electrical conductance, Electronics
Proceedings Papers

Micromachined Planar Coil Tactile Sensor Implantable in Soft Structure

Nobuyuki Futai, Takashi Yasuda, Masayuki Inaba, Isao Shimoyama, Hirochika Inoue
Proc. ASME. IMECE2000, Micro-Electro-Mechanical Systems (MEMS), 51-56, November 5–10, 2000
Paper No: IMECE2000-1070
https://doi.org/10.1115/IMECE2000-1070
View Paper titled, Micromachined Planar Coil Tactile Sensor Implantable in Soft Structure
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Topics: Micromachining, Tactile sensors, Resonance, Silicone rubber, Capacitors, Deformation, Design, Electromagnetic spectrum, Engineering prototypes, Manufacturing
Proceedings Papers

Key Parameters Affecting Solder Joint Life of Chip Resistors and Chip Capacitors Mounted on Insulated Metal Substrate

Nicoletta Sangalli, Donald B. Barker
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 35-41, November 5–10, 2000
Paper No: IMECE2000-2244
https://doi.org/10.1115/IMECE2000-2244
View Paper titled, Key Parameters Affecting Solder Joint Life of Chip Resistors and Chip Capacitors Mounted on Insulated Metal Substrate
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Topics: Capacitors, Metals, Resistors, Solder joints, Finite element analysis, Aluminum, Ceramics, Energy dissipation, Heat, Temperature
Proceedings Papers

An Engineering Approach to Model Blood Cells Electrical Characteristics: From Biological to Digital-Twin

Luca Fontanili, Massimo Milani, Luca Montorsi, Letizia Scurani, Francesco Fabbri
Proc. ASME. IMECE2020, Volume 5: Biomedical and Biotechnology, V005T05A009, November 16–19, 2020
Paper No: IMECE2020-23583
https://doi.org/10.1115/IMECE2020-23583
View Paper titled, An Engineering Approach to Model Blood Cells Electrical Characteristics: From Biological to Digital-Twin
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Topics: Blood, Capacitors, Membranes, Biological cells, Blood vessels, Dimensions, Disks, Electric charge, Electromagnetic fields, Engineering systems and industry applications