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Proceedings Papers

Application of Metallic Nanoparticle Suspensions in Advanced Cooling Systems

Shinpyo Lee, Stephen U.-S. Choi
Proc. ASME. IMECE96, Recent Advances in Solids/Structures and Application of Metallic Materials, 227-234, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0161
https://doi.org/10.1115/IMECE1996-0161
View Paper titled, Application of Metallic Nanoparticle Suspensions in Advanced Cooling Systems
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Topics: Cooling systems, Nanoparticles, Heat exchangers, Microchannels, Nanofluids, Cooling, Fluids, Silicon, Heat transfer, Nitrogen
Proceedings Papers

Methods of Simulating Fouling Effect in Water-Cooled Condenser With a Sub-Cooler

Shan S. Li
Proc. ASME. IMECE96, Advanced Energy Systems, 41-45, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0259
https://doi.org/10.1115/IMECE1996-0259
View Paper titled, Methods of Simulating Fouling Effect in Water-Cooled Condenser With a Sub-Cooler
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Topics: Condensers (steam plant), Water, Heat exchangers, Circuits, Cooling, Flow (Dynamics), Algorithms, Approximation, Couplings, Energy consumption
Proceedings Papers

Optimum Design of Microchannel Heat Sinks

S. F. Choquette, M. Faghri, M. Charmchi, Y. Asako
Proc. ASME. IMECE96, Microelectromechanical Systems (MEMS), 115-126, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-1344
https://doi.org/10.1115/IMECE1996-1344
View Paper titled, Optimum Design of Microchannel Heat Sinks
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Topics: Design, Heat sinks, Microchannels, Thermal resistance, Turbulence, Optimization, Boundary-value problems, Computers, Fluids, Friction
Proceedings Papers

Thermal Management in Direct Chip Attach Assemblies

Daniel F. Baldwin, James T. Beerensson, Suresh K. Sitaraman
Proc. ASME. IMECE96, Sensing, Modeling and Simulation in Emerging Electronic Packaging, 29-37, November 17–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1996-0887
https://doi.org/10.1115/IMECE1996-0887
View Paper titled, Thermal Management in Direct Chip Attach Assemblies
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Topics: Thermal management, Adhesives, Electronics, Anisotropy, Design, Energy dissipation, Flip-chip, Flip-chip assemblies, Flip-chip devices, Junctions
Proceedings Papers

Thermal Performance Evaluation of VBGA Packages

Wen C. Zheng, Paul Y. F. Wu, James J. D. Lan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 329-337, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1107
https://doi.org/10.1115/IMECE1997-1107
View Paper titled, Thermal Performance Evaluation of VBGA Packages
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Topics: Air flow, Ball-Grid-Array packages, Engineering simulation, Finite element methods, Finite element model, Heat transfer coefficients, Modeling, Performance evaluation, Simulation, Thermal resistance
Proceedings Papers

The Effects of Transverse Acceleration-Induced Body Forces on the Capillary Limit of Helically-Grooved Heat Pipes

Scott K. Thomas, Kevin S. Klasing, Kirk L. Yerkes
Proc. ASME. IMECE97, Advanced Energy Systems, 3-15, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0968
https://doi.org/10.1115/IMECE1997-0968
View Paper titled, The Effects of Transverse Acceleration-Induced Body Forces on the Capillary Limit of Helically-Grooved Heat Pipes
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Topics: Heat pipes, Fluids, Geometry, Heat, Thermal resistance, Copper, Ethanol, Pipes, Steady state, Temperature
Proceedings Papers

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

D. Angirasa, F. Pyrtle, III, G. P. Peterson
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 279-285, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0853
https://doi.org/10.1115/IMECE1997-0853
View Paper titled, Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package
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Topics: Cooling, Electronic packages, Heat sinks, Temperature, Aluminum, Computer cooling, Heat, Heat transfer, Porosity, Reynolds number
Proceedings Papers

Transient, Three-Dimensional Heat Transfer Model for the Laser Assisted Machining of Ceramic Materials

Jay C. Rozzi, Frank P. Incropera, Yung C. Shin
Proc. ASME. IMECE97, Heat Transfer: Volume 1, 75-85, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0833
https://doi.org/10.1115/IMECE1997-0833
View Paper titled, Transient, Three-Dimensional Heat Transfer Model for the Laser Assisted Machining of Ceramic Materials
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Topics: Ceramics, Heat transfer, Lasers, Machining, Transients (Dynamics), Temperature, Cutting tools, Temperature distribution, Carbon dioxide lasers, Silicon nitride ceramics
Proceedings Papers

Thin Film Resistance Heaters for High Heat Flux Jet-Array Cooling Experiments

Hesham F. Younis, Rudy S. Dahbura, John H. Lienhard, V
Proc. ASME. IMECE97, Heat Transfer: Volume 3, 127-134, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0901
https://doi.org/10.1115/IMECE1997-0901
View Paper titled, Thin Film Resistance Heaters for High Heat Flux Jet-Array Cooling Experiments
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Topics: Cooling, Heat flux, Thin films, Flux (Metallurgy), Heat, Ceramics, Metals, Plasmas (Ionized gases), Bulk solids, Design
Proceedings Papers

Heat Transfer in Generator Armature Bar Region Near a Resistance Temperature Detector

Wei Tong
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 249-253, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0658
https://doi.org/10.1115/IMECE1998-0658
View Paper titled, Heat Transfer in Generator Armature Bar Region Near a Resistance Temperature Detector
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Topics: Generators, Heat transfer, Resistance thermometers, Copper, Heat, Temperature, Cooling, Engineers, Ferrosilicon, Finite element methods
Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia
Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-1089
https://doi.org/10.1115/IMECE1998-1089
View Paper titled, Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package
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Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks
Proceedings Papers

Temperature Effect on Power MOSFET Devices

W. Lu, L. C. Chow, K. B. Sundaram
Proc. ASME. IMECE98, Advanced Energy Systems, 467-473, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0875
https://doi.org/10.1115/IMECE1998-0875
View Paper titled, Temperature Effect on Power MOSFET Devices
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Topics: MOSFET transistors, Temperature, Thermal resistance, Junctions, Heat, Operating temperature, Cooling, Circuits, Heat sinks, Low temperature
Proceedings Papers

Assessment of Coupled Natural Convection and Radiation Within Enclosed Vertical Annuli

Joseph C. Sanders
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 273-280, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0661
https://doi.org/10.1115/IMECE1998-0661
View Paper titled, Assessment of Coupled Natural Convection and Radiation Within Enclosed Vertical Annuli
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Topics: Annulus, Natural convection, Radiation (Physics), Storage, Metals, Temperature, Boundary-value problems, Containers, Heat, Heat transfer
Proceedings Papers

Effects of Mesh Size in a Flat Evaporator and Condenser Cooling Capacity on the Thermal Performance of a Capillary Pumped Loop

J. H. Boo, M. S. Chun
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 121-127, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0644
https://doi.org/10.1115/IMECE1998-0644
View Paper titled, Effects of Mesh Size in a Flat Evaporator and Condenser Cooling Capacity on the Thermal Performance of a Capillary Pumped Loop
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Topics: Condensers (steam plant), Cooling, Vapors, Heat flux, Convection, Copper, Dimensions, Ethanol, Flow (Dynamics), Fluids
Proceedings Papers

Micro Channel Heat Exchanger for Cooling Electrical Equipment

Koichiro Kawano, Ko Minakami, Hideo Iwasaki, Masaru Ishizuka
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 173-180, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0650
https://doi.org/10.1115/IMECE1998-0650
View Paper titled, Micro Channel Heat Exchanger for Cooling Electrical Equipment
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Topics: Cooling, Electrical components, Heat exchangers, Microchannels, Pressure, Heat, Heat transfer, Computer simulation, Design, Integrated circuits
Proceedings Papers

Protective Clothing Containing Encapsulated Phase Change Materials

David P. Colvin, Yvonne G. Bryant
Proc. ASME. IMECE98, Advances in Heat and Mass Transfer in Biotechnology, 123-132, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0807
https://doi.org/10.1115/IMECE1998-0807
View Paper titled, Protective Clothing Containing Encapsulated Phase Change Materials
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Topics: Phase change materials, Protective clothing, Fibers, Foams (Chemistry), Particulate matter, Thermal energy storage, Air Force, Arctic region, Capacitance, Coatings
Proceedings Papers

Deriving Thermal Model From Data by Sparse Identification Based on Physical Laws

Tomoyuki Suzuki, Akira Kano, Kenji Hirohata
Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A003, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-70639
https://doi.org/10.1115/IMECE2021-70639
View Paper titled, Deriving Thermal Model From Data by Sparse Identification Based on Physical Laws
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Topics: Design, Forced convection, Heat capacity, Heat transfer, Machine learning, Maintenance, Natural convection, Network models, Nonlinear dynamical systems, Physical laws
Proceedings Papers

Multi-Objective Thermal Optimization of a Nanofluid-Cooled Rectangular Microchannel Heat Sink Using Genetic Algorithm: A Comparative Study

Hamid Fazeli
Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A054, November 1–5, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2021-68217
https://doi.org/10.1115/IMECE2021-68217
View Paper titled, Multi-Objective Thermal Optimization of a Nanofluid-Cooled Rectangular Microchannel Heat Sink Using Genetic Algorithm: A Comparative Study
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Topics: Genetic algorithms, Heat sinks, Microchannels, Nanofluids, Optimization, Water, Carbon nanotubes, Nanoparticles, Design, Thermal resistance
Proceedings Papers

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Tien-Yu Tom Lee
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0966
https://doi.org/10.1115/IMECE1999-0966
View Paper titled, An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool
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Topics: Ball-Grid-Array packages, Computational fluid dynamics, Flip-chip, Flip-chip devices, Flat heat pipes, Heat sinks, Heat transfer, Aluminum, Copper, Flip-chip packages
Proceedings Papers

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

T. M. Ying, K. C. Toh
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 29-36, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0967
https://doi.org/10.1115/IMECE1999-0967
View Paper titled, A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages
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Topics: Ball-Grid-Array packages, Solders, Thermal analysis, Ball-Grid-Array packaging, Solder joints, Energy dissipation, Finite element methods, Finite element model, Heat, Boundary-value problems