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Proceedings Papers

Thermal Performance Evaluation of VBGA Packages

Wen C. Zheng, Paul Y. F. Wu, James J. D. Lan

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 329-337, November 16–21, 1997

Paper No: IMECE1997-1107

DOI: https://doi.org/10.1115/IMECE1997-1107

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Topics: Air flow, Ball-Grid-Array packages, Engineering simulation, Finite element methods, Finite element model, Heat transfer coefficients, Modeling, Performance evaluation, Simulation, Thermal resistance

Proceedings Papers

Thin Film Resistance Heaters for High Heat Flux Jet-Array Cooling Experiments

Hesham F. Younis, Rudy S. Dahbura, John H. Lienhard, V

Proc. ASME. IMECE97, Heat Transfer: Volume 3, 127-134, November 16–21, 1997

Paper No: IMECE1997-0901

DOI: https://doi.org/10.1115/IMECE1997-0901

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Topics: Cooling, Heat flux, Thin films, Flux (Metallurgy), Heat, Ceramics, Metals, Plasmas (Ionized gases), Bulk solids, Design

Proceedings Papers

The Effects of Transverse Acceleration-Induced Body Forces on the Capillary Limit of Helically-Grooved Heat Pipes

Scott K. Thomas, Kevin S. Klasing, Kirk L. Yerkes

Proc. ASME. IMECE97, Advanced Energy Systems, 3-15, November 16–21, 1997

Paper No: IMECE1997-0968

DOI: https://doi.org/10.1115/IMECE1997-0968

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Topics: Heat pipes, Fluids, Geometry, Heat, Thermal resistance, Copper, Ethanol, Pipes, Steady state, Temperature

Proceedings Papers

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

D. Angirasa, F. Pyrtle, III, G. P. Peterson

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 279-285, November 16–21, 1997

Paper No: IMECE1997-0853

DOI: https://doi.org/10.1115/IMECE1997-0853

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Topics: Cooling, Electronic packages, Heat sinks, Temperature, Aluminum, Computer cooling, Heat, Heat transfer, Porosity, Reynolds number

Proceedings Papers

Transient, Three-Dimensional Heat Transfer Model for the Laser Assisted Machining of Ceramic Materials

Jay C. Rozzi, Frank P. Incropera, Yung C. Shin

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 75-85, November 16–21, 1997

Paper No: IMECE1997-0833

DOI: https://doi.org/10.1115/IMECE1997-0833

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Topics: Ceramics, Heat transfer, Lasers, Machining, Transients (Dynamics), Temperature, Cutting tools, Temperature distribution, Carbon dioxide lasers, Silicon nitride ceramics

Proceedings Papers

Protective Clothing Containing Encapsulated Phase Change Materials

David P. Colvin, Yvonne G. Bryant

Proc. ASME. IMECE98, Advances in Heat and Mass Transfer in Biotechnology, 123-132, November 15–20, 1998

Paper No: IMECE1998-0807

DOI: https://doi.org/10.1115/IMECE1998-0807

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Topics: Phase change materials, Protective clothing, Fibers, Foams (Chemistry), Particulate matter, Thermal energy storage, Air Force, Arctic region, Capacitance, Coatings

Proceedings Papers

Temperature Effect on Power MOSFET Devices

W. Lu, L. C. Chow, K. B. Sundaram

Proc. ASME. IMECE98, Advanced Energy Systems, 467-473, November 15–20, 1998

Paper No: IMECE1998-0875

DOI: https://doi.org/10.1115/IMECE1998-0875

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Topics: MOSFET transistors, Temperature, Thermal resistance, Junctions, Heat, Operating temperature, Cooling, Circuits, Heat sinks, Low temperature

Proceedings Papers

Assessment of Coupled Natural Convection and Radiation Within Enclosed Vertical Annuli

Joseph C. Sanders

Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 273-280, November 15–20, 1998

Paper No: IMECE1998-0661

DOI: https://doi.org/10.1115/IMECE1998-0661

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Topics: Annulus, Natural convection, Radiation (Physics), Storage, Metals, Temperature, Boundary-value problems, Containers, Heat, Heat transfer

Proceedings Papers

Effects of Mesh Size in a Flat Evaporator and Condenser Cooling Capacity on the Thermal Performance of a Capillary Pumped Loop

J. H. Boo, M. S. Chun

Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 121-127, November 15–20, 1998

Paper No: IMECE1998-0644

DOI: https://doi.org/10.1115/IMECE1998-0644

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Topics: Condensers (steam plant), Cooling, Vapors, Heat flux, Convection, Copper, Dimensions, Ethanol, Flow (Dynamics), Fluids

Proceedings Papers

Micro Channel Heat Exchanger for Cooling Electrical Equipment

Koichiro Kawano, Ko Minakami, Hideo Iwasaki, Masaru Ishizuka

Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 173-180, November 15–20, 1998

Paper No: IMECE1998-0650

DOI: https://doi.org/10.1115/IMECE1998-0650

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Topics: Cooling, Electrical components, Heat exchangers, Microchannels, Pressure, Heat, Heat transfer, Computer simulation, Design, Integrated circuits

Proceedings Papers

Heat Transfer in Generator Armature Bar Region Near a Resistance Temperature Detector

Wei Tong

Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 249-253, November 15–20, 1998

Paper No: IMECE1998-0658

DOI: https://doi.org/10.1115/IMECE1998-0658

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Topics: Generators, Heat transfer, Resistance thermometers, Copper, Heat, Temperature, Cooling, Engineers, Ferrosilicon, Finite element methods

Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998

Paper No: IMECE1998-1089

DOI: https://doi.org/10.1115/IMECE1998-1089

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Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks

Proceedings Papers

Multi-Objective Thermal Optimization of a Nanofluid-Cooled Rectangular Microchannel Heat Sink Using Genetic Algorithm: A Comparative Study

Hamid Fazeli

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A054, November 1–5, 2021

Paper No: IMECE2021-68217

DOI: https://doi.org/10.1115/IMECE2021-68217

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Topics: Genetic algorithms, Heat sinks, Microchannels, Nanofluids, Optimization, Water, Carbon nanotubes, Nanoparticles, Design, Thermal resistance

Proceedings Papers

Deriving Thermal Model From Data by Sparse Identification Based on Physical Laws

Tomoyuki Suzuki, Akira Kano, Kenji Hirohata

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A003, November 1–5, 2021

Paper No: IMECE2021-70639

DOI: https://doi.org/10.1115/IMECE2021-70639

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Topics: Design, Forced convection, Heat capacity, Heat transfer, Machine learning, Maintenance, Natural convection, Network models, Nonlinear dynamical systems, Physical laws

Proceedings Papers

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Tien-Yu Tom Lee

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999

Paper No: IMECE1999-0966

DOI: https://doi.org/10.1115/IMECE1999-0966

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Topics: Ball-Grid-Array packages, Computational fluid dynamics, Flip-chip, Flip-chip devices, Flat heat pipes, Heat sinks, Heat transfer, Aluminum, Copper, Flip-chip packages

Proceedings Papers

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

T. M. Ying, K. C. Toh

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 29-36, November 14–19, 1999

Paper No: IMECE1999-0967

DOI: https://doi.org/10.1115/IMECE1999-0967

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Topics: Ball-Grid-Array packages, Solders, Thermal analysis, Ball-Grid-Array packaging, Solder joints, Energy dissipation, Finite element methods, Finite element model, Heat, Boundary-value problems

Proceedings Papers

Melting Rate of a Solid With Periodic Melt Removal

Valerian Nemchinsky

Proc. ASME. IMECE99, Heat Transfer: Volume 2, 247-254, November 14–19, 1999

Paper No: IMECE1999-1035

DOI: https://doi.org/10.1115/IMECE1999-1035

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Topics: Melting, Electrodes, Heat, Arc welding, Electromagnetic force, Gravity (Force), Heat flux, Heat transfer, Thermal resistance

Proceedings Papers

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Andrei G. Fedorov, Raymond Viskanta

Proc. ASME. IMECE99, Heat Transfer: Volume 3, 89-98, November 14–19, 1999

Paper No: IMECE1999-1066

DOI: https://doi.org/10.1115/IMECE1999-1066

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Topics: Cooling, Electronic components, Heat sinks, Heat transfer, Microchannels, Fluids, Design, Electronic packaging, Energy conservation, Flow (Dynamics)

Proceedings Papers

Thermal Conductivity Measurement of CVD Diamond Films Using a Modified Thermal Comparator Method

Kumar R. Cheruparambil, Bakhtier Farouk, Joseph E. Yehoda, Nelson A. Macken

Proc. ASME. IMECE99, Heat Transfer: Volume 4, 103-111, November 14–19, 1999

Paper No: IMECE1999-1109

DOI: https://doi.org/10.1115/IMECE1999-1109

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Topics: Diamond films, Synthetic diamonds, Thermal conductivity, Thermal conductivity measurement, Calibration, Chemical vapor deposition, Heat transfer, Thermal resistance, Anisotropy, Bulk solids

Proceedings Papers

Optimal Shapes of Fully Embedded Channels for Conjugate Cooling

T. S. Fisher, K. E. Torrance

Proc. ASME. IMECE99, Advanced Energy Systems, 29-35, November 14–19, 1999

Paper No: IMECE1999-0806

DOI: https://doi.org/10.1115/IMECE1999-0806

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Topics: Cooling, Shapes, Arches, Coolants, Diamonds, Flow (Dynamics), Pressure drop, Pumps, Thermal resistance, Wall thickness

2 3 4 5

NARROW

Thermal Performance Evaluation of VBGA Packages

Thin Film Resistance Heaters for High Heat Flux Jet-Array Cooling Experiments

The Effects of Transverse Acceleration-Induced Body Forces on the Capillary Limit of Helically-Grooved Heat Pipes

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

Transient, Three-Dimensional Heat Transfer Model for the Laser Assisted Machining of Ceramic Materials

Protective Clothing Containing Encapsulated Phase Change Materials

Temperature Effect on Power MOSFET Devices

Assessment of Coupled Natural Convection and Radiation Within Enclosed Vertical Annuli

Effects of Mesh Size in a Flat Evaporator and Condenser Cooling Capacity on the Thermal Performance of a Capillary Pumped Loop

Micro Channel Heat Exchanger for Cooling Electrical Equipment

Heat Transfer in Generator Armature Bar Region Near a Resistance Temperature Detector

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Multi-Objective Thermal Optimization of a Nanofluid-Cooled Rectangular Microchannel Heat Sink Using Genetic Algorithm: A Comparative Study

Deriving Thermal Model From Data by Sparse Identification Based on Physical Laws

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

Melting Rate of a Solid With Periodic Melt Removal

Analysis of Conjugate Heat Transfer in a Three-Dimensional Microchannel Heat Sink for Cooling of Electronic Components

Thermal Conductivity Measurement of CVD Diamond Films Using a Modified Thermal Comparator Method

Optimal Shapes of Fully Embedded Channels for Conjugate Cooling

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