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Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 26–28, 2021

Paper No: IPACK2021-69882

DOI: https://doi.org/10.1115/IPACK2021-69882

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Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress

Proceedings Papers

Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading

Ryota Horiuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A001, October 26–28, 2021

Paper No: IPACK2021-68902

DOI: https://doi.org/10.1115/IPACK2021-68902

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Topics: Damage, Electrodiffusion, Flexible electronics, Stress

Proceedings Papers

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Mahsa Montazeri, David R. Huitink

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A004, October 27–29, 2020

Paper No: IPACK2020-2598

DOI: https://doi.org/10.1115/IPACK2020-2598

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Topics: Electrodiffusion, Solders, Stress, Reliability, Tension, Copper, Current density, Wire, Bonding, Electrical resistance

Proceedings Papers

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A004, October 27–29, 2020

Paper No: IPACK2020-2556

DOI: https://doi.org/10.1115/IPACK2020-2556

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Topics: Electrodiffusion, Intermetallic compounds, Solder joints, Stress

Proceedings Papers

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 7–9, 2019

Paper No: IPACK2019-6408

DOI: https://doi.org/10.1115/IPACK2019-6408

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Topics: Damage, Density, Flexible electronics, Inks, Nanoparticles, Metals, Anodes, Current density, Printing, Reliability

Proceedings Papers

Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

Tusher Ahmed, Mohammad Motalab, Jeffrey C. Suhling

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A024, October 7–9, 2019

Paper No: IPACK2019-6521

DOI: https://doi.org/10.1115/IPACK2019-6521

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Topics: Electrodiffusion, Failure, Lead-free solders

Proceedings Papers

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Sami Alajlouni, Kerry Maize, Peter Bermel, Ali Shakouri

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A008, October 7–9, 2019

Paper No: IPACK2019-6413

DOI: https://doi.org/10.1115/IPACK2019-6413

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Topics: Aluminum, Electrodiffusion, Imaging, Temperature, Thermoreflectance, Failure, Design, Resolution (Optics), Temperature profiles, Wire

Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 29–September 1, 2017

Paper No: IPACK2017-74059

DOI: https://doi.org/10.1115/IPACK2017-74059

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Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons

Proceedings Papers

Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line

Ryuji Takaya, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki

Paper No: IPACK2017-74092

DOI: https://doi.org/10.1115/IPACK2017-74092

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Topics: Current density, Damage, Electrodiffusion, Reservoirs, Shapes, Density, Anodes, Computer simulation

Proceedings Papers

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Kaiser Matin, Avram Bar-Cohen, Joseph J. Maurer

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A024, July 6–9, 2015

Paper No: IPACK2015-48334

DOI: https://doi.org/10.1115/IPACK2015-48334

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Topics: Cooling, Modeling, Simulation, Critical heat flux, Corrosion, Design, Electrodiffusion, Erosion, Fluids, Gallium nitride

Proceedings Papers

Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir

Kazuhiro Fujisaki, Hikaru Narita, Kazuhiko Sasagawa

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T02A015, July 6–9, 2015

Paper No: IPACK2015-48744

DOI: https://doi.org/10.1115/IPACK2015-48744

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Topics: Current density, Electrodiffusion, Numerical analysis, Reservoirs, Tree (Data structure), Damage, Metals, Electric current, Circuits, Computer simulation

Proceedings Papers

Reliability Implications of Thermo-Mechanically and Electrically Induced Interfacial Sliding of Through-Silicon Vias in 3D Packages

Lutz Meinshausen, Ming Liu, Tae-Kyu Lee, Indranath Dutta, Li Li

Paper No: IPACK2015-48124

DOI: https://doi.org/10.1115/IPACK2015-48124

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Topics: Reliability, Silicon, Finite element analysis, Finite element model, Shear stress, Temperature, Copper, Creep, Diffusion (Physics), Electrodiffusion

Proceedings Papers

DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids

Subramanya Sadasiva, Ganesh Subbarayan

Paper No: IPACK2015-48655

DOI: https://doi.org/10.1115/IPACK2015-48655

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Topics: Diffusion (Physics), Simulation, Solids, Stress, Electrodiffusion, Failure, Solder joints, Dynamics (Mechanics), Finite element analysis, Solders

Proceedings Papers

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Masaru Gotoh, Ken Suzuki, Hideo Miura

Paper No: IPACK2015-48197

DOI: https://doi.org/10.1115/IPACK2015-48197

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Topics: Copper, Thermal conductivity, Thin films, Grain boundaries, Electrical resistivity, Heating, Joules, Stress, Thermal properties, Diffusion (Physics)

Proceedings Papers

Electrical-Thermal-Reliability Co-Design for TSV-Based 3D-ICs

Tiantao Lu, Ankur Srivastava

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A037, July 6–9, 2015

Paper No: IPACK2015-48386

DOI: https://doi.org/10.1115/IPACK2015-48386

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Topics: Design, Reliability, Finite element methods, Stress, Circuits, Design methodology, Electrodiffusion, Flow (Dynamics), Heat conduction, Optimization

Proceedings Papers

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma

Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A003, July 16–18, 2013

Paper No: IPACK2013-73130

DOI: https://doi.org/10.1115/IPACK2013-73130

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Topics: Carbon nanotubes, Current density, Damage, Oxidation, Oxygen, Atoms, Carbon, Density, Electrodes, Electrodiffusion

Proceedings Papers

Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests

Shinichi Fujiwara, Nobuhiko Chiwata, Masaru Fujiyoshi, Motoki Wakano, Hisashi Tanie

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 719-723, July 6–8, 2011

Paper No: IPACK2011-52110

DOI: https://doi.org/10.1115/IPACK2011-52110

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Topics: Copper, Cycles, Electrodiffusion, Solders, Intermetallic compounds, Solder joints, Current density, Joining, Reliability, Accelerated life testing

Proceedings Papers

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Naokazu Murata, Naoki Saito, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Paper No: IPACK2011-52048

DOI: https://doi.org/10.1115/IPACK2011-52048

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Topics: Copper, Electrical properties, Grain boundaries, Thin films, Fracture (Materials), Annealing, Reliability, Brittle fracture, Electron backscatter diffraction, Stress

Proceedings Papers

Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

Naoki Saito, Naokazu Murata, Kinji Tamakawa, Ken Suzuki, Hideo Miura

Paper No: IPACK2011-52058

DOI: https://doi.org/10.1115/IPACK2011-52058

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Topics: Copper, Electrodiffusion, Stress, Thin films, Atoms, Sulfur, Current density, Electroplating, Fracture (Materials), Fracture (Process)

Proceedings Papers

IC-Package Thermal Co-Analysis in 3D IC Environment

Stephen H. Pan, Norman Chang, Ji Zheng

Paper No: IPACK2011-52240

DOI: https://doi.org/10.1115/IPACK2011-52240

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Topics: Design, Electrodiffusion, Leakage, Power density, Reliability, Temperature, Temperature distribution

NARROW

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading

Development of a Novel Test Setup to Study the Combined Effects of Electromigration and Mechanical Stress in Solder Interconnects

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model

Damage of Flexible Electronic Line Printed With Ag Nanoparticle Ink due to High-Current Density

Numerical Investigation on Electromigration Oriented Failure of Lead Free Solder Joints With Aging Effects

Thermoreflectance Imaging of Electromigration in Aluminum Interconnects at Different Ambient Temperatures

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line

Modeling and Simulation Challenges in Embedded Two Phase Cooling: DARPA’s ICECool Program

Numerical Analysis of Allowable Current Density for Electromigration of Interconnect Tree Structure With Reservoir

Reliability Implications of Thermo-Mechanically and Electrically Induced Interfacial Sliding of Through-Silicon Vias in 3D Packages

DiffCode: A System for the Simulation of Diffusion Driven Phase Evolution in Solids

Improvement of Thermal Conductivity of Electroplated Copper Interconnections by Controlling Their Crystallinity

Electrical-Thermal-Reliability Co-Design for TSV-Based 3D-ICs

Experimental Study of Damage Mechanism of Carbon Nanotube as Nano-Component of Electronic Devices Under High Current Density

Electromigration in Copper-Core Solder Ball Joints During Thermal Cycle Tests

Effect of Crystallographic Quality of Grain Boundaries on Both Mechanical and Electrical Properties of Electroplated Copper Thin Film Interconnections

Stress-Induced and Electro-Migration of Electroplated Copper Thin Film Interconnections Used for 3D Integration

IC-Package Thermal Co-Analysis in 3D IC Environment

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