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Keywords: SAC305
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A003, October 25–27, 2022
Paper No: IPACK2022-94505
... grains in the literature. The goal of this paper is to determine rate-independent plastic constitutive behavior of Anisotropic SAC305 single grains. Monotonic tensile and shear tests are conducted at room temperature on a set of single-grain SAC305 solder joints. The grain structure for each test...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A019, October 27–29, 2020
Paper No: IPACK2020-2694
...DEFORMATION BEHAVIOR OF SAC305 SOLDER JOINTS WITH MULTIPLE GRAINS Debabrata Mondal, Abdullah Fahim, KM Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall Department of Mechanical Engineering, and Center for Advanced Vehicle and Extreme Environment Electronics (CAVE3) Auburn University Auburn, AL 36849...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A024, October 7–9, 2019
Paper No: IPACK2019-6521
... the reliability issues found in electronic packages. This current investigation deals with the review of mechanical property degradations of SAC305(Sn-96.5Ag-3.0Cu-0.5) solder materials due to thermal aging and their effects on electromigration oriented failure of small scale flip chip solder bumps. Thermal aging...