.... , Kim , R.-H. , Wang , S. , Wu , J. , , 2011 , “ Epidermal Electronics ,” Science , 333 ( 6044 ), pp. 838 – 843 . 10.1126/science.1206157 [7] Yang , J. C. , Mun , J. , Kwon , S. Y. , Park , S. , Bao , Z. , and Park , S. , 2019 , “ Electronic Skin...

... in the potting due to the change in stiffness of the board assembly with and without solder. Not surprisingly, there was not much difference in either stress or displacement in the electronics can, with and without solder. Fig. 13 Von Mises stress of circuit board and chips, 333 K, softer potting...

...Shuodao Wang; Ming Li; Jian Wu; Dae-Hyeong Kim; Nanshu Lu; Yewang Su; Zhan Kang; Yonggang Huang; John A. Rogers Epidermal electronic system (EES) is a class of integrated electronic systems that are ultrathin, soft, and lightweight, such that it could be mounted to the epidermis based on van der...