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Keywords: electronics
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. May 2023, 90(5): 051005.
Paper No: JAM-22-1379
Published Online: January 23, 2023
... the remarkable robustness of Eq. (13) . thin films cohesive zone modeling debonding electronics failure criteria structures National Natural Science Foundation of China 10.13039/501100001809 11521202 11890681 12032001 As shown in Fig. 1 , the self-debonding process can...
Journal Articles
Publisher: ASME
Article Type: Launch Dynamics
J. Appl. Mech. May 2013, 80(3): 031502.
Paper No: JAM-12-1360
Published Online: April 19, 2013
...L. E. Reinhardt; J. A. Cordes; A. S. Haynes; J. D. Metz In conclusion, for accurate modeling and simulation of the stresses in electronic chips, electronic boards, and potting, the solder should be included in the model. We would like to thank Shana Groeschler for her careful review...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Appl. Mech. May 2012, 79(3): 031022.
Published Online: April 5, 2012
...Shuodao Wang; Ming Li; Jian Wu; Dae-Hyeong Kim; Nanshu Lu; Yewang Su; Zhan Kang; Yonggang Huang; John A. Rogers Epidermal electronic system (EES) is a class of integrated electronic systems that are ultrathin, soft, and lightweight, such that it could be mounted to the epidermis based on van der...