This article is dedicated to the review of publications on drop impact analysis performed on consumer electronic devices such as cellular phones and two-way radios in the past decade. Prior to the highlights of this review, the scope and motivation behind this work will be briefly explained. A comprehensive survey on published literatures devoted to the methodologies established to analyze the reliability of electronic products exposed to the event of drop impact is presented. The scope of the review is extended beyond product level analysis to also include drop impact study at board level. This type of review is novel and has not been published in the past. The focus will be on the different analytical and numerical modeling approaches and the current status of finite element method in predicting the drop impact performance of electronic devices. Of equal interest is the methodology adopted in past work to establish a correlation between numerical and experimental results. This article serves as a reference to all intended future work which could be an extension from the current known art of drop impact analysis on electronic devices. The time frame of this review is up to year 2010.
Issue Section:
Review Articles
Keywords:
drop impact,
electronic devices,
board level drop test,
product level drop test,
numerical simulation,
consumer electronics,
drops,
electronic products,
finite element analysis,
impact (mechanical),
reliability
Topics:
Computer simulation,
Dynamic response,
Electronic products,
Failure,
Finite element analysis,
Modeling,
Printed circuit boards,
Reliability,
Solder joints,
Solders,
Stress,
Testing,
Numerical analysis,
Dynamics (Mechanics),
Design,
Deflection,
Boundary-value problems,
Displacement,
Manufacturing
References
1.
JEDEC, 2003, “
Board Level Drop Test Method of Components for Handheld Electronic Products
,” JEDEC Document for Board Level Drop Test Method of Components for Handheld Electronic Products, JEDEC Solid State Technology Association, Arlington, VA, Paper No. JESD22-B111.2.
“
Subassembly Mechanical Shock
,” JEDEC Document for Board Level Drop Test Method of Components for Handheld Electronic Products, JEDEC Solid State Technology Association, Arlington, VA, Paper No. JESD22-B110A.3.
Ng
, H. S.
, Tee
, T. Y.
, and Luan
, J.-E.
, 2004, “Design for Standard Impact Pulses of Drop Tester Using Dynamic Simulation
,” Proceedings of the 6th Electronics Packaging Technology Conference
, Singapore, pp. 793
–799
.4.
Goyal
, S.
, Papadopoulos
, J. M.
, and Sullivan
, P. A.
, 1998, “The Dynamics of Clattering I: Equation of Motion and Examples
,” J. Dyn. Syst., Meas., Control
, 20
(1
), pp. 83
–93
.5.
Goyal
, S.
, Papadopoulos
, J. M.
, and Sullivan
, P. A.
, 1998, “The Dynamics of Clattering II: Global Results and Shock Protection
,” J. Dyn. Syst., Meas., Control
, 20
(1
), pp. 94
–101
.6.
Shan
, H.
, Su
, J.
, Badiu
, F.
, Zhu
, J.
, and Xu
, L.
, 2005, “Modeling and Simulation of Multiple Impacts of Falling Rigid Bodies
,” Math. Comput. Modell.
, 43
(5-6
), pp. 592
–611
.7.
Goyal
, S.
, and Buratynski
, E. K.
, 2000, “Methods for Realistic Drop-Testing
,” Int. J. Microcircuits Electron. Packag.
, 23
(1
), pp. 45
–52
.8.
Buratynski
, E. K.
, Goyal
, S.
, and Rosenthal
, E. J.
, “Realistic, Repeatable and Controllable Drop Testing
,” U.S. Patent No. 6,374,661.9.
Shim
, V. P. W.
, and Lim
, C. T.
, “Impact Drop Tester for Portable Consumer Products
,” U. S. Patent No. 6,508,103.10.
Lim
, C. T.
, Teo
, Y. M.
, and Shim
, V. P. W.
, 2002, “Numerical Simulation of the Drop Impact Response of a Portable Electronic Product
,” IEEE Trans. Compon. Packag. Technol.
, 25
(3
), pp. 478
–485
.11.
Chen
, S. C.
, Huang
, L. T.
, Chou
, C. C.
, Kuo
, W. I.
, and Shih
, H.
, “Detecting Method of a Drop Test and the Device Thereof
,” U. S. Patent No. 2004/0200264.12.
Wang
, H. L.
, Chen
, S.
, Huang
, L.
, and Wang
, Y. C.
, 2004, “Simulation and Verification of the Drop Test of 3C Products
,” Proceedings of the 8th International LS-DYNA User Conference
, MI.13.
Chen
, S-C.
, Wang
, H-L.
, Huang
, L-T.
, and Wang
, Y-C.
, 2007, “Drop Test System With Orientation Repeatability for 3C Products
,” Proceedings of the 33rd Annual Conference Industrial Electronics Society
, Taipei, pp. 2910
–2915
.14.
Seung
, Y. H.
, “Dropping Test Apparatus for Mobile Communication Terminal
,” U. S Patent No. 6,907,767.15.
Ishikawa
, K.
, “Fall Impact Apparatus
,” U. S Patent No. 6,892,564.16.
Fukushima
, S.
, and Kurahara
, S.
, “Drop Test Apparatus
,” U. S Patent No. 2009/0031783.17.
Wong
, E. H.
, Lim
, K. M.
, Lee
, N.
, Cheah
, S.
, Hoe
, C.
, and Wang
, J.
, 2002, “Drop Impact Test – Mechanics and Physics of Failure
,” Proceedings of the 4th Electronic Packaging Technology Conference
, Singapore, pp. 327
–333
.18.
Wong
, E. H.
, Mai
, Y. W.
, Seah
, S. K. W.
, Rajoo
, R.
, Lim
, T. B.
, Lim
, C. T.,
and Field
, J.
, 2005, “Drop Impact Reliability - A Comprehensive Summary
,” Proceedings of the High Density Microsystem Design and Packaging and Component Failure Analysis
, Shanghai, pp. 1
–11
.19.
Wong
, E. H.
, Rajoo
, R.
, Mai
, Y. W.
, Seah
, S. K. W.
, Tsai
, K. T.
, and Yap
, L. M.
, 2005, “Drop Impact: Fundamentals and Impact Characterization of Solder Joints
,” Proceedings of the 55th Electronic Components and Technology Conference
, Lake Buena Vista
, pp. 1202
–1209
.20.
Wong
, E. H.
, and Mai
, Y. W.
, 2006, “New Insights Into Board Level Drop Impact
,” J. Microelectronics Reliability
, 46
(5-6
), pp. 930
–938
.21.
Wong
, E. H.
, Seah
, S. K. W.
, and Shim
, V. P. W.
, 2008, “A Review of Board Level Solder Joints for Mobile Applications
,” J. Microelectronics Reliability
, 48
(11-12
), pp. 1747
–1758
.22.
Tee
, T. Y.
, Luan
, J -E.
, Pek
, E.
, Lim
, C. T.
, and Zhong
, Z.
, 2004, “Advanced Experimental and Simulation Techniques for Analysis of Dynamic Responses during Drop Impact
,” Proceedings of the 54th Electronic Components and Technology Conference
, Las Vegas, NV, 1
, pp. 1088
–1094
.23.
Luan
, J. E.
, Tee
, Y. T.
, Pek
, E.
, Lim
, C. T.
, Zhong
, Z.
, and Zhou
, J.
, 2006, “Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact
,” IEEE Trans. Compon. Packag. Technol.
, 29
(3
), pp. 449
–456
.24.
Tee
, T. Y.
, Luan
, J.-E.
, Pek
, E.
, Lim
, C. T.
, and Zhong
, Z.
, 2004, “Novel Numerical and Experimental Analysis of Dynamic Responses Under Board Level Drop Test
,” Proceedings of the 5th Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems Conference (EuroSimE)
, Brussels, pp. 133
–140
.25.
Tee
, T. Y.
, Ng
, H. S.
, Lim
, C. T.
, Pek
, E.
, and Zhong
, Z.
, 2003, “Board Level Drop Test and Simulation of TFBGA Packages for Telecommunication Applications
,” Proceedings of the 53rd Electronic Components and Technology Conference
, New Orleans, LA, pp. 121
–129
.26.
Luan
, J -E.
, Tee
, T. Y.
, Pek
, E.
, Lim
, C. T.
, and Zhong
, Z.
, 2003, “Modal Analysis and Dynamic Responses of Board Level Drop Test
,” Proceedings of the 5th Electronic Packaging Technology Conference
, Singapore, pp. 233
–243
.27.
Xie
, D.
, Arra
, M.
, Yi
, S.
, and Rooney
, D.
, 2003, “Solder Joint Behavior of Area Array Packages in Board Level Drop for Handheld Devices
,” Proceedings of the 53rd Electronic Components and Technology Conference
, New Orleans, LA, pp. 130
–135
.28.
Luan
, J -E.
, and Tee
, T. Y.
, 2005, “Analysis of PCB Subassembly Dynamic Responses using Integrated Analytical, Numerical and Experimental Techniques
,” Proceedings of the 6th International Conference on Electronic Packaging Technology
, Shenzhen, pp. 133
–140
.29.
Pan
, K -L.
, Zhou
, B.
, and Yan
, Y -L.
, 2007, “Drop Dynamic Responses and Modal Analysis for Board Level TFBGA
,” International Symposium on High Density Packaging and Microsystem Integration
, Shanghai, pp. 1
–5
.30.
Jie
, B.
, Fei
, Q.
, and Tong
, A.
, 2007, “Dynamic Stress of Solder Joints Under Board-Level Drop/Impact
,” Proceedings of the 8th Electronic Packaging Technology Conference
, (ICEPT)
, Shanghai
, pp. 1
–5
.31.
Tong
, A.
, and Fei
, Q.
, 2009, “Effects of PCB Dynamic Responses on Solder Joint Stress
,” Proceedings of the Electronic Packaging Technology & High Density Packaging, (ICEPT-HDP’09)
, Beijing, pp. 370
–373
.32.
Xu
, Z. J.
, and Yu
, T. X.
, 2008, “Board Level Dynamic Response and Solder Joint Reliability Analysis Under Drop Impact Test with Various Impact Orientations
,” Proceedings of the 10th Electronics Packaging Technology Conference
, Singapore, pp. 1080
–1085
.33.
Yao
, X.
, Fan
, Z.
, Yuan
, M.
, Zhang
, Z.
, Li
, Z.
, and Han
, Q.
, 2010, “Research on Reliability of Board Level Package-on-Package in Drop Test
,” Proceedings of the 11th Electronic Packaging Technology and High Density Packaging (ICEPT-HDP’10), Xi’an
, pp. 1138
–1141
.34.
Park
, S.
, Shah
, C.
, and Kwak
, J.
, 2007, “Effect of Boundary Conditions on the Dynamic Response Characterization of Board-Level Drop Test
,” Proceedings of the 9th Electronics Packaging Technology Conference
, Singapore, pp. 374
–379
.35.
Sano
, M.
, Chou
, C -Y.
, Hung
, T -Y.
, Yang
, S -Y.
, and Chiang
, K -N.
, 2009, “Uncertainty and Reliability Analysis of Chip Scale Package Subjected to Board-Level Drop Test
,” Proceedings of the 10th Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems (EuroSimE’09)
, Delft, pp. 1
–6
.36.
Liu
, Y.
, Kessels
, F. J. H. G.
, Driel
, W. D. V.
, Driel
, J. A. S. V.
, Sun
, F. L.
, and Zhang
, G. Q.
, 2009, “Comparing Drop Impact Test Method Using Strain Gauge Measurements
,” J. Microelectronics Reliability
, 49
(9-11
), pp. 1299
–1303
.37.
Luan
, J -E.
, and Tee
, T. Y.
, 2004, “Analytical and Numerical Analysis of Impact Pulse Parameters on Consistency of Drop Impact Results
,” Proceedings of the 6th Electronics Packaging Technology Conference
, Singapore, pp. 664
–670
.38.
Lai
, Y -S.
, Yang
, P -C.
, and Yeh
, C -L.
, 2008, “Effects of Different Drop Test Conditions on Board-Level Reliability of Chip-Scale Packages
,” J. Microelectronics Reliability
, 48
(2
), pp. 274
–281
.39.
Wong
, E. H.
, Mai
, Y -W.
, and Seah
, S. K. W.
, 2005, “Board Level Drop Impact – Fundamental and Parametric Analysis
,” ASME J. Electron. Packag.
127
(4
), pp. 496
–502
.40.
Woo
, M. S. S.
, and Wong
, E. H.
, 2007, “Analytical Solution of the Dynamic Response of Printed Circuit Board to Support Excitation
,” Proceedings of the 9th Electronics Packaging Technology Conference
, Singapore, pp. 386
–390
.41.
Wong
, E. H.
, Mai
, Y -W.
, and Woo
, M.
, 2009, “Analytical Solution for the Damped-Dynamics of Printed Circuit Board and Applied to Study the Effects of Distorted Half-Sine Support Excitation
,” IEEE Trans. Adv. Packag.
, 32
(2
), pp. 536
–545
.42.
Wong
, E. H.
, Mai
, Y. W.
, Seah
, S. K. W.
, Lim
, K -M.
, and Lim
, T. B.
, 2006, “Analytical Solutions for Interconnect Stress in Board Level Drop Impact
,” Proceedings of the 56th Electronic Components and Technology Conference
, San Diego, CA, pp. 8
.43.
Wong
, E. H.
, Mai
, Y. W.
, Seah
, S. K. W.
, Lim
, K -M.
, and Lim
, T. B.
, 2007, “Analytical Solutions for Interconnect Stress in Board Level Drop Impact
,” IEEE Trans. Adv. Packag.
, 30
(4
), pp. 654
–664
.44.
Zhou
, J.
, 2008, “Analytical Analysis on the Effect of Time Duration of Acceleration Pulse to a JEDEC Board in Drop Test
,” Proceedings of the Electronic Packaging Technology & High Density Packaging (ICEPT-HDP’08)
, Shanghai, pp. 1
–6
.45.
Zhou
, J.
, Corder
, P.
, and Niraula
, R. P.
, 2007, Block-Diagram Based SIMULINK Analysis for the Drop Impact Response of a Mobile Electronic System
,” Proceedings of the Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems (EuroSimE’07)
, London, pp. 1
–7
.46.
Zhou
, J.
, Niraula
, R. P.
, and Aung
, K.
, 2007, “Analysis on the Effect of Input Impact Profiles in Drop Test
,” Proceedings of the ASME Conference (IMECHE’07), IMECE2007-41138
, Seattle, WA, pp. 223
–231
.47.
Suhir
, E.
, 2010, “Analytical/Mathematical Modeling of the Dynamic Response of a Printed Circuit Board (PCB) to an Impact Load
,” Proceedings of the 11th Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
, Shanghai, pp. 480
–488
.48.
Moore
, T. D.
, and Jarvis
, J. L.
, 2002, “The Effects of In-Plane Orthotropic Properties in a Multi-Chip All Grid Array Assembly
,” J. Microelectronics Reliability
, 42
(6
), pp. 943
–949
.49.
Low
, K. H.
, Wang
, Y.
, Pang
, H. L. J.
, Hoon
, K. H.
, Che
, F. X.
, and Yong
, Y. S.
, 2006, “Modeling and Simulation for a Drop-Impact Analysis of Multi-Layered Printed Circuit Boards
,” J. Microelectronics Reliability
, 46
(2-4
), pp. 558
–573
.50.
Fang
, L.
, Guang
, M.
, and Mei
, Z.
, 2007, “Viscoelastic Influence on Dynamic Properties of PCB Under Drop Impact
,” ASME J. Electron. Packag.
, 129
(3
), pp. 266
–272
.51.
Fuchs
,P. F.
, Major
, Z.
and Lang
, R. W.
, 2009, “Characterization of the Deformation Behavior of PCBs under Dynamic Loading Conditions
,” J. Phys: Conf. Ser.
, 181
(1
), pp. 012065
.52.
Ong
, K. C.
, Tan
, V. B. C.
, Lim
, C. T.
, Wong
, E. H.
, and Zhang
, X. W.
, 2004, “Dynamic Materials Testing and Modeling of Solder Interconnects
,” Proceedings of the 54th Electronic Components and Technology Conference
, Las Vegas, NV, 1
, pp. 1075
–1079
.53.
Wen
, L.
, Fu
, X.
, Zhou
, J.
, Wang
, Q.
, and Lee
, J.
, 2008, “Dynamic Properties Testing of Solders and Modeling of Electronic Packages Subjected to Drop Impact
,” Proceedings of the Electronic Packaging Technology and High Density Packaging (ICEPT-HDP’08)
, Shanghai, pp. 1
–7
.54.
Amagai
, M.
, Toyoda
, Y.
, and Tajima
, T.
, 2003, “High Solder Joint Reliability with Lead Free Solders
,” Proceedings of the 53rd Electronic Components and Technology Conference
, New Orleans, LA, pp. 317
–322
.55.
Amagai
, M.
, Toyoda
, Y.
, Ohnishi
, T.
, and Akita
, S.
, 2004, “High Drop Test Reliability: Lead-Free Solders
,” Proceedings of the 54th Electronic Components and Technology Conference
, Las Vegas, NV, pp. 1304
–1309
.56.
Chong
, D. Y. R.
, Ng
, K.
, Tan
, J. Y. N.
, Low
, P. T. H.
, Pang
, J. H. L.
, Che
, F. X.
, Xiong
, B.
, and S.
Xu
, L.
, 2005, “Drop Impact Reliability Testing for Lead-Free and Leaded Soldered IC Packages
,” Proceedings of the 55th Electronic Components and Technology Conference
, Lake Buena Vista, pp. 622
–629
.57.
Chong
, D. Y. R.
, Toh
, H. J.
, Lim
, B. K.
, Low
, P. T. H.
, Pang
, J. H. L.
, Che
, F. X.
, Xiong
, B. S.
, and Xu
, L.
, 2005, “Drop Reliability Performance Assessment for PCB Assemblies of Chip Scale Packages (CSP)
, Proceedings of the 7th Electronic Packaging Technology Conference
, Singapore, pp. 262
–269
.58.
Reiff
, D.
, and Bradley
, E.
, 2005, “A Novel Mechanical Shock Test Method to Evaluate Lead-Free BGA Solder Joint Reliability
,” Proceedings of the 55th Electronic Components and Technology Conference
, Lake Buena Vista, pp. 1519
–1525
.59.
Seah
, S. K. W.
, Wong
, E. H.
, Mai
, Y. W.
, Rajoo
, R.
, and Lim
, C. T.
, 2006, “Failure Mechanisms of Interconnections in Drop Impact
,” Proceedings of the 56th Electronic Components and Technology Conference
, San Diego, CA, p. 9
.60.
Qu
, X.
, Chen
, Z.
, Qi
, B.
, Lee
, T.
, and Wang
, J.
, 2007, “Board Level Drop Test and Simulation of Leaded and Lead-Free BGA-PCB Assembly
,” J. Microelectronics Reliability
, 47
(12
), pp. 2197
–2204
.61.
Ong
, Y. C.
, Shim
, V. P. W.
, Chai
, T. C.
, and Lim
, C. T.
, 2003, “Comparison of Mechanical Response of PCBs Subjected to Product-Level and Board-Level Drop Impact Tests
,” Proceedings of the 5th Electronics Packaging Technology Conference
, Singapore, pp. 223
–227
.62.
Zhu
, L.
, 2003, “Modeling Technique for Reliability Assessment of Portable Electronic Product Subjected to Drop Impact Loads
,” Proceedings of the 53rd Electronic Components and Technology Conference
, New Orleans, LA, pp. 100
–104
.63.
Ju
, R.
, and Hsiao
, B.
, 2004, “Drop Simulation for Portable Electronic Products
,” Proceedings of the 8th International LS-DYNA Users Conference
, Dearborn, MI, pp. 14.1
–14.6
.64.
Wu
, J.
, Song
, G.
, Yeh
, C -P.
, and Wyatt
, K.
, 1998, “Drop/Impact Simulation and Test Validation of Telecommunication Products
,” Proceedings of the 6th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM’98)
, Seattle, WA, pp. 330
–336
.65.
Goyal
, S.
, Upasani
, S.
, and Patel
, D. M.
, 1999, “Improving Impact Tolerance of Portable Electronic Products: Case Study of Cellular Phones
,” J. Experimental Mechanics
, 39
(1
), pp. 43
–52
.66.
Lim
, C. T.
, and Low
, Y. J.
, 2002, “Investigating the Drop Impact of Portable Electronic Products
,” Proceedings of the 52nd Electronic Components and Technology Conference
, San Diego, CA, pp. 1270
–1274
.67.
Lim
, C. T.
, Ang
, C. W.
, Tan
, L. B.
, Seah
, S. K. W.
, and Wong
, E. H.
, 2003, “Drop Impact Survey of Portable Electronic Products
,” Proceedings of the 53rd Electronic Components and Technology Conference
, New Orleans, LA, pp. 113
–120
.68.
Lim
, C. T.
, Tan
, L. B.
, Ang
, C. W.
, Tan
, V. B. C.
, and Zhang
, X.
, 2005, “Modal and Impact Analysis of Modern Portable Electronic Products
,” Proceedings of the 55th Electronic Components and Technology Conference
, Lake Buena Vista, 1
, pp. 645
–653
.69.
Kim
, J. G.
, and Park
, Y. K.
, 2004, “Experimental Verification of Drop/Impact Simulation for a Cellular Phone
,” J. Experimental Mechanics
, 44
(4
), pp. 375
–380
.70.
Kim
, J. W.
, Jo
, I -Y.
, Chung
, Y -G.
, and Lim
, J. M.
, 2002, “Optimum Design of a Cellular Phone Using LS-OPT Considering the Phone Drop Test
,” Proceedings of the 7th International LS-DYNA Users Conference
, Dearborn, MI, pp. 14.1
–14.10
.71.
Low
, K. H.
, Yang
, A.
, Hoon
, K. H.
, Zhang
, W.
, Lim
, J. K. T.
, and Lim
, K. L.
, 2001, “Initial Study on the Drop-Impact Behavior of Mini Hi-Fi Audio Products
,” Adv. Eng. Software
, 32
(9
), pp. 683
–693
.72.
Wang
, Y. Y.
, Lu
, C.
, Li
, J.
, Tan
, X. M.
, and Tse
, Y. C.
, 2005, “Simulation of Drop/Impact Reliability for Electronic Devices
,” J. Finite Elements in Analysis and Design
, 41
(6
), pp. 667
–680
.73.
Wang
, Y. Y.
, Lin
, T. Y.
, and Hua
, L.
, 2003, “Drop-Impact Simulation and Experimental Verification for Spindle Fixation of Video and Audio Module
,” Mechatronics
, 13
(5
), pp. 427
–440
.74.
Liu
, S.
, Wang
, X.
, Ma
, B.
, Gan
, Z.
, and Zhang
, H.
, 2005, “Drop Test and Simulation of Portable Electronic Devices
,” Proceedings of the 6th Electronic Packaging Technology Conference
, Singapore, pp. 1
–4
.75.
Sharan
, K.
, Lahoti
, S.
, and Zhou
, J.
, 2006, “Dynamic Response of a Portable Electronic Product Subjected to an Impact Load
,” Proceedings of the 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM’06)
, Orlando, FL, pp. 1049
–1055
.76.
Zhou
, J.
, Sharan
, K.
, and Lahoti
, S.
, 2006, “Analytical and Numerical Analysis of Drop Impact Behavior for a Portable Electronic Device
,” Proceedings of the 7th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems (EuroSimE’06)
, Como, pp. 1
–7
.77.
Park
, S.
, Al-Yafawi
, A.
, Yu
, D.
, Kwak
, J. B.
, Lee
, J.
, and Goo
, N. S.,
2008, “Influence of Fastening Methods on the Dynamic Response and Reliability Assessment of PCBs in Cellular Phones under Free Drop
,” Proceedings of the 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM 08)
, Orlando, pp. 876
–882
.78.
Yu
, D.
, Kwak
, J. B.
, Park
, S.
, and Lee
, J.
, 2010, “Dynamic Responses of PCB under Product-Level Free Drop Impact
,” J. Microelectronics Reliability
, 50
(1
), pp. 1028
–1038
.79.
Zhou
, C. Y.
, Yu
, T. X.
, and Lee
, R. S. W.
, 2008, “Drop/Impact Tests and Analysis of Typical Portable Electronic Devices
,” J. International of Mechanical Sciences
, 50
(5
), pp. 905
–917
.80.
Park
, S.
, Yu
, D.
, Al-Yafawi
, A.
, Kwak
, J.
, and Lee
, J.
, 2009, “Effect of Damping and Air Cushion on Dynamic Responses of PCB under Product Level Free Drop Impact
,” Proceedings of the 59th Electronic Components and Technology Conference
, San Diego, CA, pp. 1256
–1262
.81.
Low
, K. H.
, 2003, “Drop-Impact Cushioning Effect of Electronic Products Formed by Plates
,” J. Advances in Engineering Software
, 34
(1
), pp. 31
–50
.82.
Luan
, J -E.
, and Tee
, T. Y.
, 2004, “Novel Board Level Drop Test Simulation Using Implicit Transient Analysis With Input-G Method
,” Proceedings of the 6th Electronics Packaging Technology Conference
, Singapore, pp. 671
–677
.83.
Tee
, T. Y.
, Luan
, J -E.
, and Ng
, H. S.
, 2005, “Development and Application of Innovational Drop Impact Modeling Techniques
,” Proceedings of the 55th Electronic Components and Technology Conference
, Lake Buena Vista, 1
, pp. 504
–512
.84.
Irving
, S.
, and Liu
, Y.
, 2004, “Free Drop Test Simulation for Portable IC Package by Implicit Transient Dynamics FEM
,” Proceedings of the 54th Electronic Components and Technology Conference
, Las Vegas, 1
, pp. 1062
–1066
.85.
Wu
, J.
, 2006, “Advanced Modeling and Drop Simulation With New Features of LS-DYNA
,” Proceedings of the 9th LS-DYNA Users’ Conference
, Dearborn, MI, pp. 3.1
–3.14
.86.
Tan
, V. B. C.
, Tong
, M. X.
, Lim
, K. M.
, and Lim
, C. T.
, 2005, “Finite Element Modeling of Electronic Packages Subjected to Drop Impact
,” IEEE Trans. Compon. Packag. Technol.
, 28
(3
), pp. 555
–560
.87.
Diehl
, T.
, and Carroll
, D.
, 2000, “Utilizing ABAQUS’ 10-Node Modified Tet for Analyzing Impact Problems Involving Thin-Walled Structures
,” Proceedings of the ABAQUS Users’ Conference
, Newport, RI.88.
Carroll
, D.
, Bates
, C.
, Zampino
, M.
, and Jones
, K.
, 2006, “A Novel Technique for Modeling Solder Joint Failure During System Level Drop Simulations
,” Proceedings of the 10th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronics Systems (ITHERM’06)
, Orlando, pp. 861
–868
.89.
Jones
, W. K.
, 2006, “A Novel Technique for Modeling Solder Joint Failure during System Level Drop Simulations
,” Proceedings of the 11th International Symposium on Advanced Packaging Materials: Processes, Properties and Interface
, Atlanta, GA, pp. 15
.90.
Yeh
, C -L.
, and Lai
, Y -S.
, 2004, “Support Excitation Scheme for Transient Analysis of JEDEC Board-Level Drop Test
,” J. Microelectronics Reliability
, 46
(2-4
), pp. 626
–636
.91.
Wang
, J.
, Hoe
, C.
, and Wong
, E. H.
, 2002, “Modeling Solder Joint Reliability of BGA Packages Subject to Drop Impact Loading using Submodeling
,” Proceedings of the ABAQUS Users’ Conference
, Newport, RI.92.
Hsu
, H -C.
, Hsu
, Y -C.
, Lee
, H -Y.
, Yeh
, C -L.
, and Lai
, Y -S.
, 2006, “Application of Submodeling Technique to Transient Drop Impact Analysis of Board-Level Stacked Die Packages
,” Proceedings of the 8th Electronics Packaging Technology Conference
, Singapore, pp. 412
–418
.93.
Wu
, J.
, 2000, “Global and Local Coupling Analysis for Small Components in Drop Simulation
,” Proceedings of the 6th LS-DYNA Users’ Conference
, Dearborn, MI, pp. 11.17
–11.26
.94.
Cadge
, D.
, Wang
, J. H. J.
, Bai
, R.
, and Gong
, P.
, 2006, “Drop Test Simulation of Electronic Devices using Finite Element Method
,” Proceedings of the International Conference on Electronic Materials and Packaging (EMAP 2006)
, Hong Kong, pp. 1
–7
.95.
Lall
, P.
, Gupte
, S.
, Choudhary
, P.
, and Suhling
, J.
, 2007, “Solder Joint Reliability in Electronics Under Shock and Vibration Using Explicit Finite-Element Submodeling
,” IEEE Trans. Electron. Packag. Manuf.
, 30
(1
), pp. 74
–83
.96.
Low
, K. H.
, Wang
, Y.
, Hoon
, K. H.
, and Vahdati
, N.
, 2004, “Initial Global-Local Analysis for Drop-Impact Effect Study of TV Products
,” Adv. Eng. Software
, 35
(3-4
), pp. 179
–190
.97.
Low
, K. H.
, Wang
, Y.
, Hoon
, K. H.
, and Wai
, W. K.
, 2004, “A Virtual Boundary Model for a Quick Drop-Impact Analysis of Electronic Components in TV Model
,” Adv. Eng. Software
, 35
(8-9
), pp. 537
–551
.98.
Low
, K. H.
, Wang
, Y.
, Hoon
, K. H.
, and Wai
, W. K.
, 2003, “A Virtual Boundary Model for a Quick Drop-Impact Analysis of PCB in Electronic Products
,” Proceedings of the 5th Electronics Packaging Technology Conference
, Singapore, pp. 275
–281
.99.
Lai
, Y -S.
, Yeh
, C -L.
, and Kao
, C -L.
, 2006, “Evaluation of Board-Level Reliability of Electronic Packages under Consecutive Drops
,” J. Microelectronics Reliability
, 46
(7
), pp. 1172
–1182
.100.
Yeh
, C.-L.
, and Lai
, Y -S.
, 2008, “Investigations of Solder Joint Damage Potentials for Board-Level Chip-Scale Packages Subjected to Consecutive Drops
,” J. Microelectronics Reliability
, 48
(2
), pp. 282
–292
.Copyright © 2011
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