Designing Surface-Mounted Components for High Reliability

[+] Author and Article Information
J. Rasty, B. Chen

Mechanical Engineering Department, Texas Tech University, Lubbock, TX 79409

W. Kolarik

Industrial Engineering Department, Texas Tech University, Lubbock, TX 79409

J. Energy Resour. Technol 116(3), 232-239 (Sep 01, 1994) (8 pages) doi:10.1115/1.2906448 History: Received April 15, 1992; Revised August 25, 1992; Online April 16, 2008


Recent emphasis of the Department of Defense (DOD) on the reliability and integrity of avionics has spurred a new wave of research on this subject. This paper presents the results of a parametric investigation conducted to study the effect of vibration direction, boundary conditions, stiffeners and/or point supports, lead type, lead height, and the layout of the components on the natural frequencies and stresses exerted on a typical printed circuit board (PCB) used in avionics. The “robust design” procedure was adopted using a series of computer-simulated experiments. A finite element software, EMRC-FEAP, was utilized to estimate the maximum von Mises stresses within the critical leads, while the statistical analysis system (SAS) software was employed to analyze the natural frequency responses of the system and the signal-to-noise ratio (SNR) of the stresses induced at critical leads.

Copyright © 1994 by The American Society of Mechanical Engineers
Topics: Reliability , Design
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In