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Just Accepted Manuscript
Research-Article November 20, 2023
Optimal Design of Thermal Cycling Reliability For PBGA Assembly via FEM and Taguchi Method
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4064097
Research-Article November 20, 2023
PCB Defect Image Recognition Based On The Multi-Model Fusion Algorithm
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4064098
Research-Article November 20, 2023
Heat Dissipation Design Based On Topology Optimization And Auxiliary Materials
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4064099
Research-Article October 30, 2023
Numerical And Experimental Investigation Of A Volumetric Resistance Blower Performance And Its Optimization For Portable Computing Device Applications
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4063917
Research-Article October 30, 2023
The Research For Quickly Measuring The Diameter And Roundness Of Solder Balls Based On Machine Vision Technology
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4063918
Research-Article June 29, 2023
Automotive Silicon Carbide Power Module Cooling With A Novel Modular Manifold And Embedded Heat Sink
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4062869
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Heat Dissipation Design Based On Topology Optimization And Auxiliary Materials
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J. Electron. Packag (June 2024)
