The field reliability of solder joints depends on the manufacturing process tolerance of design parameters and on the capability of manufacturing processes to achieve the tolerance. This process capability is usually expressed through measures such as “six-sigma.” In this paper, a systematic procedure to estimate the reliability of solder joints due to manufacturing process induced variations on the design is presented. The reliability is calculated using the stochastic finite element method and is most naturally expressed in terms of a mean life and a standard deviation in life. An integrated finite element solution procedure for predicting solder joint profile (during reflow) and life is also presented in the paper. A physico-neural approach in which the finite element models are used to build an artificial neural network model is next developed to combine the accuracy of the finite element models with the computational efficiency of neural networks. This physico-neural approach is shown to reduce the computational time required per design evaluation by four orders of magnitude without significant loss of accuracy. The developed procedures are applied to the 72 I/O OMPAC BGA package from Motorola, Inc. It is shown that a ±10 percent process tolerance on solder joint height, volume and pad sizes with a “six-sigma” process capability on these variables will result in solder joint with over ±20 percent variations in life about the mean life at ±6σ level. It is also shown that variations in life of BGA solder joints are most sensitive to variations in solder joint height. Variations in PWB pad size, solder volume, and substrate pad size are relatively less important, but in the order listed.
Issue Section:
Technical Papers
1.
Charles
H. K.
Clatterbaugh
G. V.
1990
, “Solder Joint Reliability— Design Implications from Finite Element Modeling and Experimental Testing
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 112
, No. 2
, pp. 135
–146
.2.
Chu
T. Y.
1975
, “A Hydrostatic Model of Solder Fillets
,” Western Electronic Engineer
, Vol. 19
, No. 2
, pp. 31
–42
.3.
Coffin
L. F.
1954
, “A Study of Cyclic Thermal Stresses in a Ductile Metal
,” Trans. ASME
, Vol. 76
, pp. 931
–950
.4.
Corbin
J. S.
1993
, “Finite Element Analysis for Solder Ball Connect (SBC): Structural Design Optimization
,” IBM Journal of Research and Development
, Vol. 37
, No. 5
, pp. 585
–596
.5.
Darveaux, R., and Banerji, K., 1992, “Constitutive Relations for Tin-Based Solder Joints,” Proceedings of the 42nd Electronics Components and Technology Conference, IEEE, pp. 538–551.
6.
Darveaux, R., Banerji, K., Mawer, A., and Dody, G., 1995, “Reliability of Plastic Ball Grid Array Assembly,” J. H. Lau, ed., Ball Grid Array Technology, Chapter 13. McGraw-Hill.
7.
Engelmaier
W.
1993
, “Generic Reliability Figures of Merit Design Tools for Surface Mount Solder Attachments
,” IEEE Transactions on Components, Hybrids and Manufacturing Technology
, Vol. 16
, No, 1
, pp. 103
–112
.8.
Heinrich, S. M., 1994, “Prediction of Solder Joint Geometry,” Frear, D., Morgan, H., Burchett, S., and Lau, J., eds., The Mechanics of Solder Alloy Interconnects, Van Nostrand Reinhold.
9.
Heinrich
S. M.
Elkouh
A. F.
Nigro
N. J.
Lee
P. S.
1990
a, “Solder Joint Formation in Surface Mount Technology—Part I: Analysis
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 112
, pp. 210
–218
.10.
Heinrich
S. M.
Nigro
N. J.
Elkouh
A. F.
Lee
P. S.
1990
b, “Solder Joint Formation in Surface Mount Technology—Part II: Design
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 112
, pp. 219
–222
.11.
Heinrich, S. M., Schroeder, S. A., and Lee, P. S., 1994, “Prediction of Solder Joint Geometries in Multiple Bump Arrays,” Proceedings of ASME Winter Annual Meeting, ASME.
12.
Heinrich, S. M., Wang, Y., Shakya, S., Schroeder, S. A., and Lee, P. S., 1995, “Selection of Design and Process Parameters for Non-Uniform Ball-Grid Arrays,” Hsu, T. R., Bar-Cohen, A., and Nakayama, W., eds., EEP-Vol. 10-1, Advances in Electronic Packaging 1995, ASME, pp. 273–288.
13.
Hibbitt, Karlsson & Sorensen, Inc., Pawtucket, RI 02860, 1994, ABAQUS User’s Manual, Version 5.4.
14.
Ikegami, K., 1992, “Some Topics of Mechanical Problems in Electronic Packaging,” Advances in Electronic Packaging—Proceedings of the 1992 Joint ASME/JSME Conference on Electronic Packaging, ASME, pp. 567–573.
15.
IMSL, Inc., Houston, TX 77042, 1987, User’s Manual, Math/Library, Version 1.0.
16.
Jeannotte, D. A., Goldman, L. S., and Howard, R. T., 1988, “Package Reliability,” Tummala, R. R., and Rymaszewski, E. J., eds., Microelectronies Packaging Handbook, chapter 5, Van Nostrand Reinhold.
17.
Ju, T-H., Lin, W., Lee, Y. C., and Liu, J. J., 1993, “Effects of Ceramic Ball-Grid-Array Packages Manufacturing Variations on Solder Joint Reliability,” Proceedings of the 1993 ASME Winter Annual Meeting, ASME.
18.
Katyl
R. H.
Pimbley
W. T.
1992
, “Shape and Force Relationships for Molten Axisymmetric Solder Connections
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 114
, pp. 336
–341
.19.
Kreyszig, E., 1983, Advanced Engineering Mathematics, Wiley, New York.
20.
Lau, J. H., 1991, Solder Joint Reliability: Theory and Applications, Van Nostrand Rheinhold, New York.
21.
Li, Y., Mahajan, R. L., and N. Nikmanesh, N., 1995, “Fine Pitch Stencil Printing Process Modeling and Optimization,” Hsu, T. R., Bar-Cohen, A., and Nakayama, W., eds., EEP-Vol. 10-1, Advances in Electronic Packaging 1995, ASME, pp. 119–127.
22.
Mahajan
R. L.
Wang
X. A.
1993
, “Neural Network Models for Thermally Based Microelectronic Manufacturing Processes
,” Journal of the Electrochemical Society
, Vol. 140
, No. 8
, pp. 2287
–2293
.23.
Marwah, M., Li, Y., and Mahajan, R. L., 1996, “An Integrated Neural Network Modeling Approach and its Applications in Electronic Manufacturing,” to appear in ASME JOURNAL OF ELECTRONIC MANFACTURING.
24.
Manson, S. S., 1953, “Behavior of Materials Under Conditions of Thermal Stress,” Heat Transfer Symposium, University of Michigan Engineering Research Institute, pp. 9–75.
25.
Nagaraj, B., and Mahalingam, M., 1993, “Package-To-Board Attach Reliability—Methodology and Case Study on OMPAC Package,” P. A. Engel and W. T. Chen, eds., EEP-Vol. 4-1, Advances in Electronic Packaging, ASME, pp. 537–543.
26.
Nakaoka, Y., Hirota, J., and Machida, K., 1989, “Mechanical Properties of Solder Joints in Surface Mounting,” Sixth IEEE/CHMT International Electronics Manufacturing Technology Symposium, IEEE, pp. 117–120.
27.
Nigro
N. J.
Heinrich
S. M.
Elkouh
A. F.
Zou
X.
Fournelle
R.
Lee
P. S.
1993
, “Finite Element Method for Predicting Equilibrium Shapes of Solder Joints
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 115
, pp. 141
–146
.28.
Nigro, N. J., Zhou, F. J., Elkouh, A. F., Fournelle, R. A., Heinrich, S. M., and Lee, P. S., 1995, “Parametric Finite Element Method for Predicting Shapes of Three-Dimensional Solder Joints,” T. R. Hsu, A. Bar-Cohen, and W. Nakayama, eds., EEP-Vol. 10-1, Advances in Electronic Packaging 1995, ASME, pp. 435–449.
29.
Electronic Packaging and Production, Oct. 1993, Motorola, amkor sign BGA licensing agreement.
30.
Patra
S. K.
Lee
Y. C.
1991
, “Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint
,” ASME JOURNAL OF ELECTRONIC PACKAGING
, Vol. 113
, pp. 337
–342
.31.
PDA Engineering, Costa Mesa, CA 92626, 1993, PATRAN User’s Guide, Release 2.5.
32.
Peace, G. S., 1992, Taguchi Methods: A Hands on Approach, Addison-Wesley, Reading, MA.
33.
Sarihan, V., 1993, “A Robust Design Optimization Methodology for Life Enhancement in Electronic Packages,” P. A. Engel and W. T. Chen, eds., EEP-Vol. 4-1, Advances in Electronic Packaging, ASME, pp. 397–403.
34.
Shinozuka
M.
1987
, “Structural Response Variability
,” ASCE Journal of Engineering Mechanics
, Vol. 113
, No. 6
, pp. 825
–842
.35.
Smith, J., and Oliver, M., 1992, “Six Sigma: Realistic Goal or PR Ploy?” Machine Design, Sept., pp. 71–74.
36.
Taguchi, G., Elsayed, E. A., and Hsiang, T., 1989, Quality Engineering in Production Systems, McGraw-Hill, New York.
37.
Vanmarcke, E., 1983, Random Fields: Analysis and Synthesis. MIT, Cambridge, MA.
38.
Wang
X. A.
Mahajan
R. L.
1995
, “CVD Epitaxial Deposition in a Vertical Barrel Reactor: Process Modeling and Optimization Using Neural Network Models
,” J. Electrochem. Soc.
, Vol. 142
, No. 9
, pp. 3123
–3131
.39.
Zienkiewicz, O. C., and Taylor, R. L., 1989, The Finite Element Method. Volume 1. McGraw-Hill, London.
40.
Zienkiewicz, O. C., and Taylor, R. L, 1991, The Finite Element Method. Volume 2, McGraw-Hill, London.
This content is only available via PDF.
Copyright © 1996
by The American Society of Mechanical Engineers
You do not currently have access to this content.
