The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding of the thermal behavior of these components can help in deciding an effective thermal management scheme. Recognizing the inherent need for the thermal design of the active integrated power electronics modules, this paper assesses various possibilities of integrated thermal management for integrated power electronics modules. These integrated thermal management strategies include employing high thermal conductivity materials as well as structural modifications to the current module structure while not adding complexity to the fabrication process to reduce the cost.

Issue Section:
Research Papers
Keywords:
thermal management (packaging), modules, power electronics, cooling, thermal conductivity
Topics:
Ceramics, Cooling, Electronics, Heat, Thermal conductivity, Temperature, Thermal management
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 by American Society of Mechanical Engineers
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