Abstract

Power electronic components are found in all areas of an electric vehicle, from power train to motors and from battery to ancillary loads and these converters are manufactured in Silicon (Si). However, there are many other applications where the design requirements on power converters are too stringent to be met using conventional Silicon-based solutions. This includes applications in electric vehicles, defense and aerospace, subterranean exploration, and geothermal energy. For power converters in such applications, SiC offers many advantages over Si. While doing the electrical design of a power converter, the thermal aspects are usually neglected causing a vast difference in the simulation and real-life application. This paper aims to show how taking thermal characteristics into account for a power converter is beneficial and how it influences the results. This is done with two different SiC device models to replicate the results and to demonstrate the conclusiveness of the analysis. First, the electrical design of a buck converter is presented and then the thermal aspects of a design are explained in detail. Finally, both aspects are combined, and detailed simulations are shown in multiple different cases which provide a significant difference in the results validating the hypothesis.

References

1.
Emadi
,
A.
,
2017
,
Handbook of Automotive Power Electronics and Motor Drives
,
CRC Press
, Boca Raton, FL.
2.
Morya
,
A. K.
,
Gardner
,
M. C.
,
Anvari
,
B.
,
Liu
,
L.
,
Yepes
,
A. G.
,
Doval-Gandoy
,
J.
, and
Toliyat
,
H. A.
,
2019
, “
Wide Bandgap Devices in AC Electric Drives: Opportunities and Challenges
,”
IEEE Trans. Transp. Electrif.
,
5
(
1
), pp.
3
20
.10.1109/TTE.2019.2892807
3.
She
,
X.
,
Huang
,
A. Q.
,
Lucía
,
Ó.
, and
Ozpineci
,
B.
,
2017
, “
Review of Silicon Carbide Power Devices and Their Applications
,”
IEEE Trans. Ind. Electron.
,
64
(
10
), pp.
8193
8205
.10.1109/TIE.2017.2652401
4.
Gupta
,
U.
, and
Vass-Varnai
,
A.
,
2022
, “
Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model
,”
ASME
Paper No. IPACK2022-97669. 10.1115/IPACK2022-97669
5.
Haque
,
M. R.
,
Eka
,
S. Z.
,
Ferdous
,
S.
, and
Razzak
,
M. A.
,
2021
, “
Analysis of Loss Profile and Thermal Distribution of Heat Sink of IGBT-Based Asynchronous and Synchronous Buck Converters for EV Charging System
,”
Proceedings of the 2021 5th International Conference on Electronics, Materials Engineering & Nanotechnology
(
IEMEN-Tech
),
Kolkata, India
, Sept. 24–26, pp.
1
6
.10.1109/IEMENTech53263.2021.9614827
6.
Eckhardt
,
G.
, and
Lenz
,
J. M.
,
2022
, “
Four-Phase Buck Converter Design and Thermal Modeling Using FEA Simulation
,”
Proceedings of the 2022 14th Seminar on Power Electronics and Control
(
SEPOC
),
Santa Maria, Brazil
, Nov. 12–15, pp.
1
6
.10.1109/SEPOC54972.2022.9976419
7.
Rojas
,
C. A.
,
Gonzalez
,
R.
,
Callegaro
,
L.
, and
Young
,
H.
,
2021
, “
Mission Profile-Oriented Active Thermal Control of a Bidirectional Three-Level Buck-Boost GaN-Based DC-DC Converter for Electric Vehicles Powertrains
,”
Proceedings of the IECON 2021—47th Annual Conference of the IEEE Industrial Electronics Society
,
Toronto, ON, Canada
, Oct. 13–16, pp.
1
6
.10.1109/IECON48115.2021.9589692
8.
Pattnayak
,
R. A.
, and
Manapadam
,
Baskar
,
B.
,
2020
, “
Thermal and Electro-Thermal Analysis of DC-DC Convertor for 3-Wheeler Electric Vehicle
,”
Proceedings of the 2020 IEEE 8th Electronics System-Integration Technology Conference
(
ESTC
),
Tønsberg, Norway
, Sept. 15–18, pp.
1
5
.10.1109/ESTC48849.2020.9229677
9.
Hauke
,
B.
,
2011
, “
Basic Calculation of a Buck Converter's Power Stage
,” Texas Instruments, Dallas, TX, Application Report No.
SLVA477B
.https://www.ti.com/lit/an/slva477b/slva477b.pdf?ts=1698040612568
10.
Lee
,
S. W.
,
2014
, “
Demystifying Type II and Type III Compensators Using Op-Amp and OTA for DC/DC Converters
,” Texas Instruments, Dallas, TX, Application Report No.
SLVA662
.https://www.ti.com/lit/an/slva662/slva662.pdf?ts=1698041322884&ref_url=https%253A%252F%252Fwww.google.com%252F
11.
Wong
,
V. H.
,
Vass-Varnai
,
A.
,
Caruso
,
A.
,
Hara
,
T.
,
Hsu
,
A.
, and
Wang
,
G.
,
2021
, “
Detection of Die Attach Defects Through Rapid Thermal Transient Tests
,”
Proceedings of the 2021 International Conference on Electronics Packaging
(
ICEP
), Tokyo, Japan,
May 12–14, pp. 117–118
.10.23919/ICEP51988.2021.9451916
12.
JEDEC
,
1995
, “
EIA/JESD 51-1: Integrated Circuits Thermal Measurement Method-Electrical Test Method (Single Semiconductor Device)
,” JEDEC, Arlington, VA.
13.
Vass-Varnai
,
A.
,
Cho
,
Y. J.
,
Farkas
,
G.
, and
Rencz
,
M.
,
2018
, “
An Alternative Method to Accurately Determine the Thermal Resistance of SiC MOSFET Structures With Discrete Diodes
,”
Proceedings of the 2018 International Power Electronics Conference (IPEC-Niigata 2018-ECCE Asia)
, Niigata, Japan,
May 20–24, pp. 137–141
.10.23919/IPEC.2018.8507995
14.
Szekely
,
V.
, and
Van Bien
,
T.
,
1988
, “
Fine Structure of Heat Flow Path in Semiconductor Devices: A Measurement and Identification Method
,”
Solid-State Electron.
,
31
(
9
), pp.
1363
1368
.10.1016/0038-1101(88)90099-8
15.
Rencz
,
M. R.
, and
Szekely
,
V.
,
2002
, “
Measuring Partial Thermal Resistances in a Heat-Flow Path
,”
IEEE Trans. Compon. Packag. Technol.
,
25
(
4
), pp.
547
553
.10.1109/TCAPT.2002.808003
16.
Bornoff
,
R.
, and
Vass-Varnai
,
A.
,
2013
, “
A Detailed IC Package Numerical Model Calibration Methodology
,”
Proceedings of the 29th IEEE Semiconductor Thermal Measurement and Management Symposium
, San Jose, CA,
Mar. 17–21
, pp.
65
70
.10.1109/SEMI-THERM.2013.6526807
17.
Blackmore
,
B.
,
2016
, “
Automatic Calibration of Detailed IC Package Models
,”
Proceedings of the 2016 32nd Thermal Measurement, Modeling & Management Symposium
(
SEMI-THERM
), San Jose, CA, Mar. 14–17, pp.
105
112
.10.1109/SEMI-THERM.2016.7458454
18.
JEDEC
,
2010
, “
JESD 51-14: Transient Dual Interface Test Method for the Measurement of the Thermal Resistance Junction-to-Case of Semiconductor Devices With Heat Flow Through a Single Path
,” JEDEC, Arlington, VA.
19.
Blackmore
,
B.
,
Donnelly
,
M.
, and
Alkhenaizi
,
M.
,
2021
, “
Including Electrothermal Effects in Electronics Design With Connected FANTASTIC BCI-ROMs
,”
Proceedings of the 2021 37th Semiconductor Thermal Measurement, Modeling & Management Symposium (
SEMI-THERM
), San Jose, CA, Mar. 22–26, pp.
78
87
.https://ieeexplore.ieee.org/abstract/document/9406088
20.
Infineon
, 2017, “
DF100R07W1H5FP_B54 Easy-PACK™ Module With TRENCH STOP™ 5 H5 and Cool SiC™ Diode and Press FIT/Pre-Applied Thermal Interface Material
,” Infineon Technologies, München, Germany, accessed Oct. 25, 2023, https://www.mouser.com/datasheet/2/196/Infineon-DF100R07W1H5FP_B54-DataSheet-v03_00-EN-1731317.pdf
21.
CREE
, 2021, “
C2M0160120D Silicon Carbide Power MOSFET C2M TM MOSFET Technology N-Channel Enhancement Mode
,” CREE, Silicon Drive, Durham, NC, accessed Oct. 25, 2023, https://assets.wolfspeed.com/uploads/2020/12/C2M0160120D.pdf
22.
Zhang
,
H.
,
Liu
,
T.
,
Gupta
,
U.
,
Isukapati
,
S. B.
,
Ashik
,
E.
,
Morgan
,
A. J.
,
Lee
,
B.
,
Sung
,
W.
,
Agarwal
,
A. K.
, and
Fayed
,
A.
,
2022
, “
A 600V Half-Bridge Power Stage Fully Integrated With 25V Gate-Drivers in SiC CMOS Technology
,” Proceedings of the 2022 IEEE 65th International Midwest Symposium on Circuits and Systems (
MWSCAS
), Fukuoka, Japan, Aug. 7–10, pp.
1
4
.10.1109/MWSCAS54063.2022.9859305
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