Volume 136 Issue 3 | J. Electron. Packag.

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Volume 136, Issue 3

September 2014

ISSN 1043-7398

EISSN 1528-9044

Editorial

Letter From the Editors

Bahgat G. Sammakia, Y. C. Lee

J. Electron. Packag. September 2014, 136(3): 030201. doi: https://doi.org/10.1115/1.4028063

Extract

View articletitled, Letter From the Editors

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Topics: Actuators , Biomedicine , Computers , Data centers , Design , Electronic packaging , Electronics , Energy / power systems , Engineering teachers , Feedback

Reviewer Acknowledgment for the Journal of Electronic Packaging

J. Electron. Packag. September 2014, 136(3): 038001. doi: https://doi.org/10.1115/1.4027628

Extract

View articletitled, Reviewer Acknowledgment for the Journal of Electronic Packaging

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Topics: Electronic packaging

Research Papers

High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux

Fuliang Wang, Junhui Li, Lei Han

J. Electron. Packag. September 2014, 136(3): 031001. doi: https://doi.org/10.1115/1.4026877

Abstract

View articletitled, High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux

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Topics: Bonding , Low temperature , Silver

HDPE Matrix Composites Filled With Ca₄La₆(SiO₄)₄(PO₄)₂O₂ for Microwave Substrate Applications

Dhanesh Thomas, Mailadil T. Sebastian

J. Electron. Packag. September 2014, 136(3): 031002. doi: https://doi.org/10.1115/1.4027089

Abstract

View articletitled, HDPE Matrix Composites Filled With Ca4La6(SiO4)4(PO4)2O2 for Microwave Substrate Applications

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Topics: Composite materials , Fillers (Materials) , Microwaves

Heat Transfer Enhancement for Blocks in a Channel Using a Rotationally Oscillating Plate

Esam M. Alawadhi

J. Electron. Packag. September 2014, 136(3): 031003. doi: https://doi.org/10.1115/1.4027090

Abstract

View articletitled, Heat Transfer Enhancement for Blocks in a Channel Using a Rotationally Oscillating Plate

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Topics: Flow (Dynamics) , Heat transfer , Pressure drop , Reynolds number

Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

Kenny Mahan, Yong Sun, Bongtae Han, Sungwon Han, Mike Osterman

J. Electron. Packag. September 2014, 136(3): 031004. doi: https://doi.org/10.1115/1.4026922

Abstract

View articletitled, Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

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Topics: Adhesion , Coating processes , Coatings , Testing , Urethane elastomers , Pressure

Determination of the Lumped-Capacitance Parameters of Air-Cooled Servers Through Air Temperature Measurements

Hamza Salih Erden, H. Ezzat Khalifa, Roger R. Schmidt

J. Electron. Packag. September 2014, 136(3): 031005. doi: https://doi.org/10.1115/1.4027092

Abstract

View articletitled, Determination of the Lumped-Capacitance Parameters of Air-Cooled Servers Through Air Temperature Measurements

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Topics: Capacitance , Temperature , Transients (Dynamics) , Heat transfer , Data centers , Computational fluid dynamics , Air flow

Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps

Chang-Chun Lee, Po Ting Lin

J. Electron. Packag. September 2014, 136(3): 031006. doi: https://doi.org/10.1115/1.4026854

Abstract

View articletitled, Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps

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Topics: Bonding , Design , Packaging , Reliability , Warping , Compression , Finite element analysis

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume

J. Electron. Packag. September 2014, 136(3): 031007. doi: https://doi.org/10.1115/1.4027425

Abstract

View articletitled, Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

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Topics: Diffraction gratings , Lasers , Resolution (Optics) , Warping , Printed circuit boards , Accuracy and precision

Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components

Benjamin Giron-Palomares, Xin Fu, Abel Hernandez-Guerrero, Bladimir Ramos-Alvarado

J. Electron. Packag. September 2014, 136(3): 031008. doi: https://doi.org/10.1115/1.4027378

Abstract

View articletitled, Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components

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Topics: Inspection , Solders , Thermography , Temperature , Ball-Grid-Array packaging

Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling

Xiaohong Hao, Bei Peng, Gongnan Xie, Yi Chen

J. Electron. Packag. September 2014, 136(3): 031009. doi: https://doi.org/10.1115/1.4027508

Abstract

View articletitled, Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling

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Topics: Heat sinks , Pressure drop , Thermal resistance , Heat transfer , Pressure , Temperature , Modeling

A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems

A. Gholami, M. Ahmadi, M. Bahrami

J. Electron. Packag. September 2014, 136(3): 031010. doi: https://doi.org/10.1115/1.4027509

Abstract

View articletitled, A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems

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Topics: Cooling systems , Flat heat pipes , Heat , Heat pipes , Heat sinks , Network models , Temperature , Thermal resistance , Dynamic testing (Materials) , Transients (Dynamics)

Genetic Algorithm Applied to Geometric Optimization of Isothermal Y-Shaped Cavities

Giulio Lorenzini, Cesare Biserni, Emanuel da Silva Diaz Estrada, Elizaldo Domingues Dos Santos, Liércio André Isoldi, Luiz Alberto Oliveira Rocha

J. Electron. Packag. September 2014, 136(3): 031011. doi: https://doi.org/10.1115/1.4027421

Abstract

View articletitled, Genetic Algorithm Applied to Geometric Optimization of Isothermal Y-Shaped Cavities

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Topics: Cavities , Degrees of freedom , Design , Genetic algorithms , Optimization , Shapes , Temperature , Simulation , Geometry

Flow and Heat Transfer Analysis of an Electro-Osmotic Flow Micropump for Chip Cooling

K. Pramod, A. K. Sen

J. Electron. Packag. September 2014, 136(3): 031012. doi: https://doi.org/10.1115/1.4027657

Abstract

View articletitled, Flow and Heat Transfer Analysis of an Electro-Osmotic Flow Micropump for Chip Cooling

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Topics: Electroosmosis , Flow (Dynamics) , Micropumps , Pressure , Temperature , Cascades (Fluid dynamics) , Design , Cooling , Heat transfer , Pumps

Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime

Gongnan Xie, Masoud Asadi, Bengt Sunden, Shaofei Zheng

J. Electron. Packag. September 2014, 136(3): 031013. doi: https://doi.org/10.1115/1.4027728

Abstract

View articletitled, Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime

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Topics: Design , Flow (Dynamics) , Geometry , Heat transfer , Optimization , Reynolds number , Thermal resistance , Vortices , Wavelength , Degrees of freedom

Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor

Vivek Sahu, Andrei G. Fedorov, Yogendra K. Joshi

J. Electron. Packag. September 2014, 136(3): 031014. doi: https://doi.org/10.1115/1.4027901

Abstract

View articletitled, Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor

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Topics: Cooling , Superlattices , Temperature , Transients (Dynamics) , Microchannels

Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

Qimin Liu, Lidong Du, Zhan Zhao, Cheng Liu, Zhen Fang

J. Electron. Packag. September 2014, 136(3): 031015. doi: https://doi.org/10.1115/1.4028013

Abstract

View articletitled, Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

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Topics: Bonding , Design , Glass , Leakage , Microchannels , Silicon , Cavities , Theoretical analysis , Pressure sensors , Temperature

Technical Brief

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Dapeng Liu, Seungbae Park

J. Electron. Packag. September 2014, 136(3): 034501. doi: https://doi.org/10.1115/1.4026661

Abstract

View articletitled, A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

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Topics: Diffusion (Physics) , Simulation , Temperature , Transients (Dynamics) , Materials properties

Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink

S. Shanmugan, D. Mutharasu

J. Electron. Packag. September 2014, 136(3): 034502. doi: https://doi.org/10.1115/1.4027379

Abstract

View articletitled, Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink

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Topics: Aluminum , Calibration , Copper , Currents , Heat sinks , Junctions , Light-emitting diodes , Temperature , Thermal resistance , Thin films

Editorial

Letter From the Editors

Reviewer Acknowledgment for the Journal of Electronic Packaging

Research Papers

High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux

HDPE Matrix Composites Filled With Ca₄La₆(SiO₄)₄(PO₄)₂O₂ for Microwave Substrate Applications

Heat Transfer Enhancement for Blocks in a Channel Using a Rotationally Oscillating Plate

Adhesion and Puncture Strength of Polyurethane Coating Used to Mitigate Tin Whisker Growth

Determination of the Lumped-Capacitance Parameters of Air-Cooled Servers Through Air Temperature Measurements

Reliability-Based Design Guidance of Three-Dimensional Integrated Circuits Packaging Using Thermal Compression Bonding and Dummy Cu/Ni/SnAg Microbumps

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components

Thermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling

A New Analytical Approach for Dynamic Modeling of Passive Multicomponent Cooling Systems

Genetic Algorithm Applied to Geometric Optimization of Isothermal Y-Shaped Cavities

Flow and Heat Transfer Analysis of an Electro-Osmotic Flow Micropump for Chip Cooling

Constructal Theory Based Geometric Optimization of Wavy Channels in the Low Reynolds Number Regime

Transient Characterization of Hybrid Microfluidic-Thermoelectric Cooling Scheme for Dynamic Thermal Management of Microprocessor

Theoretical Analysis and Experimental Quantification of the Gas Leakage Due to Electrical Feedthroughs in Anodic Bonding

Technical Brief

A Note on the Normalized Approach to Simulating Moisture Diffusion in a Multimaterial System Under Transient Thermal Conditions Using ansys 14 and 14.5

Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink

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