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Issues
December 2014
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Editorial
Special Section on InterPACK 2013
J. Electron. Packag. December 2014, 136(4): 040201.
doi: https://doi.org/10.1115/1.4028390
Topics:
Copper
,
Design
,
Electronic packaging
,
Engineering mechanics
,
Manufacturing
,
Packaging
,
Reliability
,
Sensors
,
Silicon
,
Thermal management
Review Article
Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
J. Electron. Packag. December 2014, 136(4): 040801.
doi: https://doi.org/10.1115/1.4028629
Research Papers
Design of Thermoelectric Modules for High Heat Flux Cooling
J. Electron. Packag. December 2014, 136(4): 041001.
doi: https://doi.org/10.1115/1.4028118
Topics:
Cooling
,
Design
,
Heat
,
Heat flux
,
Packing (Shipments)
,
Packings (Cushioning)
,
Temperature
,
Geometry
,
Thermal resistance
,
Thermoelectric coolers
Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors
J. Electron. Packag. December 2014, 136(4): 041002.
doi: https://doi.org/10.1115/1.4026437
Topics:
Sensors
,
Simulation
,
Strain gages
,
Strain sensors
,
Stress
,
Temperature
,
Cycles
,
Surface acoustic waves
Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams
J. Electron. Packag. December 2014, 136(4): 041003.
doi: https://doi.org/10.1115/1.4026353
Topics:
Containers
,
Copper
,
Evaporation
,
Flux (Metallurgy)
,
Foams (Chemistry)
,
Heat
,
Heat losses
,
Porosity
,
Temperature
,
Ethanol
Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal Collector and Thermoelectric Generators
J. Electron. Packag. December 2014, 136(4): 041004.
doi: https://doi.org/10.1115/1.4028060
Topics:
Electrical efficiency
,
Flow (Dynamics)
,
Generators
,
Temperature
,
Thermal efficiency
,
Water
,
Heat
,
Solar energy
Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb Systems
J. Electron. Packag. December 2014, 136(4): 041005.
doi: https://doi.org/10.1115/1.4028331
Topics:
Cooling
,
Design
,
Heat sinks
,
Natural convection
,
Light-emitting diodes
UCPD Model for Pb-Free Solder
J. Electron. Packag. December 2014, 136(4): 041006.
doi: https://doi.org/10.1115/1.4026851
Topics:
Cycles
,
Damage
,
Fracture (Materials)
,
Lead-free solders
,
Solder joints
,
Solders
,
Failure
,
Fatigue
,
Simulation
Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes
J. Electron. Packag. December 2014, 136(4): 041007.
doi: https://doi.org/10.1115/1.4028075
Topics:
Capacitance
,
Electrodes
,
Junctions
,
Network models
,
Sensors
Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications
J. Electron. Packag. December 2014, 136(4): 041008.
doi: https://doi.org/10.1115/1.4028076
Topics:
Heating
,
Joules
,
Junctions
,
Mechanical admittance
,
Silicon
,
Temperature
,
Heat
,
Temperature distribution
Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit
J. Electron. Packag. December 2014, 136(4): 041009.
doi: https://doi.org/10.1115/1.4028119
Topics:
Design
,
Flow (Dynamics)
,
Pumps
,
Reservoirs
,
Sensors
,
Temperature
,
Water
,
Valves
,
Algorithms
,
Electronics
Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials
J. Electron. Packag. December 2014, 136(4): 041010.
doi: https://doi.org/10.1115/1.4026542
Topics:
Design
,
Shock (Mechanics)
,
Stress
Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density
J. Electron. Packag. December 2014, 136(4): 041011.
doi: https://doi.org/10.1115/1.4026878
Topics:
Carbon nanotubes
,
Current density
,
Damage
,
Multi-walled carbon nanotubes
,
Oxidation
,
Density
,
Electrodes
,
Atoms
,
Carbon
,
Evaporation
Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf
J. Electron. Packag. December 2014, 136(4): 041012.
doi: https://doi.org/10.1115/1.4028332
Topics:
Cavities
,
Columns (Structural)
,
Copper
,
Evaporation
,
Fillers (Materials)
,
Nanoparticles
,
Particulate matter
,
Self-assembly
,
Silver
,
Temperature
Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration
J. Electron. Packag. December 2014, 136(4): 041013.
doi: https://doi.org/10.1115/1.4028163
Topics:
Algorithms
,
Filters
,
Kalman filters
,
Particulate matter
Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors
J. Electron. Packag. December 2014, 136(4): 041014.
doi: https://doi.org/10.1115/1.4028333
Topics:
Sensors
,
Silicon
,
Stress
,
Bridges (Structures)
,
Shear stress
Technical Brief
Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener
J. Electron. Packag. December 2014, 136(4): 044501.
doi: https://doi.org/10.1115/1.4028316
Topics:
Aluminum
,
Bonding
,
Manufacturing
,
Nanowires
,
Fasteners
,
Electrical resistance
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