Topics: Copper , Design , Electronic packaging , Engineering mechanics , Manufacturing , Packaging , Reliability , Sensors , Silicon , Thermal management

Review Article

Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

John H. Lau

J. Electron. Packag. December 2014, 136(4): 040801. doi: https://doi.org/10.1115/1.4028629

Abstract

View articletitled, Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

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Topics: Integrated circuit packaging , Manufacturing , Semiconductor wafers , Supply chains , Wire bonding , Packaging , Integrated circuits , Bonding

Research Papers

Design of Thermoelectric Modules for High Heat Flux Cooling

Ram Ranjan, Joseph E. Turney, Charles E. Lents, Virginia H. Faustino

J. Electron. Packag. December 2014, 136(4): 041001. doi: https://doi.org/10.1115/1.4028118

Abstract

View articletitled, Design of Thermoelectric Modules for High Heat Flux Cooling

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Topics: Cooling , Design , Heat , Heat flux , Packing (Shipments) , Packings (Cushioning) , Temperature , Geometry , Thermal resistance , Thermoelectric coolers

Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

Jochen Hempel, Sohaib Anees, Elena Zukowski, Michael Berndt, Jürgen Wilde, Leonhard M. Reindl

J. Electron. Packag. December 2014, 136(4): 041002. doi: https://doi.org/10.1115/1.4026437

Abstract

View articletitled, Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

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Topics: Sensors , Simulation , Strain gages , Strain sensors , Stress , Temperature , Cycles , Surface acoustic waves

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Mahmood R. S. Shirazy, Luc G. Fréchette

J. Electron. Packag. December 2014, 136(4): 041003. doi: https://doi.org/10.1115/1.4026353

Abstract

View articletitled, Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

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Topics: Containers , Copper , Evaporation , Flux (Metallurgy) , Foams (Chemistry) , Heat , Heat losses , Porosity , Temperature , Ethanol

Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal Collector and Thermoelectric Generators

Xinqiang Xu, Siyi Zhou, Mark M. Meyers, Bahgat G. Sammakia, Bruce T. Murray

J. Electron. Packag. December 2014, 136(4): 041004. doi: https://doi.org/10.1115/1.4028060

Abstract

View articletitled, Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal Collector and Thermoelectric Generators

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Topics: Electrical efficiency , Flow (Dynamics) , Generators , Temperature , Thermal efficiency , Water , Heat , Solar energy

Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb Systems

James Petroski

J. Electron. Packag. December 2014, 136(4): 041005. doi: https://doi.org/10.1115/1.4028331

Abstract

View articletitled, Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb Systems

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Topics: Cooling , Design , Heat sinks , Natural convection , Light-emitting diodes

UCPD Model for Pb-Free Solder

Michael K. Neilsen, Paul T. Vianco

J. Electron. Packag. December 2014, 136(4): 041006. doi: https://doi.org/10.1115/1.4026851

Abstract

View articletitled, UCPD Model for Pb-Free Solder

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Topics: Cycles , Damage , Fracture (Materials) , Lead-free solders , Solder joints , Solders , Failure , Fatigue , Simulation

Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes

Stephen H. Taylor, Suresh V. Garimella

J. Electron. Packag. December 2014, 136(4): 041007. doi: https://doi.org/10.1115/1.4028075

Abstract

View articletitled, Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes

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Topics: Capacitance , Electrodes , Junctions , Network models , Sensors

Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications

Fahad Mirza, Gaurang Naware, Ankur Jain, Dereje Agonafer

J. Electron. Packag. December 2014, 136(4): 041008. doi: https://doi.org/10.1115/1.4028076

Abstract

View articletitled, Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications

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Topics: Heating , Joules , Junctions , Mechanical admittance , Silicon , Temperature , Heat , Temperature distribution

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

Michael J. Ellsworth, Jr., Randy J. Zoodsma, Frank Cascio, Eileen Behrendt

J. Electron. Packag. December 2014, 136(4): 041009. doi: https://doi.org/10.1115/1.4028119

Abstract

View articletitled, Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

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Topics: Design , Flow (Dynamics) , Pumps , Reservoirs , Sensors , Temperature , Water , Valves , Algorithms , Electronics

Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials

S. A. Meguid, Chen Zhuo, Fan Yang

J. Electron. Packag. December 2014, 136(4): 041010. doi: https://doi.org/10.1115/1.4026542

Abstract

View articletitled, Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials

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Topics: Design , Shock (Mechanics) , Stress

Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Kazuhiko Sasagawa, Kazuhiro Fujisaki, Jun Unuma, Ryota Azuma

J. Electron. Packag. December 2014, 136(4): 041011. doi: https://doi.org/10.1115/1.4026878

Abstract

View articletitled, Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

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Topics: Carbon nanotubes , Current density , Damage , Multi-walled carbon nanotubes , Oxidation , Density , Electrodes , Atoms , Carbon , Evaporation

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf

J. Electron. Packag. December 2014, 136(4): 041012. doi: https://doi.org/10.1115/1.4028332

Abstract

View articletitled, Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

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Topics: Cavities , Columns (Structural) , Copper , Evaporation , Fillers (Materials) , Nanoparticles , Particulate matter , Self-assembly , Silver , Temperature

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration

Pradeep Lall, Ryan Lowe

J. Electron. Packag. December 2014, 136(4): 041013. doi: https://doi.org/10.1115/1.4028163

Abstract

View articletitled, Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration

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Topics: Algorithms , Filters , Kalman filters , Particulate matter

Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling

J. Electron. Packag. December 2014, 136(4): 041014. doi: https://doi.org/10.1115/1.4028333

Abstract

View articletitled, Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

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Topics: Sensors , Silicon , Stress , Bridges (Structures) , Shear stress

Technical Brief

Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener

Hiromasa Teshima, Kohei Kojima, Yang Ju

J. Electron. Packag. December 2014, 136(4): 044501. doi: https://doi.org/10.1115/1.4028316

Abstract

View articletitled, Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener

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Topics: Aluminum , Bonding , Manufacturing , Nanowires , Fasteners , Electrical resistance

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Editorial

Special Section on InterPACK 2013

Review Article

Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration

Research Papers

Design of Thermoelectric Modules for High Heat Flux Cooling

Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

Effect of Meniscus Recession on the Effective Pore Radius and Capillary Pumping of Copper Metal Foams

Performance Analysis of a Combination System of Concentrating Photovoltaic/Thermal Collector and Thermoelectric Generators

Advanced Natural Convection Cooling Designs for Light-Emitting Diode Bulb Systems

UCPD Model for Pb-Free Solder

Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes

Effect of Through-Silicon-Via Joule Heating on Device Performance for Low-Powered Mobile Applications

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

Effective Mitigation of Shock Loads in Embedded Electronic Packaging Using Bilayered Potting Materials

Experimental Study of Damage Mechanism of Carbon Nanotube as Nanocomponent of Electronic Devices Under High Current Density

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration

Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

Technical Brief

Fabrication of Anodic Aluminum Oxide Template and Copper Nanowire Surface Fastener

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