Topics: Condensers (steam plant) , Flow (Dynamics) , Heat , Secondary cells , Stress , Temperature , Subcooling , Cooling systems , Refrigerants , Electronics

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Jayati Athavale, Yogendra Joshi, Minami Yoda

J. Electron. Packag. March 2018, 140(1): 010902. doi: https://doi.org/10.1115/1.4039025

Abstract

View articletitled, Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

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Topics: Tiles , Data centers , Flow (Dynamics) , Temperature

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek

J. Electron. Packag. March 2018, 140(1): 010903. doi: https://doi.org/10.1115/1.4039333

Abstract

View articletitled, Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

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Topics: Electronics , Failure , Reliability , Stress , Temperature , Failure mechanisms , Cycles , Safety , Failure analysis , Simulation

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura

J. Electron. Packag. March 2018, 140(1): 010904. doi: https://doi.org/10.1115/1.4039020

Abstract

View articletitled, Thermal Metamaterials for Heat Flow Control in Electronics

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Topics: Composite materials , Design , Electronics , Flow control , Heat , Heat flux , Metamaterials , Printed circuit boards , Temperature , Anisotropy

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua

J. Electron. Packag. March 2018, 140(1): 010905. doi: https://doi.org/10.1115/1.4039026

Abstract

View articletitled, Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

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Topics: Heat conduction , Heat flux , Heat transfer , Integrated circuits , Interpolation , Optimization , Sensors , Temperature , Temperature sensors , Genetic algorithms

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho

J. Electron. Packag. March 2018, 140(1): 010906. doi: https://doi.org/10.1115/1.4039027

Abstract

View articletitled, Lead-Free Alternatives for Interconnects in High-Temperature Electronics

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Topics: Alloys , Electronics , High temperature , Solders , Temperature , Testing , Thermal conductivity , Failure , Melting , Tensile testing

Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles

Sadegh Khalili, Mohammad I. Tradat, Kourosh Nemati, Mark Seymour, Bahgat Sammakia

J. Electron. Packag. March 2018, 140(1): 010907. doi: https://doi.org/10.1115/1.4039028

Abstract

View articletitled, Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles

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Topics: Air flow , Design , Leakage , Tiles , Temperature , Computational fluid dynamics , Simulation , Flow (Dynamics) , Pressure

Research Papers

A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging

X. J. Yao, J. J. Fang, Wenjun Zhang

J. Electron. Packag. March 2018, 140(1): 011001. doi: https://doi.org/10.1115/1.4038391

Abstract

View articletitled, A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging

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Topics: Flip-chip , Flow (Dynamics) , Permeability , Porous materials , Packaging

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Lei Shi, Lin Chen, David Wei Zhang, Evan Liu, Qiang Liu, Ching-I Chen

J. Electron. Packag. March 2018, 140(1): 011002. doi: https://doi.org/10.1115/1.4038245

Abstract

View articletitled, Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

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Topics: Density , Design , Finite element model , Packaging , Reliability , Semiconductor wafers , Solder joints , Solders , Stress , Fatigue life

Ripening Growth Kinetics of Cu₆Sn₅ Grains in Sn-3.0Ag-0.5Cu-xTiO₂/Cu Solder Joints During the Reflow Process

Y. Tang, S. M. Luo, G. Y. Li, Z. Yang, C. J. Hou

J. Electron. Packag. March 2018, 140(1): 011003. doi: https://doi.org/10.1115/1.4038861

Abstract

View articletitled, Ripening Growth Kinetics of Cu6Sn5 Grains in Sn-3.0Ag-0.5Cu-xTiO2/Cu Solder Joints During the Reflow Process

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Topics: Solder joints , Tin , Solders , Nanoparticles

Errata

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333]

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling

J. Electron. Packag. March 2018, 140(1): 017001. doi: https://doi.org/10.1115/1.4038735

Extract

View articletitled, Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333]

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Topics: Bridges (Structures) , Electrons , Sensors , Silicon , Stress , Wire

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Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Experimentally Validated Computational Fluid Dynamics Model for Data Center With Active Tiles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Thermal Metamaterials for Heat Flow Control in Electronics

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Impact of Tile Design on the Thermal Performance of Open and Enclosed Aisles

Research Papers

A Further Study on the Analytical Model for the Permeability in Flip-Chip Packaging

Improvement of Thermo-Mechanical Reliability of Wafer-Level Chip Scale Packaging

Ripening Growth Kinetics of Cu₆Sn₅ Grains in Sn-3.0Ag-0.5Cu-xTiO₂/Cu Solder Joints During the Reflow Process

Errata

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333]

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