Topics: Data centers , Electronic packaging , Cooling , Design , Engineering teachers , Microelectronic packaging , Packaging , Semiconductor industry

Review Article

Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

Phil Geng

J. Electron. Packag. March 2019, 141(1): 010801. doi: https://doi.org/10.1115/1.4042800

Abstract

View articletitled, Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention

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Topics: Design , Shock (Mechanics) , Solder joints , Stress , Structural design , Vibration , Failure , Creep

Liquid Cooling of Compute System

Jessica Gullbrand, Mark J. Luckeroth, Mark E. Sprenger, Casey Winkel

J. Electron. Packag. March 2019, 141(1): 010802. doi: https://doi.org/10.1115/1.4042802

Abstract

View articletitled, Liquid Cooling of Compute System

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Topics: Cooling , Design , Fluids , Plates (structures) , Flow (Dynamics) , Manifolds , Temperature

Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

Aastha Uppal, Jerrod Peterson, Je-Young Chang, Xi Guo, Frank Liang, Weihua Tang

J. Electron. Packag. March 2019, 141(1): 010803. doi: https://doi.org/10.1115/1.4042801

Abstract

View articletitled, Thermomechanical Interaction Between Thin Bare-Die Package and Thermal Solution in Next-Generation Mobile Computing Platforms

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Topics: Design , Modeling , Thermomechanics , Stress , Heat pipes , Pressure

Special Section Articles

Mechanical Characterization of Thermal Interface Materials and Its Challenges

Vijay Subramanian, Jorge Sanchez, Joseph Bautista, Yi He, Jinlin Wang, Abhishek Das, Jesus Gerardo Reyes Schuldes, Kyle Yazzie, Hemanth K. Dhavaleswarapu, Pramod Malatkar

J. Electron. Packag. March 2019, 141(1): 010804. doi: https://doi.org/10.1115/1.4042805

Abstract

View articletitled, Mechanical Characterization of Thermal Interface Materials and Its Challenges

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Topics: Adhesion , Compression , Shear (Mechanics) , Temperature , Thermal expansion , Stress , Thermomechanics , Silicon

Research Papers

Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal

Yuntao Cui, Yujie Ding, Shuo Xu, Yushu Wang, Wei Rao, Jing Liu

J. Electron. Packag. March 2019, 141(1): 011001. doi: https://doi.org/10.1115/1.4041665

Abstract

View articletitled, Study on Heat Transfer and Corrosion Resistance of Anodized Aluminum Alloy in Gallium-Based Liquid Metal

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Topics: Aluminum alloys , Corrosion resistance , Gallium , Heat transfer , Liquid metals , Thermal conductivity , Oxidation , Heat , Coatings , Cooling

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Arman Nokhosteen, M. Soltani, Banafsheh Barabadi

J. Electron. Packag. March 2019, 141(1): 011002. doi: https://doi.org/10.1115/1.4041666

Abstract

View articletitled, Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

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Topics: Boundary-value problems , Heat , Integrated circuits , Microelectronic devices , Modeling , Principal component analysis , Simulation , Temperature , Temperature distribution , Temperature profiles