Topics: Cooling , Heat , Heat pipes , Phase change materials , Temperature , Thermal management , Transients (Dynamics) , Vapors , Boiling , Steady state

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

Ruina Xu, Gaoyuan Wang, Peixue Jiang

J. Electron. Packag. March 2022, 144(1): 010802. doi: https://doi.org/10.1115/1.4050046

Abstract

View articletitled, Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

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Topics: Cooling , Heat transfer , Sprays , Critical heat flux , Drops

Underfill Flow in Flip-Chip Encapsulation Process: A Review

Fei Chong Ng, Mohamad Aizat Abas

J. Electron. Packag. March 2022, 144(1): 010803. doi: https://doi.org/10.1115/1.4050697

Abstract

View articletitled, Underfill Flow in Flip-Chip Encapsulation Process: A Review

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Topics: Flow (Dynamics) , Flip-chip , Fluids , Optimization , Design , Reliability

Research Papers

Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging

Chang-Chun Lee, Kuo-Shu Kao, Hou-Chun Liu, Chia-Ping Hsieh, Tao-Chih Chang

J. Electron. Packag. March 2022, 144(1): 011001. doi: https://doi.org/10.1115/1.4050198

Abstract

View articletitled, Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging

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Topics: Creep , Fatigue , Packaging , Reliability , Solder joints , Warping , Finite element analysis , Stress , Solders , Silicon

Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy

Zheng Liu, Li Yang, Yifeng Xiong, Huiming Gao

J. Electron. Packag. March 2022, 144(1): 011002. doi: https://doi.org/10.1115/1.4051025

Abstract

View articletitled, Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy

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Topics: Alloys , Composite materials , Nanoparticles , Solders , Tin , Tensile strength

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis

J. Electron. Packag. March 2022, 144(1): 011003. doi: https://doi.org/10.1115/1.4050696

Abstract

View articletitled, Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

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Topics: Ball-Grid-Array packages , Design , Failure , Finite element analysis , Finite element methods , Heat , Probability , Reliability , Temperature , Thermal analysis

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Gilberto Moreno, Sreekant Narumanchi, Xuhui Feng, Paul Anschel, Steve Myers, Phil Keller

J. Electron. Packag. March 2022, 144(1): 011004. doi: https://doi.org/10.1115/1.4049815

Abstract

View articletitled, Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

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Topics: Cooling , Electronics , Fluids , Heat exchangers , Heat transfer , Thermal management , Thermal resistance , Vehicles , Heat , Temperature

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu

J. Electron. Packag. March 2022, 144(1): 011005. doi: https://doi.org/10.1115/1.4049813

Abstract

View articletitled, Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

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Topics: Cycles , Microelectromechanical systems , Modeling , Pressure sensors , Signals , Stress , Temperature , Vibration , Solder joints , Soldering

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

Tae-Yong Park, Hyun-Ung Oh

J. Electron. Packag. March 2022, 144(1): 011006. doi: https://doi.org/10.1115/1.4050512

Abstract

View articletitled, Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

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Topics: Fatigue life , Random vibration , Safety , Solder joints , Ball-Grid-Array packaging

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. March 2022, 144(1): 011007. doi: https://doi.org/10.1115/1.4050871

Abstract

View articletitled, Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

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Topics: Annealing , Cycles , Damage , Deformation , Dislocations , Fatigue , Fatigue life , Nanoparticles , Particulate matter , Shear strength

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Patrick Krane, David Gonzalez Cuadrado, Francisco Lozano, Guillermo Paniagua, Amy Marconnet

J. Electron. Packag. March 2022, 144(1): 011008. doi: https://doi.org/10.1115/1.4050200

Abstract

View articletitled, Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

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Topics: Electronic packages , Heat , Temperature , Errors , Heat conduction

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Vishnu V. B. Reddy, Saurabh Gupta, Jaimal Williamson, Suresh K. Sitaraman

J. Electron. Packag. March 2022, 144(1): 011009. doi: https://doi.org/10.1115/1.4050898

Abstract

View articletitled, Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

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Topics: Cycles , Damage , Finite element analysis , Inspection , Lasers , Modeling , Natural language interfaces , Solders , Accelerated life testing , Density

Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO₂/Graphite Bilayered Packaging Structure

Zong-Tao Li, Jun-Hao Wu, Zhi-yao Ren, Yao-xing Song, Jia-Sheng Li

J. Electron. Packag. March 2022, 144(1): 011010. doi: https://doi.org/10.1115/1.4050202

Abstract

View articletitled, Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO<sub>2</sub>/Graphite Bilayered Packaging Structure

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Topics: Electromagnetic scattering , Graphite , Light-emitting diodes , Nanoparticles , Packaging , Radiation (Physics)

Numerical Modeling of the Wave Soldering Process and Experimental Validation

Violeta Carvalho, Bruno Arcipreste, Delfim Soares, Luís Ribas, Nelson Rodrigues, Senhorinha F. C. F. Teixeira, José Carlos Teixeira

J. Electron. Packag. March 2022, 144(1): 011011. doi: https://doi.org/10.1115/1.4050981

Abstract

View articletitled, Numerical Modeling of the Wave Soldering Process and Experimental Validation

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Topics: Computer simulation , Soldering , Solders , Wave soldering , Waves , Strain measurement , Fluids

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Editorial

Reviewer's Recognition

Review Articles

A Review on Transient Thermal Management of Electronic Devices

Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms

Underfill Flow in Flip-Chip Encapsulation Process: A Review

Research Papers

Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging

Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO₂/Graphite Bilayered Packaging Structure

Numerical Modeling of the Wave Soldering Process and Experimental Validation

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