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Issues
December 2023
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Special Issue: InterPACK2022
GUEST EDITORIAL
Special Issue on InterPACK2022
J. Electron. Packag. December 2023, 145(4): 040301.
doi: https://doi.org/10.1115/1.4063893
Topics:
Aerosols
,
Artificial intelligence
,
Cloud computing
,
Cooling
,
Cycles
,
Density
,
Electric vehicles
,
Electronic packaging
,
Electronics
,
Energy conversion
SPECIAL PAPERS
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
J. Electron. Packag. December 2023, 145(4): 041101.
doi: https://doi.org/10.1115/1.4062403
Topics:
Boilers
,
Boiling
,
Bose-Einstein condensates
,
Cooling
,
Fluids
,
Junctions
,
Slug flows
,
Temperature
,
Thermal resistance
,
Vehicles
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals
J. Electron. Packag. December 2023, 145(4): 041102.
doi: https://doi.org/10.1115/1.4063325
Topics:
Anisotropy
,
Cooling
,
Crystals
,
Finite element analysis
,
Grain size
,
Shear (Mechanics)
,
Solder joints
,
Solders
,
Stress
,
Tin
Converging Jet Impingement for Enhanced Liquid Cooling
J. Electron. Packag. December 2023, 145(4): 041103.
doi: https://doi.org/10.1115/1.4063484
Topics:
Additive manufacturing
,
Cooling
,
Electronics
,
Fluids
,
Heat transfer
,
Jets
,
Nozzles
,
Pressure
,
Reynolds number
,
Simulation
The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch
J. Electron. Packag. December 2023, 145(4): 041104.
doi: https://doi.org/10.1115/1.4063485
Topics:
Inks
,
Particulate matter
,
Percolation theory
,
Resistors
,
Silver
,
Modeling
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
J. Electron. Packag. December 2023, 145(4): 041105.
doi: https://doi.org/10.1115/1.4063541
Topics:
Aerosols
,
Failure
,
Failure mechanisms
,
Modeling
,
Reliability
,
Silver
,
Temperature
,
Testing
,
Circuits
,
Printing
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application
J. Electron. Packag. December 2023, 145(4): 041106.
doi: https://doi.org/10.1115/1.4063883
Topics:
Design
,
Electric vehicles
,
Silicon carbide
,
Simulation
,
Modeling
,
Temperature
TECHNICAL BRIEF
Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska
Jewoo Park, Nhi V. Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
J. Electron. Packag. December 2023, 145(4): 044501.
doi: https://doi.org/10.1115/1.4063486
Topics:
Autonomous vehicles
,
Drops
,
Machine learning
,
Sensors
,
Temperature
,
Vehicles
Email alerts
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Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
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