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1-20 of 19079
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Journal Articles
Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021001.
Paper No: EP-22-1003
Published Online: August 8, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021002.
Paper No: EP-22-1037
Published Online: August 8, 2022
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 1 ( a ) Assembly of the pure copper cold plate, ( b ) channel network and manifold cross section of nickel-plated cold plate, and ( c ) top view of channel network for pure copper and nickel-plated cold plates More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 2 The cross section image of a pure copper cold plate More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 3 The SEM of channel network for ( a ) electroless nickel-plated and ( b ) pure copper heat sinks from top view More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 4 Benchtop experimental setup ( a ) mock package including the copper block heater and the cold plate, ( b ) schematic of the test setup, and ( c ) benchtop experimental setup More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 5 A schematic of resistances for the heat flow from a real chip to incoming fluid for a regular cold plate arrangement More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 6 A symmetric view of the computational domain with applied boundary conditions More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 7 The results of grid resolution based on thermal resistance and pressure drop More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 8 ( a ) Nickel plated cold plate and ( b ) pure copper cold plate pressure drop curve at two different inlet temperatures of 32 °C and 45 °C More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 9 A comparison of nickel-plated and pure copper cold plate pressure drops at 32 °C. The curves include the fitting's pressure drops. More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 10 A comparison of the nickel-plated and pure copper cold plate thermal resistances at various inlet temperatures More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 11 CFD results compared to actual test data for the pure copper cold plate More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 12 Temperature nonuniformity on the case profile according to flow rate More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 13 Temperature profile of the case surface at ( a ) 0.5 LPM and ( b ) 1.5 LPM More
Image
in Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 14 Velocity profile inside parallel channels at half the fin height and 1 LPM More
Image
in Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 1 Optical microscope image examples of cross-sectioned flip-chip SAC305 solder spheres ( a ) before and ( b ) after experiencing EM conditions with voiding present at bond location in bottom of image ( b ) More
Image
in Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 2 Example of solder joint sample after fabrication More
Image
in Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 3 Schematic view of mechanical structure of test setup More
Image
in Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
> Journal of Electronic Packaging
Published Online: August 8, 2022
Fig. 4 Final test setup with four simultaneous EM-mechanical strain experiment beds More