Fig. 1 ( a ) Assembly of the pure copper cold plate, ( b ) channel network and manifold cross section of nickel-plated cold plate, and ( c ) top view of channel network for pure copper and nickel-plated cold plates More

Fig. 2 The cross section image of a pure copper cold plate More

Fig. 3 The SEM of channel network for ( a ) electroless nickel-plated and ( b ) pure copper heat sinks from top view More

Fig. 4 Benchtop experimental setup ( a ) mock package including the copper block heater and the cold plate, ( b ) schematic of the test setup, and ( c ) benchtop experimental setup More

Fig. 5 A schematic of resistances for the heat flow from a real chip to incoming fluid for a regular cold plate arrangement More

Fig. 6 A symmetric view of the computational domain with applied boundary conditions More

Fig. 7 The results of grid resolution based on thermal resistance and pressure drop More

Fig. 8 ( a ) Nickel plated cold plate and ( b ) pure copper cold plate pressure drop curve at two different inlet temperatures of 32 °C and 45 °C More

Fig. 9 A comparison of nickel-plated and pure copper cold plate pressure drops at 32 °C. The curves include the fitting's pressure drops. More

Fig. 10 A comparison of the nickel-plated and pure copper cold plate thermal resistances at various inlet temperatures More

Fig. 11 CFD results compared to actual test data for the pure copper cold plate More

Fig. 12 Temperature nonuniformity on the case profile according to flow rate More

Fig. 13 Temperature profile of the case surface at ( a ) 0.5 LPM and ( b ) 1.5 LPM More

Fig. 14 Velocity profile inside parallel channels at half the fin height and 1 LPM More

Fig. 1 Optical microscope image examples of cross-sectioned flip-chip SAC305 solder spheres ( a ) before and ( b ) after experiencing EM conditions with voiding present at bond location in bottom of image ( b ) More

Fig. 2 Example of solder joint sample after fabrication More

Fig. 3 Schematic view of mechanical structure of test setup More

Fig. 4 Final test setup with four simultaneous EM-mechanical strain experiment beds More