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Journal Articles

Interfacial Fracture Caused by Electromigration at Copper Interconnects

Yuexing Wang, Bofeng Li, Yao Zhifeng, Yao Yao
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011007.
Paper No: EP-23-1034
https://doi.org/10.1115/1.4062828
Published Online: July 14, 2023
View Article titled, Interfacial Fracture Caused by Electromigration at Copper Interconnects
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Topics: Copper, Electrodiffusion, Fracture (Materials), Fracture (Process), Stress, Fracture toughness, Dislocations, Anodes
Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011102.
Paper No: EP-22-1016
https://doi.org/10.1115/1.4055394
Published Online: September 27, 2022
View Article titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model
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Topics: Anodes, Creep, Current density, Electrodiffusion, Solder joints, Stress, Temperature
Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041012.
Paper No: EP-21-1136
https://doi.org/10.1115/1.4053365
Published Online: January 28, 2022
View Article titled, Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current
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Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries
Journal Articles

Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model

Mitsuaki Kato, Takahiro Omori, Akihiro Goryu, Tomoya Fumikura, Kenji Hirohata
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
https://doi.org/10.1115/1.4052231
Published Online: September 13, 2021
View Article titled, Electromigration Analysis of Solder Joints for Power Modules Using an Electrical–Thermal-Stress Coupled Model
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Topics: Creep, Current density, Electrodiffusion, Solder joints, Temperature, Anodes, Plasticity, Stress
Journal Articles

Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect

Yasuhiro Kimura, Masumi Saka
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021008.
Paper No: EP-18-1073
https://doi.org/10.1115/1.4042980
Published Online: April 10, 2019
View Article titled, Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect
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Topics: Current density, Electrodiffusion, Finite element analysis, Flow (Dynamics), Electric potential, Anodes, Damage, Density, Solders, Atoms
Journal Articles

Effect of Polarity on Heat Transfer in the Ball Formation Process

L. J. Huang, M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 1991, 113(1): 33–39.
https://doi.org/10.1115/1.2905364
Published Online: March 1, 1991
View Article titled, Effect of Polarity on Heat Transfer in the Ball Formation Process
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Topics: Heat transfer, Wire, Anodes, Aluminum, Copper, Bonding, Electric discharge, Heat, Pressure, Semiconductors (Materials)