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Journal Articles

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi

J. Electron. Packag. June 2023, 145(2): 021004.

Paper No: EP-22-1038

DOI: https://doi.org/10.1115/1.4055094

Published Online: August 18, 2022

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Topics: Climate, Design, Solar energy, Temperature, Thermal management, Transients (Dynamics), Solar radiation, Smart cities, Computer simulation, Cycles

Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2023, 145(1): 011204.

Paper No: EP-21-1110

DOI: https://doi.org/10.1115/1.4054784

Published Online: August 3, 2022

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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure

Journal Articles

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia

J. Electron. Packag. December 2020, 142(4): 041109.

Paper No: EP-19-1123

DOI: https://doi.org/10.1115/1.4047471

Published Online: June 29, 2020

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Topics: Genetic algorithms, Heat, Optimization, Temperature, Artificial neural networks, Heat transfer, Integrated circuits, Algorithms, Boundary-value problems

Journal Articles

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

M. Y. Tsai, H. J. Chen, J. H. Yeh

J. Electron. Packag. December 2019, 141(4): 041007.

Paper No: EP-19-1034

DOI: https://doi.org/10.1115/1.4044961

Published Online: October 18, 2019

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Topics: Bending strength, Boundary-value problems, Displacement, Glass, Stress, Failure mechanisms, Surface roughness

Journal Articles

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Arman Nokhosteen, M. Soltani, Banafsheh Barabadi

J. Electron. Packag. March 2019, 141(1): 011002.

Paper No: EP-18-1029

DOI: https://doi.org/10.1115/1.4041666

Published Online: February 25, 2019

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Topics: Boundary-value problems, Heat, Integrated circuits, Microelectronic devices, Modeling, Principal component analysis, Simulation, Temperature, Temperature distribution, Temperature profiles

Journal Articles

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Sharan Kallolimath, Jiang Jenny Zhou

J. Electron. Packag. December 2016, 138(4): 041001.

Paper No: EP-14-1082

DOI: https://doi.org/10.1115/1.4034187

Published Online: August 10, 2016

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Topics: Electrons, Finite element analysis, Lumber, Shock (Mechanics), Simulation, Stress, Solder joints, Modeling, Symmetry (Physics), Boundary-value problems

Journal Articles

Modeling Thermal Microspreading Resistance in Via Arrays

Michael Fish, Patrick McCluskey, Avram Bar-Cohen

J. Electron. Packag. March 2016, 138(1): 010909.

Paper No: EP-15-1097

DOI: https://doi.org/10.1115/1.4032348

Published Online: March 11, 2016

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Topics: Boundary-value problems, Convection, Electrical conductivity, Modeling, Thermal conductivity, Heat, Flow (Dynamics), Finite element model

Journal Articles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald

J. Electron. Packag. March 2016, 138(1): 010903.

Paper No: EP-15-1083

DOI: https://doi.org/10.1115/1.4032345

Published Online: March 10, 2016

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Topics: Calibration, Condensers (steam plant), Copper, Flat heat pipes, Heat, Heat losses, Natural convection, Temperature, Thermal resistance, Vapors

Journal Articles

Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application

S. Shanmugan, O. Zeng Yin, P. Anithambigai, D. Mutharasu

J. Electron. Packag. March 2016, 138(1): 011001.

Paper No: EP-13-1112

DOI: https://doi.org/10.1115/1.4032029

Published Online: March 10, 2016

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Topics: Boundary-value problems, Thin films, Light-emitting diodes, Temperature, Thermal resistance

Journal Articles

Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink

S. Shanmugan, D. Mutharasu

J. Electron. Packag. September 2014, 136(3): 034502.

Paper No: EP-13-1099

DOI: https://doi.org/10.1115/1.4027379

Published Online: May 12, 2014

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Topics: Aluminum, Calibration, Copper, Currents, Heat sinks, Junctions, Light-emitting diodes, Temperature, Thermal resistance, Thin films

Journal Articles

A Compact Modeling Approach to Enhance Collaborative Design of Thermal-Fluid Systems

Jason Stafford, David Newport, Ronan Grimes

J. Electron. Packag. March 2014, 136(1): 011004.

Paper No: EP-13-1026

DOI: https://doi.org/10.1115/1.4026051

Published Online: December 16, 2013

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Topics: Boundary-value problems, Design, Modeling, Thermofluids, Computational fluid dynamics, Temperature

Journal Articles

Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations

Elham Maghsoudi, Michael James Martin

J. Electron. Packag. June 2013, 135(2): 021011.

Paper No: EP-12-1075

DOI: https://doi.org/10.1115/1.4024012

Published Online: April 12, 2013

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Topics: Heat, Heating, Switches, Displacement, Simulation, Steady state, Bridges (Structures), Boundary-value problems

Journal Articles

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

D. N. Borza, I. T. Nistea

J. Electron. Packag. December 2012, 134(4): 041007.

DOI: https://doi.org/10.1115/1.4007812

Published Online: November 26, 2012

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Topics: Deformation, Failure, Printed circuit board assemblies, Screws, Stress, Vibration, Solder joints, Interferometry, Displacement, Boundary-value problems

Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl

J. Electron. Packag. December 2011, 133(4): 041004.

DOI: https://doi.org/10.1115/1.4005289

Published Online: December 9, 2011

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Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling

Journal Articles

Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

Valentin Bissuel, Michel Brizoux, Arnaud Grivon, Eric Monier-Vinard, Fabrice Pires

J. Electron. Packag. September 2011, 133(3): 031013.

DOI: https://doi.org/10.1115/1.4004830

Published Online: September 30, 2011

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Topics: Boundary-value problems, Cooling, Density, Design, Genetic algorithms, Heat, Junctions, Modeling, Printed circuit boards, Temperature

Journal Articles

Simplified Thermal Model of a Stacked Ball Grid Array Package

Luigi P. M. Colombo, Alexey Petrushin, Davide Paleari

J. Electron. Packag. June 2011, 133(2): 021006.

DOI: https://doi.org/10.1115/1.4003991

Published Online: June 23, 2011

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Topics: Ball-Grid-Array packages, Solders, Temperature, Thermal resistance, Ball-Grid-Array packaging, Heat, Errors, Boundary-value problems, Junctions

Journal Articles

Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel

Zhanyu Sun, Yogesh Jaluria

J. Electron. Packag. June 2011, 133(2): 021008.

DOI: https://doi.org/10.1115/1.4004218

Published Online: June 23, 2011

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Topics: Bronze, Gas flow, Heat flux, Heat transfer, Microchannels, Nitrogen, Slip flow, Temperature, Thermal conductivity, Silicon nitride ceramics

Journal Articles

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Arun Prakash Raghupathy, John Janssen, Attila Aranyosi, Urmila Ghia, Karman Ghia, William Maltz

J. Electron. Packag. March 2011, 133(1): 011003.

DOI: https://doi.org/10.1115/1.4003217

Published Online: March 3, 2011

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Topics: Boundary-value problems, Errors, Flow (Dynamics), Heat, Junctions, Natural convection, Temperature, Computational fluid dynamics, Optimization, Forced convection

Journal Articles

Compact Thermal Models: A Global Approach

Mohamed-Nabil Sabry, Hossam Saleh Abdelmeguid

J. Electron. Packag. December 2008, 130(4): 041107.

DOI: https://doi.org/10.1115/1.2993132

Published Online: November 14, 2008

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Topics: Boundary-value problems, Cooling, Heat, Reliability, Temperature, Thermal analysis, Heat flux, Modeling, Resistors, Heat transfer

Journal Articles

Board Level Drop Test Analysis Based on Modal Test and Simulation

Fang Liu, Guang Meng, Mei Zhao, Junfeng Zhao

J. Electron. Packag. June 2008, 130(2): 021007.

DOI: https://doi.org/10.1115/1.2912212

Published Online: May 8, 2008

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Topics: Elastic moduli, Simulation, Printed circuit board assemblies, Damping, Design, Boundary-value problems

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Journal citation

NARROW

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Evaluation of Bending Strength of Window Glass Substrate With Considerations of Uni- and Bi-Axial Loading and Free Edge Stresses

Reduced Order Modeling of Transient Heat Transfer in Microchip Interconnects

Optimal Shock Pulse in a Drop Test Simulation of Standardized Board for Uniform Shock Response

Modeling Thermal Microspreading Resistance in Via Arrays

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Analysis of ZnO Thin Film as Thermal Interface Material for High Power Light Emitting Diode Application

Thermal Resistance Analysis of High Power Light Emitting Diode Using Aluminum Nitride Thin Film-Coated Copper Substrates as Heat Sink

A Compact Modeling Approach to Enhance Collaborative Design of Thermal-Fluid Systems

Thermally Actuated Microswitches: Computation of Power Requirements for Alternate Heating Configurations

Experimental Investigation by Speckle Interferometry of Solder Joint Failure Under Thermomechanical Load Aggravated by Boundary Conditions at Board Level

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

Simplified Thermal Model of a Stacked Ball Grid Array Package

Conjugate Thermal Transport in Gas Flow in Long Rectangular Microchannel

Development of Delphi-Type Compact Thermal Models for Opto-Electronic Packages

Compact Thermal Models: A Global Approach

Board Level Drop Test Analysis Based on Modal Test and Simulation

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