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Journal Articles

Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter

Enzo M. Minazzo, Gautier Rouaze, Jackson B. Marcinichen, John R. Thome, Fred Buining
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041105.
Paper No: EP-24-1033
https://doi.org/10.1115/1.4065863
Published Online: July 25, 2024
View Article titled, Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter
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Topics: Condensers (steam plant), Cooling systems, Fluids, Heat, Secondary cells, Stress, Temperature, Thermal resistance, Pipeline risers, Risers (Casting)
Journal Articles

Characterization of a Rack-Level Thermosyphon-Based Cooling System

R. Khalid, S. G. Schon, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031007.
Paper No: EP-23-1068
https://doi.org/10.1115/1.4064524
Published Online: March 11, 2024
View Article titled, Characterization of a Rack-Level Thermosyphon-Based Cooling System
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Topics: Condensers (steam plant), Cooling, Cooling systems, Data centers, Fluids, Heat, Heat recovery, Refrigerants, Stress, Temperature
Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021110.
Paper No: EP-21-1048
https://doi.org/10.1115/1.4052767
Published Online: November 22, 2021
View Article titled, Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers
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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities
Journal Articles

Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling

Filippo Cataldo, Yuri Carmelo Crea
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041110.
Paper No: EP-21-1094
https://doi.org/10.1115/1.4052670
Published Online: November 5, 2021
View Article titled, Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling
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Topics: Condensers (steam plant), Heat, Stress, Flow (Dynamics), Temperature, Fluids, Modeling
Journal Articles

Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems

Steven A. Isaacs, Caelan Lapointe, Peter E. Hamlington
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2021, 143(1): 011010.
Paper No: EP-19-1130
https://doi.org/10.1115/1.4047576
Published Online: July 10, 2020
View Article titled, Development and Application of a Thin Flat Heat Pipe Design Optimization Tool for Small Satellite Systems
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Topics: Design, Heat pipes, Optimization, Vapors, Flat heat pipes, Temperature, Condensers (steam plant), Computational fluid dynamics, Heat, Satellites
Journal Articles

Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a

Filippo Cataldo, John Richard Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 021002.
Paper No: EP-17-1125
https://doi.org/10.1115/1.4039706
Published Online: May 9, 2018
View Article titled, Experimental Performance of a Completely Passive Thermosyphon Cooling System Rejecting Heat by Natural Convection Using the Working Fluids R1234ze, R1234yf, and R134a
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Topics: Flow (Dynamics), Fluids, Heat, Refrigerants, Condensers (steam plant), Stress, Cooling systems, Temperature, Design, Natural convection
Journal Articles

Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis

Nicolas Lamaison, Raffaele L. Amalfi, Todd Salamon, Jackson B. Marcinichen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2018, 140(1): 010901.
Paper No: EP-17-1085
https://doi.org/10.1115/1.4039091
Published Online: March 2, 2018
View Article titled, Role of a Liquid Accumulator in a Passive Two-Phase Liquid Cooling System for Electronics: Experimental Analysis
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Topics: Condensers (steam plant), Flow (Dynamics), Heat, Secondary cells, Stress, Temperature, Subcooling, Cooling systems, Refrigerants, Electronics
Journal Articles

Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling

Pablo A. de Oliveira, Jader R. Barbosa, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031005.
Paper No: EP-17-1008
https://doi.org/10.1115/1.4036817
Published Online: June 28, 2017
View Article titled, Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling
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Topics: Compressors, Cooling, Heat, Heat sinks, Heat transfer, Refrigeration, Stress, Temperature, Flow (Dynamics), Refrigerants
Journal Articles

Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology

Li-Anne Liew, Ching-Yi Lin, Ryan Lewis, Susan Song, Qian Li, Ronggui Yang, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011003.
Paper No: EP-16-1103
https://doi.org/10.1115/1.4035241
Published Online: December 7, 2016
View Article titled, Flexible Thermal Ground Planes Fabricated With Printed Circuit Board Technology
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Topics: Copper, Heat, Manufacturing, Printed circuit boards, Vapors, Water, Nylon fabrics, Condensers (steam plant), Thermal resistance
Journal Articles

A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection

Gaurav Patankar, Simone Mancin, Justin A. Weibel, Suresh V. Garimella, Mark A. MacDonald
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010903.
Paper No: EP-15-1083
https://doi.org/10.1115/1.4032345
Published Online: March 10, 2016
View Article titled, A Method for Thermal Performance Characterization of Ultrathin Vapor Chambers Cooled by Natural Convection
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Topics: Calibration, Condensers (steam plant), Copper, Flat heat pipes, Heat, Heat losses, Natural convection, Temperature, Thermal resistance, Vapors
Journal Articles

Promising Technology for Electronic Cooling: Nanofluidic Micro Pulsating Heat Pipes

Kambiz Jahani, Maziar Mohammadi, Mohammad Behshad Shafii, Zahra Shiee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021005.
Paper No: EP-12-1070
https://doi.org/10.1115/1.4023847
Published Online: March 28, 2013
View Article titled, Promising Technology for Electronic Cooling: Nanofluidic Micro Pulsating Heat Pipes
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Topics: Computer cooling, Ferrofluids, Fluids, Heat pipes, Heating, Magnetic fields, Nanofluids, Thermal resistance, Water, Heat transfer
Journal Articles

An Investigation of Flat-Plate Oscillating Heat Pipes

Peng Cheng, Scott Thompson, Joe Boswell, H. B. Ma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041009.
https://doi.org/10.1115/1.4002726
Published Online: November 24, 2010
View Article titled, An Investigation of Flat-Plate Oscillating Heat Pipes
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Topics: Diamonds, Flat plates, Fluids, Heat pipes, Heat transfer, Nanofluids, Temperature, Thermal resistance, Water, Operating temperature
Journal Articles

An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration

Victor Chiriac, Florea Chiriac
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041103.
https://doi.org/10.1115/1.2993148
Published Online: November 13, 2008
View Article titled, An Alternative Method for the Cooling of Power Microelectronics Using Classical Refrigeration
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Topics: Compressors, Condensers (steam plant), Cooling, Design, Microchannels, Refrigerants, Refrigeration, Vapors, Compression, Microelectronic devices
Journal Articles

An Experimental Investigation of a High Flux Heat Pipe Heat Sink

H. B. Ma, K. P. Lofgreen, G. P. Peterson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2006, 128(1): 18–22.
https://doi.org/10.1115/1.2159004
Published Online: May 10, 2005
View Article titled, An Experimental Investigation of a High Flux Heat Pipe Heat Sink
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Topics: Air flow, Condensers (steam plant), Design, Heat, Heat pipes, Heat sinks, Heat transfer, Temperature, Particulate matter, Evaporation
Journal Articles

Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components

Hiroshi Honda, ZhengGuo Zhang, Nobuo Takata
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 317–324.
https://doi.org/10.1115/1.1772412
Published Online: October 6, 2004
View Article titled, Flow and Heat Transfer Characteristics of a Natural Circulation Evaporative Cooling System for Electronic Components
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Topics: Boiling, Critical heat flux, Electronic components, Flow (Dynamics), Heat transfer, Pool boiling, Ducts, Condensers (steam plant), Heat flux, Cooling
Journal Articles

Performance of Graphite Foam Evaporator for Use in Thermal Management

Johnathan S. Coursey, Jungho Kim, Paul J. Boudreaux
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 127–134.
https://doi.org/10.1115/1.1871193
Published Online: June 1, 2004
View Article titled, Performance of Graphite Foam Evaporator for Use in Thermal Management
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Topics: Boiling, Copper, Density, Graphite, Temperature, Thermal management, Heat transfer, Condensers (steam plant), Fluids, Thermal conductivity
Journal Articles

Advanced Heat Exchange Technology for Thermoelectric Cooling Devices

R. L. Webb, M. D. Gilley, V. Zarnescu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 98–105.
https://doi.org/10.1115/1.2792292
Published Online: March 1, 1998
View Article titled, Advanced Heat Exchange Technology for Thermoelectric Cooling Devices
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Topics: Heat, Thermoelectric cooling, Thermoelectric coolers, Heat exchangers, Condensers (steam plant), Design, Electronic components, Temperature, Thermal resistance
Journal Articles

Investigation of a Heat Pipe Array for Convective Cooling

A. H. Howard, G. P. Peterson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 208–214.
https://doi.org/10.1115/1.2792093
Published Online: September 1, 1995
View Article titled, Investigation of a Heat Pipe Array for Convective Cooling
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Topics: Cooling, Heat pipes, Heat, Copper, Electrical measurement, Fins, Flow (Dynamics), Pressure drop, Thermal resistance, Water
Journal Articles

Heat Pipes for Cooling High Flux/High Power Semiconductor Chips

M. T. North, C. T. Avedisian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1993, 115(1): 112–117.
https://doi.org/10.1115/1.2909290
Published Online: March 1, 1993
View Article titled, Heat Pipes for Cooling High Flux/High Power Semiconductor Chips
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Topics: Cooling, Heat pipes, Power semiconductor devices, Heat, Condensers (steam plant), Flux (Metallurgy), Temperature, Water, Copper powders, Design