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Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041105.
Paper No: EP-23-1012
https://doi.org/10.1115/1.4063541
Published Online: November 1, 2023
View Article titled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
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Topics: Aerosols, Failure, Failure mechanisms, Modeling, Reliability, Silver, Temperature, Testing, Circuits, Printing
Journal Articles

A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules

Feifei Yan, Laili Wang, Yongmei Gan, Kaixuan Li, Boya Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031016.
Paper No: EP-21-1168
https://doi.org/10.1115/1.4053891
Published Online: March 11, 2022
View Article titled, A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules
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Topics: Ceramics, Electric fields, Electrodes, Silicones, Insulation
Journal Articles

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nathaniel J. O'Connor, Alexander J. Castaneda, Pavolas N. Christidis, Nicolas Vayas Tobar, Michal Talmor, Jamal Yagoobi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041105.
Paper No: EP-20-1021
https://doi.org/10.1115/1.4047459
Published Online: June 23, 2020
View Article titled, Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling
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Topics: Computer cooling, Electrohydrodynamics, Flow (Dynamics), Fluids, Heat conduction, Pumps, Electrodes, Design, Electric fields
Journal Articles

Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region

Tie Li, Guan-Long Cao, Hong-Juan Xie, Jing-Qin Wang, Zi-Hui Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031108.
Paper No: EP-19-1132
https://doi.org/10.1115/1.4046934
Published Online: May 4, 2020
View Article titled, Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region
Open the PDF for Systematical and Numerical Investigations on InGaN-Based Green Light-Emitting Diodes: Si-Doped Quantum Barriers, Engineered p-Electron Blocking Layer and AlGaN/GaN Structured p-Type Region in another window
Topics: Electric fields, Electrons, Gallium nitride, Indium gallium nitride, Light-emitting diodes, Polarization (Electricity), Polarization (Light), Polarization (Waves), Quantum wells, Leakage
Journal Articles

Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations

M. Baris Dogruoz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2016, 138(2): 021004.
Paper No: EP-16-1035
https://doi.org/10.1115/1.4033109
Published Online: April 19, 2016
View Article titled, Assessment of Joule Heating and Temperature Distribution on Printed Circuit Boards Via Electrothermal Simulations
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Topics: Electric fields, Heating, Joules, Printed circuit boards, Simulation, Temperature, Temperature distribution, Thermal conductivity, Engineering simulation
Journal Articles

Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process

Wei Qin, Ira M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 212–219.
https://doi.org/10.1115/1.2905688
Published Online: September 1, 1994
View Article titled, Fixed Wand Electronic Flame-Off for Ball Formation in the Wire Bonding Process
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Topics: Flames, Wire bonding, Wire, Electrodes, Design, Computation, Computer simulation, Cycles, Deflection, Electric fields
Journal Articles

Heat Transfer in Wire Bonding Process

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 44–48.
https://doi.org/10.1115/1.2905492
Published Online: March 1, 1994
View Article titled, Heat Transfer in Wire Bonding Process
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Topics: Heat transfer, Wire bonding, Electrodes, Wire, Electric discharge, Electric fields, Electric potential, Engineering simulation, Flux (Metallurgy), Heat