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Journal Articles

Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics

Margie Guerrero-Fernandez, Pedro Quintero, Ozan Cagatay Ozdemir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041107.
Paper No: EP-24-1022
https://doi.org/10.1115/1.4065943
Published Online: July 26, 2024
View Article titled, Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics
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Topics: Coating processes, Coatings, Copper, Plasma spraying, Spraying (Coating processes), Sprays, Surface roughness, Ceramics, Electronics, Experimental design
Journal Articles

Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications

Amit Kumar, Ayan Majumder, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021008.
Paper No: EP-23-1043
https://doi.org/10.1115/1.4063917
Published Online: December 11, 2023
View Article titled, Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications
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Topics: Acoustics, Blades, Experimental design, Flow (Dynamics), Noise (Sound), Pressure, Rotors, Optimization, Geometry
Includes: Supplementary data
Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
https://doi.org/10.1115/1.4056992
Published Online: March 8, 2023
View Article titled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure
Journal Articles

A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort

Weicheng Shu, Jiawen Wang, Xinfeng Zhang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041106.
Paper No: EP-19-1106
https://doi.org/10.1115/1.4047470
Published Online: June 26, 2020
View Article titled, A Statistical Study to Evaluate the Performance of Liquid Cooling Garments Considering Thermal Comfort
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Topics: Cooling, Experimental design, Ice, Temperature, Heat
Journal Articles

Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies

Rajiv L. Iyer, Daryl L. Santos
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031009.
Paper No: EP-17-1012
https://doi.org/10.1115/1.4037144
Published Online: July 14, 2017
View Article titled, Experimental Analysis of a Novel Piezoelectric Jetting System for Micrograms Deposition in Electronic Assemblies
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Topics: Adhesives, Drops, Nozzles, Pistons, Experimental design, Manufacturing, Experimental analysis, Fluids
Journal Articles

Design Optimization and Reliability of PWB Level Electronic Package

Mohammad Masum Hossain, Sudhakar G. Jagarkal, Dereje Agonafer, Menberu Lulu, Stefan Reh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 9–18.
https://doi.org/10.1115/1.2429704
Published Online: September 21, 2006
View Article titled, Design Optimization and Reliability of PWB Level Electronic Package
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Topics: Design, Optimization, Solder joints, Response surface methodology, Solders, Printed circuit boards, Reliability, Fatigue life, Finite element analysis, Experimental design
Journal Articles

Electrically Conductive Adhesive Formulations for SMT Applications

Ryszard Kisiel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 367–370.
https://doi.org/10.1115/1.1497628
Published Online: December 12, 2002
View Article titled, Electrically Conductive Adhesive Formulations for SMT Applications
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Topics: Adhesive joints, Adhesives, Mechanical properties, Resins, Fillers (Materials), Experimental design, Adhesion, Finishing
Journal Articles

OMPAC Package C5 Reliability—Parametric Study

B. Nagaraj
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 18–22.
https://doi.org/10.1115/1.2792655
Published Online: March 1, 1999
View Article titled, OMPAC Package C5 Reliability—Parametric Study
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Topics: Reliability, Cycles, Design, Solders, Failure, Temperature, Ball-Grid-Array packaging, Simulation, Computers, Creep
Journal Articles

Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components

Sidharth, D. B. Barker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 244–249.
https://doi.org/10.1115/1.2792159
Published Online: December 1, 1996
View Article titled, Vibration Induced Fatigue Life Estimation of Corner Leads of Peripheral Leaded Components
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Topics: Corners (Structural elements), Fatigue life, Vibration, Stress, Displacement, Finite element analysis, Avionics, Boundary-value problems, Electronic packages, Electronic packaging
Journal Articles

Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach

Scott Anson, C. Sahay, Linda Head, James Constable
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1996, 118(2): 94–100.
https://doi.org/10.1115/1.2792138
Published Online: June 1, 1996
View Article titled, Determination of Parameters Affecting Solder Paste Tack Strength as Measured in the IPC Tack Test: A Classical Design of Experiments Approach
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Topics: Experimental design, Solders, Probes, Printed circuit boards, Adhesion, Circuits, Drying, Electronics, Ovens, Pressure
Journal Articles

Modeling Solder Joint Fatigue Life for Gullwing Leaded Packages: Part I—Elastic Plastic Stress Model

V. K. Gupta, D. B. Barker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 123–129.
https://doi.org/10.1115/1.2792078
Published Online: June 1, 1995
View Article titled, Modeling Solder Joint Fatigue Life for Gullwing Leaded Packages: Part I—Elastic Plastic Stress Model
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Topics: Fatigue life, Modeling, Solder joints, Stress, Finite element analysis, Simulation, Electronics, Experimental design, Finite element methods, Materials properties
Journal Articles

A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals

Barry Mathieu, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 98–104.
https://doi.org/10.1115/1.2905512
Published Online: June 1, 1994
View Article titled, A Fractional-Factorial Numerical Technique for Stress Analysis of Glass-To-Metal Lead Seals
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Topics: Glass, Metals, Stress analysis (Engineering), Stress, Design, Experimental design, Fracture (Materials), Fracture (Process), Geometry, Simulation
Journal Articles

Quantitative Solder Wetting Measurement for DCA Assembly

Cynthia M. Melton, Carl J. Raleigh, Susan M. Yarling
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 1992, 114(4): 476–479.
https://doi.org/10.1115/1.2905485
Published Online: December 1, 1992
View Article titled, Quantitative Solder Wetting Measurement for DCA Assembly
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Topics: Manufacturing, Solders, Wetting, Alloys, Experimental design, Nitrogen