Topics: Aerosols, Artificial intelligence, Cloud computing, Cooling, Cycles, Density, Electric vehicles, Electronic packaging, Electronics, Energy conversion

Topics: Additive manufacturing, Cooling, Electronics, Fluids, Heat transfer, Jets, Nozzles, Pressure, Reynolds number, Simulation

Topics: Cooling, Cooling systems, Design, Impingement cooling, Light-emitting diodes, Optimization, Temperature, Numerical analysis, Flow (Dynamics), Pressure

Topics: Flow (Dynamics), Flow separation, Flow visualization, Jets, Nozzles, Pressure, Fins, Temperature, Impingement cooling, Reynolds number

Topics: Flat plates, Flow (Dynamics), Flow visualization, Nozzles, Pressure, Liquid crystals, Temperature distribution, Fins, Jets, Testing

Topics: Cooling, Heat sinks, Optimization, Pins (Engineering), Pressure drop, Thermal resistance, Impingement cooling, Flow (Dynamics), Fins, Flow visualization

Topics: Electronic packages, Heat sinks, Impingement cooling, Optimization, Computational fluid dynamics, Design, Cooling, Dimensions, Electronic components, Engineering simulation

Topics: Design, Electronic components, Impingement cooling, Thermofluids

Topics: Heat, Impingement cooling, Reynolds number, Boundary layers, Heat transfer, Heat transfer coefficients, Heating, Manifolds, Multi-chip modules, Nozzles

Topics: Heat flux, Impingement cooling, Temperature, Water, Cooling, Energy dissipation, Heat transfer, Heat transfer coefficients, Reynolds number, Thermal resistance