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Journal Articles

Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Announcements
J. Electron. Packag. December 2021, 143(4): 048001.
Paper No: EP-21-1128
https://doi.org/10.1115/1.4052403
Published Online: October 1, 2021
View Article titled, Please Join the ASME Community and the Bar-Cohen Family to Support the Establishment of the ASME Avram Bar-Cohen Memorial Medal
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Topics: Electronics, Engineers, Leadership, Mentoring, Packaging, Photonics
Journal Articles

Letter From the Editors

Bahgat G. Sammakia, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. September 2014, 136(3): 030201.
Paper No: EP-14-1067
https://doi.org/10.1115/1.4028063
Published Online: July 24, 2014
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Topics: Actuators, Biomedicine, Computers, Data centers, Design, Electronic packaging, Electronics, Energy / power systems, Engineering teachers, Feedback
Journal Articles

Foreword

Bahgat Sammakia, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. December 2004, 126(4): 409.
https://doi.org/10.1115/1.1827273
Published Online: January 24, 2005
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Topics: Heat sinks, Packaging, Thermal engineering, Thermal management, Cooling, Computer cooling, Computers, Inventions, Design, Heat transfer