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Machine learning
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Journal Articles
Accepted Manuscript
Jewoo Park, Nhi Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
Journal:
Journal of Electronic Packaging
Article Type: Technical Briefs
Publisher: ASME
J. Electron. Packag.
Paper No: EP-23-1039
Published Online: September 23, 2023
Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011108.
Paper No: EP-22-1030
Published Online: December 23, 2022
Journal Articles
Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041109.
Paper No: EP-21-1087
Published Online: November 5, 2021
Topics:
Algorithms,
Artificial neural networks,
Bridges (Structures),
Cooling,
Heat sinks,
Junctions,
Machine learning,
Machinery,
Simulation,
Steady state
Includes: Supplementary data