1-20 of 26
Microelectromechanical systems
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Article titled, Special Section on InterPACK2021
Open the PDF for Special Section on InterPACK2021 in another window
Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011005.
Paper No: EP-20-1097
https://doi.org/10.1115/1.4049813
Published Online: August 6, 2021
View Article titled, Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals
Open the PDF for Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals in another window
Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering
Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. September 2020, 142(3): 030301.
Paper No: EP-20-1092
https://doi.org/10.1115/1.4048039
Published Online: August 14, 2020
View Article titled, Special Issue on InterPACK 2019 – Part 1
Open the PDF for Special Issue on InterPACK 2019 – Part 1 in another window
Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers
Journal Articles

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Chia-Cheng Chang, Kuo-Ning Chiang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011005.
Paper No: EP-19-1027
https://doi.org/10.1115/1.4044278
Published Online: September 19, 2019
View Article titled, Empirical High Cycle Fatigue Assessment Model of MEMS Devices
Open the PDF for Empirical High Cycle Fatigue Assessment Model of MEMS Devices in another window
Topics: Design, Fatigue life, High cycle fatigue, Microelectromechanical systems, Silicon-on-insulator, Simulation, Stress, Torsion, Cycles, Damage
Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. September 2019, 141(3): 030301.
Paper No: EP-19-1036
https://doi.org/10.1115/1.4043484
Published Online: May 8, 2019
View Article titled, Special Issue on InterPACK 2018
Open the PDF for Special Issue on InterPACK 2018 in another window
Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers
Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
https://doi.org/10.1115/1.4040978
Published Online: September 10, 2018
View Article titled, Reactive Joining of Thermally and Mechanically Sensitive Materials
Open the PDF for Reactive Joining of Thermally and Mechanically Sensitive Materials in another window
Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock
Journal Articles

Special Section on InterPACK 2017—Part 2

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
https://doi.org/10.1115/1.4039963
Published Online: May 9, 2018
View Article titled, Special Section on InterPACK 2017—Part 2
Open the PDF for Special Section on InterPACK 2017—Part 2 in another window
Topics: Batteries, Density, Electronic packaging, Microelectromechanical systems, Optoelectronic devices, Packaging, Semiconductor wafers, Sensors, Reliability
Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Jingshi Meng, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
https://doi.org/10.1115/1.4036187
Published Online: June 14, 2017
View Article titled, Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components
Open the PDF for Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components in another window
Topics: Failure, Failure mechanisms, Microelectromechanical systems, Printed circuit boards, Stress, Resonance, Clearances (Engineering), Vibration, Finite element analysis, Electrical wires
Journal Articles

Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications

Erdal Uzunlar, Paul A. Kohl
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2015, 137(4): 041001.
Paper No: EP-14-1114
https://doi.org/10.1115/1.4030952
Published Online: July 23, 2015
View Article titled, Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications
Open the PDF for Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications in another window
Topics: MEMS packaging, Microelectromechanical systems, Polymers, Temperature, Semiconductor wafers, Reactive-ion etching, Nuclear magnetic resonance, Hardening (Curing)
Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
https://doi.org/10.1115/1.4028890
Published Online: November 14, 2014
View Article titled, Two-Phase Thermal Ground Planes: Technology Development and Parametric Results
Open the PDF for Two-Phase Thermal Ground Planes: Technology Development and Parametric Results in another window
Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
Open the PDF for Special Section on InterPACK 2013 in another window
Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Special Issue on Thermodynamics, Flow, and Heat Transfer in MEMS

Journal: Journal of Electronic Packaging
Article Type: Editorial
J. Electron. Packag. June 2014, 136(2): 020301.
Paper No: EP-14-1048
https://doi.org/10.1115/1.4027498
Published Online: April 30, 2014
View Article titled, Special Issue on Thermodynamics, Flow, and Heat Transfer in MEMS
Open the PDF for Special Issue on Thermodynamics, Flow, and Heat Transfer in MEMS in another window
Topics: Flow (Dynamics), Heat transfer, Microelectromechanical systems, Thermodynamics
Journal Articles

Advances in the Fabrication Processes and Applications of Wafer Level Packaging

Peisheng Liu, Jinlan Wang, Liangyu Tong, Yujuan Tao
Journal: Journal of Electronic Packaging
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024002.
Paper No: EP-14-1006
https://doi.org/10.1115/1.4027397
Published Online: April 29, 2014
View Article titled, Advances in the Fabrication Processes and Applications of Wafer Level Packaging
Open the PDF for Advances in the Fabrication Processes and Applications of Wafer Level Packaging in another window
Topics: Manufacturing, Packaging, Reliability, Semiconductor wafers, Microelectromechanical systems, Solders, Solder joints, Copper, Polymers
Journal Articles

Vacuum Packaging of MEMS by Self-Assembly

Royi Naveh, Eyal Zussman
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021003.
https://doi.org/10.1115/1.4006138
Published Online: June 11, 2012
View Article titled, Vacuum Packaging of MEMS by Self-Assembly
Open the PDF for Vacuum Packaging of MEMS by Self-Assembly in another window
Topics: Cavities, Self-assembly, Solders, Vacuum, Sealing (Process), Manufacturing, Stability, Surface tension, Microelectromechanical systems, Shear (Mechanics)
Journal Articles

The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions

N. H. Chao, J. A. Cordes, D. Carlucci, M. E. DeAngelis, Jyeching Lee
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041003.
https://doi.org/10.1115/1.4005375
Published Online: December 8, 2011
View Article titled, The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions
Open the PDF for The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions in another window
Topics: Munitions, Simulation, Temperature, Thermal stresses, Transients (Dynamics), Electronic packaging, Microelectromechanical systems
Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Article Type: Editorial
J. Electron. Packag. December 2008, 130(4): 040201.
https://doi.org/10.1115/1.3039759
Published Online: November 17, 2008
View Article titled, Editorial
Open the PDF for Editorial in another window
Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells
Journal Articles

Design for Reliability Applied to Packaging of a MOEMS Switch

Abiodun A. Fasoro, Manoj Mittal, Dan O. Popa, Dereje A. Agonafer, Harry E. Stephanou
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041003.
https://doi.org/10.1115/1.2993142
Published Online: November 17, 2008
View Article titled, Design for Reliability Applied to Packaging of a MOEMS Switch
Open the PDF for Design for Reliability Applied to Packaging of a MOEMS Switch in another window
Topics: Design, Fibers, Microelectromechanical systems, Microoptoelectromechanical systems, Packaging, Reliability, Sealing (Process), Switches, Shear (Mechanics), Solders
Journal Articles

An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads

Fadi Alsaleem, Mohammad I. Younis, Ronald Miles
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031002.
https://doi.org/10.1115/1.2957319
Published Online: July 29, 2008
View Article titled, An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads
Open the PDF for An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads in another window
Topics: Microelectromechanical systems, Shock (Mechanics), Stress, Manufacturing, Diaphragms (Mechanical devices), Diaphragms (Structural)
Journal Articles

An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems

Kazuyoshi Fushinobu, Masashi Nakata
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 141–146.
https://doi.org/10.1115/1.1869511
Published Online: August 9, 2004
View Article titled, An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems
Open the PDF for An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems in another window
Topics: Electroosmosis, Flow (Dynamics), Manufacturing, Microchannels, Microelectromechanical systems, Microfluidics
Journal Articles

Investigation of Flip-Chip Bonding for MEMS Applications

W. Salalha, E. Zussman, P. Z. Bar-Yoseph
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 48–51.
https://doi.org/10.1115/1.1646427
Published Online: April 30, 2004
View Article titled, Investigation of Flip-Chip Bonding for MEMS Applications
Open the PDF for Investigation of Flip-Chip Bonding for MEMS Applications in another window
Topics: Bonding, Finite element analysis, Flip-chip, Microelectromechanical systems, Solder joints, Solders, Shapes