Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 26

Sort by

Sort Order Select

Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey

J. Electron. Packag. March 2023, 145(1): 010301.

Paper No: EP-22-1094

DOI: https://doi.org/10.1115/1.4056558

Published Online: January 11, 2023

View Article

Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices

Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu

J. Electron. Packag. March 2022, 144(1): 011005.

Paper No: EP-20-1097

DOI: https://doi.org/10.1115/1.4049813

Published Online: August 6, 2021

View Article

Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering

Journal Articles

Special Issue on InterPACK 2019 – Part 1

Sreekant Narumanchi, Sukwon Choi, Saket Karajgikar, Haiding Sun, Guangsheng Zhang

J. Electron. Packag. September 2020, 142(3): 030301.

Paper No: EP-20-1092

DOI: https://doi.org/10.1115/1.4048039

Published Online: August 14, 2020

View Article

Topics: Cloud computing, Electric vehicles, Electronic packaging, Electronics, Energy conversion, Engineering teachers, Feedback, Internet of things, Manufacturing, Mechanical engineers

Journal Articles

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Chia-Cheng Chang, Kuo-Ning Chiang

J. Electron. Packag. March 2020, 142(1): 011005.

Paper No: EP-19-1027

DOI: https://doi.org/10.1115/1.4044278

Published Online: September 19, 2019

View Article

Topics: Design, Fatigue life, High cycle fatigue, Microelectromechanical systems, Silicon-on-insulator, Simulation, Stress, Torsion, Cycles, Damage

Journal Articles

Special Issue on InterPACK 2018

Ercan M. Dede, Lauren Boteler, Changqing Chen, Przemyslaw Jakub Gromala, Benjamin Leever, Wei Li

J. Electron. Packag. September 2019, 141(3): 030301.

Paper No: EP-19-1036

DOI: https://doi.org/10.1115/1.4043484

Published Online: May 8, 2019

View Article

Topics: Electronic packaging, Electronics, Microelectromechanical systems, Design, Internet of things, Condition monitoring, Data centers, Electric vehicles, Energy conversion, Engineering teachers

Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch

J. Electron. Packag. December 2018, 140(4): 041006.

Paper No: EP-18-1016

DOI: https://doi.org/10.1115/1.4040978

Published Online: September 10, 2018

View Article

Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock

Journal Articles

Special Section on InterPACK 2017—Part 2

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani

J. Electron. Packag. June 2018, 140(2): 020301.

Paper No: EP-18-1012

DOI: https://doi.org/10.1115/1.4039963

Published Online: May 9, 2018

View Article

Topics: Batteries, Density, Electronic packaging, Microelectromechanical systems, Optoelectronic devices, Packaging, Semiconductor wafers, Sensors, Reliability

Journal Articles

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Jingshi Meng, Abhijit Dasgupta

J. Electron. Packag. September 2017, 139(3): 031001.

Paper No: EP-15-1102

DOI: https://doi.org/10.1115/1.4036187

Published Online: June 14, 2017

View Article

Topics: Failure, Failure mechanisms, Microelectromechanical systems, Printed circuit boards, Stress, Resonance, Clearances (Engineering), Vibration, Finite element analysis, Electrical wires

Journal Articles

Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications

Erdal Uzunlar, Paul A. Kohl

J. Electron. Packag. December 2015, 137(4): 041001.

Paper No: EP-14-1114

DOI: https://doi.org/10.1115/1.4030952

Published Online: July 23, 2015

View Article

Topics: MEMS packaging, Microelectromechanical systems, Polymers, Temperature, Semiconductor wafers, Reactive-ion etching, Nuclear magnetic resonance, Hardening (Curing)

Journal Articles

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Avram Bar-Cohen, Kaiser Matin, Nicholas Jankowski, Darin Sharar

J. Electron. Packag. March 2015, 137(1): 010801.

Paper No: EP-14-1069

DOI: https://doi.org/10.1115/1.4028890

Published Online: November 14, 2014

View Article

Topics: Cooling, Copper, Flat heat pipes, Fluids, Heat, Heat pipes, Silicon, Stress, Teams, Thermal conductivity

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

View Article

Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

Special Issue on Thermodynamics, Flow, and Heat Transfer in MEMS

J. Electron. Packag. June 2014, 136(2): 020301.

Paper No: EP-14-1048

DOI: https://doi.org/10.1115/1.4027498

Published Online: April 30, 2014

View Article

Topics: Flow (Dynamics), Heat transfer, Microelectromechanical systems, Thermodynamics

Journal Articles

Advances in the Fabrication Processes and Applications of Wafer Level Packaging

Peisheng Liu, Jinlan Wang, Liangyu Tong, Yujuan Tao

J. Electron. Packag. June 2014, 136(2): 024002.

Paper No: EP-14-1006

DOI: https://doi.org/10.1115/1.4027397

Published Online: April 29, 2014

View Article

Topics: Manufacturing, Packaging, Reliability, Semiconductor wafers, Microelectromechanical systems, Solders, Solder joints, Copper, Polymers

Journal Articles

Vacuum Packaging of MEMS by Self-Assembly

Royi Naveh, Eyal Zussman

J. Electron. Packag. June 2012, 134(2): 021003.

DOI: https://doi.org/10.1115/1.4006138

Published Online: June 11, 2012

View Article

Topics: Cavities, Self-assembly, Solders, Vacuum, Sealing (Process), Manufacturing, Stability, Surface tension, Microelectromechanical systems, Shear (Mechanics)

Journal Articles

The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions

N. H. Chao, J. A. Cordes, D. Carlucci, M. E. DeAngelis, Jyeching Lee

J. Electron. Packag. December 2011, 133(4): 041003.

DOI: https://doi.org/10.1115/1.4005375

Published Online: December 8, 2011

View Article

Topics: Munitions, Simulation, Temperature, Thermal stresses, Transients (Dynamics), Electronic packaging, Microelectromechanical systems

Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry

J. Electron. Packag. December 2008, 130(4): 040201.

DOI: https://doi.org/10.1115/1.3039759

Published Online: November 17, 2008

View Article

Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells

Journal Articles

Design for Reliability Applied to Packaging of a MOEMS Switch

Abiodun A. Fasoro, Manoj Mittal, Dan O. Popa, Dereje A. Agonafer, Harry E. Stephanou

J. Electron. Packag. December 2008, 130(4): 041003.

DOI: https://doi.org/10.1115/1.2993142

Published Online: November 17, 2008

View Article

Topics: Design, Fibers, Microelectromechanical systems, Microoptoelectromechanical systems, Packaging, Reliability, Sealing (Process), Switches, Shear (Mechanics), Solders

Journal Articles

An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads

Fadi Alsaleem, Mohammad I. Younis, Ronald Miles

J. Electron. Packag. September 2008, 130(3): 031002.

DOI: https://doi.org/10.1115/1.2957319

Published Online: July 29, 2008

View Article

Topics: Microelectromechanical systems, Shock (Mechanics), Stress, Manufacturing, Diaphragms (Mechanical devices), Diaphragms (Structural)

Journal Articles

An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems

Kazuyoshi Fushinobu, Masashi Nakata

J. Electron. Packag. June 2005, 127(2): 141–146.

DOI: https://doi.org/10.1115/1.1869511

Published Online: August 9, 2004

View Article

Topics: Electroosmosis, Flow (Dynamics), Manufacturing, Microchannels, Microelectromechanical systems, Microfluidics

Journal Articles

Investigation of Flip-Chip Bonding for MEMS Applications

W. Salalha, E. Zussman, P. Z. Bar-Yoseph

J. Electron. Packag. March 2004, 126(1): 48–51.

DOI: https://doi.org/10.1115/1.1646427

Published Online: April 30, 2004

View Article

Topics: Bonding, Finite element analysis, Flip-chip, Microelectromechanical systems, Solder joints, Solders, Shapes

Journal citation

NARROW

Special Section on InterPACK2021

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Special Issue on InterPACK 2019 – Part 1

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Special Issue on InterPACK 2018

Reactive Joining of Thermally and Mechanically Sensitive Materials

Special Section on InterPACK 2017—Part 2

Influence of Secondary Impact on Printed Wiring Assemblies—Part II: Competing Failure Modes in Surface Mount Components

Size-Compatible, Polymer-Based Air-Gap Formation Processes, and Polymer Residue Analysis for Wafer-Level MEMS Packaging Applications

Two-Phase Thermal Ground Planes: Technology Development and Parametric Results

Special Section on InterPACK 2013

Special Issue on Thermodynamics, Flow, and Heat Transfer in MEMS

Advances in the Fabrication Processes and Applications of Wafer Level Packaging

Vacuum Packaging of MEMS by Self-Assembly

The Use of Potting Materials for Electronic-Packaging Survivability in Smart Munitions

Editorial

Design for Reliability Applied to Packaging of a MOEMS Switch

An Investigation Into the Effect of the PCB Motion on the Dynamic Response of MEMS Devices Under Mechanical Shock Loads

An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems

Investigation of Flip-Chip Bonding for MEMS Applications

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only