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Journal Articles

Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept

Hamoon Azizsoltani, Achintya Haldar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041003.
Paper No: EP-17-1047
https://doi.org/10.1115/1.4040924
Published Online: August 20, 2018
View Article titled, Reliability Analysis of Lead-Free Solders in Electronic Packaging Using a Novel Surrogate Model and Kriging Concept
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Topics: Failure, Finite element analysis, Modeling, Reliability, Solders, Thermomechanics, Lead-free solders, Electronic packaging, Uncertainty, Stress
Journal Articles

Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes

Sun-Min Kim, Kwang-Yong Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011010.
Paper No: EP-13-1054
https://doi.org/10.1115/1.4026536
Published Online: February 14, 2014
View Article titled, Optimization of a Hybrid Double-Side Jet Impingement Cooling System for High-Power Light Emitting Diodes
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Topics: Cooling, Cooling systems, Design, Impingement cooling, Light-emitting diodes, Optimization, Temperature, Numerical analysis, Flow (Dynamics), Pressure
Journal Articles

Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section

Afzal Husain, Kwang-Yong Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
https://doi.org/10.1115/1.3103931
Published Online: April 1, 2009
View Article titled, Thermal Optimization of a Microchannel Heat Sink With Trapezoidal Cross Section
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Topics: Design, Heat sinks, Microchannels, Optimization, Thermal resistance, Heat transfer, Response surface methodology, Shapes, Flow (Dynamics), Computer simulation
Journal Articles

Design Optimization and Reliability of PWB Level Electronic Package

Mohammad Masum Hossain, Sudhakar G. Jagarkal, Dereje Agonafer, Menberu Lulu, Stefan Reh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 9–18.
https://doi.org/10.1115/1.2429704
Published Online: September 21, 2006
View Article titled, Design Optimization and Reliability of PWB Level Electronic Package
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Topics: Design, Optimization, Solder joints, Response surface methodology, Solders, Printed circuit boards, Reliability, Fatigue life, Finite element analysis, Experimental design
Journal Articles

Design Optimization for Pin-Fin Heat Sinks

Han-Ting Chen, Po-Li Chen, Jenn-Tsong Horng, Ying-Huei Hung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 397–406.
https://doi.org/10.1115/1.2056572
Published Online: December 21, 2004
View Article titled, Design Optimization for Pin-Fin Heat Sinks
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Topics: Design, Heat sinks, Optimization, Thermal resistance, Pressure drop, Response surface methodology, Heat
Journal Articles

Development of G-Helix Structure as Off-Chip Interconnect

Qi Zhu, Lunyu Ma, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 237–246.
https://doi.org/10.1115/1.1756148
Published Online: July 8, 2004
View Article titled, Development of G-Helix Structure as Off-Chip Interconnect
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Topics: Design, Displacement, Geometry, Manufacturing, Optimization, Packaging, Reliability, Solders, Stress, Thermomechanics
Journal Articles

Response Surface Modeling for Nonlinear Packaging Stresses

W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, L. J. Ernst
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 490–497.
https://doi.org/10.1115/1.1604149
Published Online: December 15, 2003
View Article titled, Response Surface Modeling for Nonlinear Packaging Stresses
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Topics: Design, Finite element model, Packaging, Response surface methodology, Stress, Temperature, Optimization, Modeling, Solders, Testing
Journal Articles

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 118–122.
https://doi.org/10.1115/1.2792592
Published Online: June 1, 1998
View Article titled, CBGA Solder Fillet Shape Prediction and Design Optimization
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Topics: Design, Optimization, Shapes, Solders, Reliability, Fatigue life, Ball-Grid-Array packaging, Ceramics, Composite materials, Engineering simulation