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Journal Articles

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Alexis Krone, Josh Kasitz, David Huitink, Hannah Alpert, Debbie G. Senesky, Satish Shetty, Gregory Salamo

J. Electron. Packag. June 2022, 144(2): 021115.

Paper No: EP-21-1064

DOI: https://doi.org/10.1115/1.4053765

Published Online: March 7, 2022

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Topics: Gallium, Gallium nitride, Hall effect, High temperature, Sensors, Temperature, Alloys, Reliability

Journal Articles

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

Mei-Chien Lu

J. Electron. Packag. June 2022, 144(2): 020801.

Paper No: EP-21-1008

DOI: https://doi.org/10.1115/1.4052069

Published Online: September 24, 2021

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Topics: Sensors, Bonding, Electronics

Journal Articles

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Jimil M. Shah, Roshan Anand, Prabjit Singh, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Mike Kaler

J. Electron. Packag. December 2020, 142(4): 041103.

Paper No: EP-19-1096

DOI: https://doi.org/10.1115/1.4047469

Published Online: June 23, 2020

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Topics: Data centers, Dust, Leakage, Particulate matter, Sensors

Journal Articles

Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor Stacks

Meriem Akin, Jennifer Blackburn, Autumn Pratt, Andreas Dietzel

J. Electron. Packag. June 2020, 142(2): 021010.

Paper No: EP-19-1057

DOI: https://doi.org/10.1115/1.4046557

Published Online: April 6, 2020

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Topics: Chain, Joining, Sensors

Journal Articles

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Klas Brinkfeldt, Göran Wetter, Andreas Lövberg, Per-Erik Tegehall, Dag Andersson, Jan Strandberg, Johnny Goncalves, Jonas Söderlund, Mikael Kwarnmark

J. Electron. Packag. September 2019, 141(3): 031010.

Paper No: EP-18-1096

DOI: https://doi.org/10.1115/1.4043479

Published Online: May 24, 2019

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Topics: Sensors, Circuits, Impact testing, Vibration, Polarization (Electricity), Polarization (Light), Polarization (Waves), Reflow soldering

Journal Articles

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Sadegh Khalili, Husam Alissa, Kourosh Nemati, Mark Seymour, Robert Curtis, David Moss, Bahgat Sammakia

J. Electron. Packag. September 2019, 141(3): 031004.

Paper No: EP-18-1075

DOI: https://doi.org/10.1115/1.4042983

Published Online: April 10, 2019

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Topics: Air flow, Cooling, Data centers, Design, Exhaust systems, Fans, Leakage, Pressure, Sensors, Temperature

Journal Articles

Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture

Richard C. Jaeger, Jeffrey C. Suhling, Jun Chen

J. Electron. Packag. December 2018, 140(4): 044501.

Paper No: EP-18-1013

DOI: https://doi.org/10.1115/1.4040829

Published Online: August 3, 2018

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Topics: Sensors, Stress

Journal Articles

Fabrication of Multimeasurand Sensor for Monitoring of a Li-Ion Battery

Aaron Knobloch, Chris Kapusta, Jason Karp, Yuri Plotnikov, Jason B. Siegel, Anna G. Stefanopoulou

J. Electron. Packag. September 2018, 140(3): 031002.

Paper No: EP-17-1053

DOI: https://doi.org/10.1115/1.4039861

Published Online: May 11, 2018

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Topics: Sensors, Manufacturing, Batteries, Design, Temperature

Journal Articles

Special Section on InterPACK 2017—Part 2

Kaushik Mysore, Sreekant Narumanchi, Ercan Dede, Reza Khiabani

J. Electron. Packag. June 2018, 140(2): 020301.

Paper No: EP-18-1012

DOI: https://doi.org/10.1115/1.4039963

Published Online: May 9, 2018

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Topics: Batteries, Density, Electronic packaging, Microelectromechanical systems, Optoelectronic devices, Packaging, Semiconductor wafers, Sensors, Reliability

Journal Articles

Peel-and-Stick Sensors Powered by Directed Radio-Frequency Energy

David Eric Schwartz, Clinton J. Smith, Joseph Lee, Shakthi Priya Gowri, George Daniel, Christopher Lalau-Keraly, Quentin Baudenon, J. R. M. Saavedra

J. Electron. Packag. June 2018, 140(2): 020904.

Paper No: EP-17-1108

DOI: https://doi.org/10.1115/1.4039138

Published Online: May 9, 2018

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Topics: Sensors

Journal Articles

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

David Gonzalez Cuadrado, Amy Marconnet, Guillermo Paniagua

J. Electron. Packag. March 2018, 140(1): 010905.

Paper No: EP-17-1099

DOI: https://doi.org/10.1115/1.4039026

Published Online: March 2, 2018

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Topics: Heat conduction, Heat flux, Heat transfer, Integrated circuits, Interpolation, Optimization, Sensors, Temperature, Temperature sensors, Genetic algorithms

Journal Articles

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling

J. Electron. Packag. March 2018, 140(1): 017001.

Paper No: EP-17-1111

DOI: https://doi.org/10.1115/1.4038735

Published Online: March 2, 2018

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Topics: Bridges (Structures), Electrons, Sensors, Silicon, Stress, Wire

Journal Articles

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Sven Rzepka, Alexander Otto, Dietmar Vogel, Rainer Dudek

J. Electron. Packag. March 2018, 140(1): 010903.

Paper No: EP-17-1090

DOI: https://doi.org/10.1115/1.4039333

Published Online: March 2, 2018

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Topics: Electronics, Failure, Reliability, Stress, Temperature, Failure mechanisms, Cycles, Safety, Failure analysis, Simulation

Journal Articles

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Leila Choobineh, Jared Jones, Ankur Jain

J. Electron. Packag. June 2017, 139(2): 020908.

Paper No: EP-16-1140

DOI: https://doi.org/10.1115/1.4036404

Published Online: June 12, 2017

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Topics: Integrated circuits, Sensors, Temperature, Thermal resistance, Thermal analysis

Journal Articles

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Dongliang Zhao, Xin Qian, Xiaokun Gu, Saad Ayub Jajja, Ronggui Yang

J. Electron. Packag. December 2016, 138(4): 040802.

Paper No: EP-16-1067

DOI: https://doi.org/10.1115/1.4034605

Published Online: October 6, 2016

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Topics: Temperature, Thermal conductivity, Thin films, Transients (Dynamics), Heat, Steady state, Sensors, Bulk solids, Thermoreflectance, Lasers

Journal Articles

Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels

Mark Schultz, Fanghao Yang, Evan Colgan, Robert Polastre, Bing Dang, Cornelia Tsang, Michael Gaynes, Pritish Parida, John Knickerbocker, Timothy Chainer

J. Electron. Packag. June 2016, 138(2): 021005.

Paper No: EP-15-1084

DOI: https://doi.org/10.1115/1.4033309

Published Online: April 25, 2016

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Topics: Coolants, Cooling, Flow (Dynamics), Heat, Pressure drop, Temperature, Vehicles, Sensors, Silicon

Journal Articles

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

Michael James Martin, Harish Manohara

J. Electron. Packag. March 2015, 137(1): 011001.

Paper No: EP-13-1066

DOI: https://doi.org/10.1115/1.4028185

Published Online: October 6, 2014

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Topics: Bridges (Structures), Nanotubes, Pressure, Sensors, Temperature, Heating, Modeling

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

Jochen Hempel, Sohaib Anees, Elena Zukowski, Michael Berndt, Jürgen Wilde, Leonhard M. Reindl

J. Electron. Packag. December 2014, 136(4): 041002.

Paper No: EP-13-1078

DOI: https://doi.org/10.1115/1.4026437

Published Online: September 19, 2014

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Topics: Sensors, Simulation, Strain gages, Strain sensors, Stress, Temperature, Cycles, Surface acoustic waves

Journal Articles

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

Michael J. Ellsworth, Jr., Randy J. Zoodsma, Frank Cascio, Eileen Behrendt

J. Electron. Packag. December 2014, 136(4): 041009.

Paper No: EP-13-1124

DOI: https://doi.org/10.1115/1.4028119

Published Online: September 19, 2014

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Topics: Design, Flow (Dynamics), Pumps, Reservoirs, Sensors, Temperature, Water, Valves, Algorithms, Electronics

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Journal citation

NARROW

High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors

Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Electrical Joining of Paper-Based Multilayer Magneto-Resistive Sensor Stacks

Feasibility of Printed Circuit Board-Integrated Vibration Sensors for Condition Monitoring of Electronic Systems

Impact of Server Thermal Design on the Cooling Efficiency: Chassis Design

Diagonal Mode van der Pauw Stress Sensors: Proof of Diagonal-Mode Conjecture

Fabrication of Multimeasurand Sensor for Monitoring of a Li-Ion Battery

Special Section on InterPACK 2017—Part 2

Peel-and-Stick Sensors Powered by Directed Radio-Frequency Energy

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

Erratum: “Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors” [ASME J. Electron. Packag., 2014, 136(4), p. 041014; DOI: 10.1115/1.4028333 ]

Application-Driven Reliability Research of Next Generation for Automotive Electronics: Challenges and Approaches

Experimental and Numerical Investigation of Interdie Thermal Resistance in Three-Dimensional Integrated Circuits

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Embedded Two-Phase Cooling of Large Three-Dimensional Compatible Chips With Radial Channels

Thermo-Electric Modeling of Nanotube-Based Environmental Sensors

Special Section on InterPACK 2013

Strain Transfer Analysis of Integrated Surface Acoustic Wave Sensors

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

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