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Journal Articles

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Mahsa Montazeri, Cody J. Marbut, David Huitink

J. Electron. Packag. September 2019, 141(3): 031011.

Paper No: EP-18-1099

DOI: https://doi.org/10.1115/1.4043480

Published Online: May 24, 2019

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Topics: Cycles, Damage, Reliability, Shear (Mechanics), Solders, Stress, Temperature, Fatigue life, Failure, Finite element analysis

Journal Articles

Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements

J.-B. Libot, J. Alexis, O. Dalverny, L. Arnaud, P. Milesi, F. Dulondel

J. Electron. Packag. June 2019, 141(2): 021002.

Paper No: EP-17-1123

DOI: https://doi.org/10.1115/1.4042806

Published Online: March 1, 2019

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Topics: Manufacturing, Shear stress, Solder joints, Solders, Strain gages, Temperature, Thermomechanics, Cycles, Construction, Shear (Mechanics)

Journal Articles

Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint

Yansong Tan, Xin Li, Yunhui Mei, Gang Chen, Xu Chen

J. Electron. Packag. June 2016, 138(2): 021001.

Paper No: EP-15-1109

DOI: https://doi.org/10.1115/1.4032880

Published Online: March 23, 2016

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Topics: Fatigue, Fracture (Materials), Shear (Mechanics), Shear stress, Temperature, Creep, Fracture (Process), Fatigue life, Cycles

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

Richard C. Jaeger, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling

J. Electron. Packag. December 2014, 136(4): 041014.

Paper No: EP-14-1027

DOI: https://doi.org/10.1115/1.4028333

Published Online: September 19, 2014

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Topics: Sensors, Silicon, Stress, Bridges (Structures), Shear stress

Journal Articles

Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance

B. Fiedler, M. Fine, K. Kao, L. Keer

J. Electron. Packag. September 2012, 134(3): 031006.

DOI: https://doi.org/10.1115/1.4006708

Published Online: July 18, 2012

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Topics: Ball-Grid-Array packaging, Electrical resistance, Fracture (Materials), Shear (Mechanics), Stress, Cycles, Fatigue cracks, Failure, Fatigue, Shear stress

Journal Articles

Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

D. Sujan, Dereje E. Woldemichael, M. V. V. Murthy, K. N. Seetharamu

J. Electron. Packag. December 2011, 133(4): 041014.

DOI: https://doi.org/10.1115/1.4005294

Published Online: December 21, 2011

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Topics: Manufacturing, Plates (structures), Shear (Mechanics), Shear stress, Solders, Stress, Temperature, Die cutting, Shearing (Deformation), Copper

Journal Articles

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Michael R. Maughan, Robert R. Stephens, Donald M. Blackketter, Karl K. Rink

J. Electron. Packag. March 2009, 131(1): 011009.

DOI: https://doi.org/10.1115/1.3068318

Published Online: February 13, 2009

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Topics: Finite element analysis, Glass, Press fits, Shear stress, Stress, Thermal stresses, Welding, Wire, Bridges (Structures), Laser welding

Journal Articles

Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels

E. Elsaadawy, H. Mortazavi, M. S. Hamed

J. Electron. Packag. September 2008, 130(3): 031011.

DOI: https://doi.org/10.1115/1.2912182

Published Online: August 5, 2008

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Topics: Turbulence, Forced convection, Shear stress

Journal Articles

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Caroline Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu

J. Electron. Packag. September 2006, 128(3): 177–183.

DOI: https://doi.org/10.1115/1.2227057

Published Online: August 7, 2005

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Topics: Adhesives, Contact resistance, Finite element methods, Flip-chip devices, Reliability, Simulation, Stress, Temperature, Warping, Flip-chip

Journal Articles

Interfacial Thermal Stresses in Trilayer Assemblies

H. R. Ghorbani, J. K. Spelt

J. Electron. Packag. September 2005, 127(3): 314–323.

DOI: https://doi.org/10.1115/1.1938205

Published Online: November 24, 2004

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Topics: Shear (Mechanics), Shear stress, Stress, Manufacturing, Plane strain, Thermal stresses, Finite element analysis

Journal Articles

Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited

C. Q. Ru

J. Electron. Packag. September 2002, 124(3): 141–146.

DOI: https://doi.org/10.1115/1.1481037

Published Online: July 26, 2002

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Topics: Shear stress, Stress, Thermal stresses, Shear (Mechanics), Differential equations, Displacement, Boundary-value problems

Journal Articles

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

John H. Lau, Fellow ASME, Stephen H. Pan, Chris Chang

J. Electron. Packag. June 2002, 124(2): 69–76.

DOI: https://doi.org/10.1115/1.1400995

Published Online: May 2, 2002

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Topics: Creep, Solder joints, Lead-free solders, Solders, Shear (Mechanics), Corners (Structural elements), Shear stress, Stress, Printed circuit board assemblies, Reliability

Journal Articles

Finite Element Predictions of the Effect of Diffusion-Accommodated Interfacial Sliding on Thermal Stresses in Cu/Polymer Dielectric and Cu/Oxide Dielectric Single Level Damascene Interconnect Structures

Nazri Kamsah, Todd S. Gross, Igor I. Tsukrov

J. Electron. Packag. March 2002, 124(1): 12–21.

DOI: https://doi.org/10.1115/1.1402629

Published Online: March 8, 2001

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Topics: Diffusion (Physics), Finite element analysis, Polymers, Stress, Copper, Thermal stresses, Shear stress

Journal Articles

Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw

F. Yang, I. Kao

J. Electron. Packag. September 1999, 121(3): 191–195.

DOI: https://doi.org/10.1115/1.2792683

Published Online: September 1, 1999

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Topics: Abrasive machining, Semiconductor wafers, Stress, Abrasives, Manufacturing, Pressure, Shear stress, Slurries, Wire, Cutting

Journal Articles

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Cemal Basaran, Assoc. Prof. and Director,, Ying Zhao, Senior Reliability Engineer,

J. Electron. Packag. September 2001, 123(3): 218–224.

DOI: https://doi.org/10.1115/1.1362674

Published Online: July 6, 1999

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Topics: Adhesives, Damage, Elastic analysis, Finite element analysis, Stress, Stress concentration, Electronic packaging, Shear stress, Stress singularity

Journal Articles

Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability

E. K. Buratynski

J. Electron. Packag. September 1998, 120(3): 221–228.

DOI: https://doi.org/10.1115/1.2792626

Published Online: September 1, 1998

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Topics: Die cutting, Lamination, Reliability, Shearing (Deformation), Solder joints, Fatigue life, Shear (Mechanics), Silicon, Stress, Temperature

Journal Articles

Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package

B. Nagaraj, M. Mahalingam

J. Electron. Packag. September 1998, 120(3): 290–295.

DOI: https://doi.org/10.1115/1.2792635

Published Online: September 1, 1998

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Topics: Reliability, Temperature, Solders, Cycles, Finite element methods, Simulation, Creep, Failure, Simulation results, Ball-Grid-Array packaging

Journal Articles

Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

J. Li, I. Kao, V. Prasad

J. Electron. Packag. June 1998, 120(2): 123–128.

DOI: https://doi.org/10.1115/1.2792595

Published Online: June 1, 1998

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Topics: Modeling, Semiconductor wafers, Stress, Wire, Particulate matter, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries

Journal Articles

Thermal Stresses in Layered Electronic Assemblies

Z. Q. Jiang, Y. Huang, A. Chandra

J. Electron. Packag. June 1997, 119(2): 127–132.

DOI: https://doi.org/10.1115/1.2792218

Published Online: June 1, 1997

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Topics: Thermal stresses, Adhesives, Design, Stress, Electronic packages, Electronics, Euler-Bernoulli beam theory, Failure, Finite element analysis, Finite element methods

Journal citation

NARROW

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Experimental SAC305 Shear Stress–Strain Hysteresis Loop Construction Using Hall's One-Dimensional Model Based on Strain Gages Measurements

Temperature-Dependent Dwell-Fatigue Behavior of Nanosilver Sintered Lap Shear Joint

Special Section on InterPACK 2013

Four-Wire Bridge Measurements of Silicon van der Pauw Stress Sensors

Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance

Effect of Bond Layer on Bimaterial Assembly Subjected to Uniform Temperature Change

Thermal Stresses Due to Laser Welding in Bridge-Wire Initiators

Turbulence Modeling of Forced Convection Heat Transfer in Two-Dimensional Ribbed Channels

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Interfacial Thermal Stresses in Trilayer Assemblies

Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

Finite Element Predictions of the Effect of Diffusion-Accommodated Interfacial Sliding on Thermal Stresses in Cu/Polymer Dielectric and Cu/Oxide Dielectric Single Level Damascene Interconnect Structures

Interior Stress for Axisymmetric Abrasive Indentation in the Free Abrasive Machining Process: Slicing Silicon Wafers With Modern Wiresaw

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Analysis of Bending and Shearing of Tri-Layer Laminations for Solder Joint Reliability

Package-to-Board Attach Reliability — Methodology and Case Study on OMPAC Package

Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Thermal Stresses in Layered Electronic Assemblies

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