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Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
DOI: https://doi.org/10.1115/1.4056992
Published Online: March 8, 2023
View Article titled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
Click here to open pdf in another window PDF for Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure
Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011109.
Paper No: EP-22-1035
DOI: https://doi.org/10.1115/1.4056477
Published Online: January 11, 2023
View Article titled, Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
Click here to open pdf in another window PDF for Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver
Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031004.
Paper No: EP-22-1072
DOI: https://doi.org/10.1115/1.4056530
Published Online: January 11, 2023
View Article titled, Mandrel Bend Test of Screen-Printed Silver Conductors
Click here to open pdf in another window PDF for Mandrel Bend Test of Screen-Printed Silver Conductors
Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging
Journal Articles

Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density

Haibin Zhang, Quan Sun, Zhidan Sun, Yebo Lu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021006.
Paper No: EP-22-1017
DOI: https://doi.org/10.1115/1.4055469
Published Online: September 28, 2022
View Article titled, Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density
Click here to open pdf in another window PDF for Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density
Topics: Current density, Silver, Wire, Temperature gradient, Electrodiffusion
Journal Articles

Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints

Ved Prakash Sharma, Naresh Varma Datla
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041016.
Paper No: EP-21-1159
DOI: https://doi.org/10.1115/1.4054096
Published Online: March 31, 2022
View Article titled, Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
Click here to open pdf in another window PDF for Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints
Topics: Fracture (Materials), Fracture (Process), Intermetallic compounds, Solder joints, Solders, Tin, Reliability, Fractography, Lead-free solders, Failure
Journal Articles

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021117.
Paper No: EP-21-1066
DOI: https://doi.org/10.1115/1.4053766
Published Online: March 11, 2022
View Article titled, Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias
Click here to open pdf in another window PDF for Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias
Topics: Aerosols, Failure, Inks, Printing, Shear (Mechanics), Sintering, Stress, Vehicles, Temperature, Silver
Journal Articles

Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes

Xinyue Wang, Zejun Zeng, Guoqi Zhang, Jing Zhang, Pan Liu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041013.
Paper No: EP-21-1109
DOI: https://doi.org/10.1115/1.4053432
Published Online: February 1, 2022
View Article titled, Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
Click here to open pdf in another window PDF for Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes
Topics: Epoxy resins, Pressure, Silver, Sintering, Temperature, Reliability, Shear strength, Epoxy adhesives, Shear (Mechanics)
Journal Articles

Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling

Fei Qin, Shuai Zhao, Yanwei Dai, Lingyun Liu, Tong An, Pei Chen, Yanpeng Gong
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031012.
Paper No: EP-21-1125
DOI: https://doi.org/10.1115/1.4053028
Published Online: December 27, 2021
View Article titled, Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling
Click here to open pdf in another window PDF for Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling
Topics: Cycles, Nanoindentation, Silver, Stress, Young's modulus, Stress-strain curves
Journal Articles

Design and Fabrication of Leadless Package Structure for Pressure Sensors

Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
DOI: https://doi.org/10.1115/1.4052246
Published Online: November 22, 2021
View Article titled, Design and Fabrication of Leadless Package Structure for Pressure Sensors
Click here to open pdf in another window PDF for Design and Fabrication of Leadless Package Structure for Pressure Sensors
Topics: Design, Glass, Manufacturing, Pressure, Pressure sensors, Silver, Thermal stresses, Bonding, Stress, Temperature
Journal Articles

Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review

Satyam Saini, Jimil M. Shah, Pardeep Shahi, Pratik Bansode, Dereje Agonafer, Prabjit Singh, Roger Schmidt, Mike Kaler
Journal: Journal of Electronic Packaging
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030801.
Paper No: EP-20-1054
DOI: https://doi.org/10.1115/1.4051255
Published Online: September 15, 2021
View Article titled, Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review
Click here to open pdf in another window PDF for Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review
Topics: Contamination, Corrosion, Data centers, Particulate matter, Reliability, Temperature, Copper, Silver, Failure
Journal Articles

Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology

Jerzy Szałapak, Konrad Kiełbasiński, Łucja Dybowska-Sarapuk, Jakub Krzeminski, Marian Teodorczyk, Tomasz Kowaluk, Małgorzata Jakubowska
Journal: Journal of Electronic Packaging
Article Type: Technical Briefs
J. Electron. Packag. September 2021, 143(3): 034501.
Paper No: EP-20-1091
DOI: https://doi.org/10.1115/1.4049240
Published Online: January 19, 2021
View Article titled, Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology
Click here to open pdf in another window PDF for Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology
Topics: Carbon, Carbon nanotubes, Electrical resistivity, Graphene, Nanoparticles, Silver, Thermal conductivity, Temperature, Joining, High temperature
Journal Articles

Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink

Neil Dalal, Yuan Gu, Guang Chen, Daniel R. Hines, Abhijit Dasgupta, Siddhartha Das
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011012.
Paper No: EP-19-1002
DOI: https://doi.org/10.1115/1.4044960
Published Online: November 14, 2019
View Article titled, Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink
Click here to open pdf in another window PDF for Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink
Topics: Aerosols, Electrical conductivity, Flow (Dynamics), Gas flow, Inks, Magnification, Nanoparticles, Printing, Silver, Agglomeration (Materials)
Includes: Supplementary data
Journal Articles

Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031002.
Paper No: EP-18-1100
DOI: https://doi.org/10.1115/1.4042984
Published Online: April 10, 2019
View Article titled, Enhanced Sintered Silver for SiC Wide Bandgap Power Electronics Integrated Package Module
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Topics: Copper, Silver, Stress, Columns (Structural), Electronics, Sintering, Design
Journal Articles

Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics

Hsien-Chie Cheng, Ruei-You Hong, Wen-Hwa Chen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041007.
Paper No: EP-18-1041
DOI: https://doi.org/10.1115/1.4041014
Published Online: September 10, 2018
View Article titled, Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
Click here to open pdf in another window PDF for Assessment of Elastic–Plastic and Electrical Properties of Printed Silver-Based Interconnects for Flexible Electronics
Topics: Dimensional analysis, Electrical properties, Finite element analysis, Flexible electronics, Inks, Modeling, Plasticity, Silver, Simulation, Stress
Journal Articles

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Tingting Zhang, Bahgat G. Sammakia, Zhihao Yang, Howard Wang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
DOI: https://doi.org/10.1115/1.4040204
Published Online: June 11, 2018
View Article titled, Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
Click here to open pdf in another window PDF for Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
Topics: Composite materials, Copper, Density, Nanocomposites, Packing (Shipments), Packings (Cushioning), Particulate matter, Thermal conductivity, Fillers (Materials), Silver
Journal Articles

Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]

K. S. Siow, Y. T. Lin
Journal: Journal of Electronic Packaging
Article Type: Errata
J. Electron. Packag. September 2016, 138(3): 037001.
Paper No: EP-16-1057
DOI: https://doi.org/10.1115/1.4033633
Published Online: May 25, 2016
View Article titled, Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]
Click here to open pdf in another window PDF for Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]
Topics: Bonding, Electrons, Microelectronic packaging, Packaging, Patents, Silver, Solders
Journal Articles

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

David A. Roberson, Ryan B. Wicker, Eric MacDonald
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2015, 137(3): 031004.
Paper No: EP-13-1041
DOI: https://doi.org/10.1115/1.4030286
Published Online: September 1, 2015
View Article titled, Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics
Click here to open pdf in another window PDF for Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics
Topics: Electronics, Hardening (Curing), Inks, Temperature, Additive manufacturing, Silver, Manufacturing, Damage
Journal Articles

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041012.
Paper No: EP-13-1130
DOI: https://doi.org/10.1115/1.4028332
Published Online: September 19, 2014
View Article titled, Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
Click here to open pdf in another window PDF for Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging
Topics: Cavities, Columns (Structural), Copper, Evaporation, Fillers (Materials), Nanoparticles, Particulate matter, Self-assembly, Silver, Temperature
Journal Articles

High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux

Fuliang Wang, Junhui Li, Lei Han
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031001.
Paper No: EP-12-1083
DOI: https://doi.org/10.1115/1.4026877
Published Online: May 5, 2014
View Article titled, High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux
Click here to open pdf in another window PDF for High-Frequency and Low-Temperature Thermosonic Bonding of Lead-Free Microsolder Ball on Silver Pad Without Flux
Topics: Bonding, Low temperature, Silver
Journal Articles

The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes

Yuan-Yun Wu, Chin C. Lee
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011006.
Paper No: EP-13-1063
DOI: https://doi.org/10.1115/1.4026171
Published Online: January 8, 2014
View Article titled, The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes
Click here to open pdf in another window PDF for The Strength of High-Temperature Ag–In Joints Produced Between Copper by Fluxless Low-Temperature Processes
Topics: Alloys, Bonding, Copper, Design, High temperature, Low temperature, Shear (Mechanics), Silver, Solid solutions, Temperature