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Journal Articles

Reviewer's Recognition

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. June 2023, 145(2): 020201.
Paper No: EP-23-1002
https://doi.org/10.1115/1.4056725
Published Online: February 1, 2023
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Journal Articles

Reviewer's Recognition

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. March 2022, 144(1): 010201.
Paper No: EP-22-1004
https://doi.org/10.1115/1.4053637
Published Online: January 28, 2022
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Journal Articles

Reviewer’s Recognition

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. June 2020, 142(2): 020201.
Paper No: EP-20-1050
https://doi.org/10.1115/1.4046542
Published Online: March 9, 2020
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Journal Articles

Reviewer's Recognition

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. June 2019, 141(2): 020201.
Paper No: EP-19-1013
https://doi.org/10.1115/1.4042738
Published Online: February 25, 2019
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Topics: Data acquisition systems
Journal Articles

Reviewer's Recognition

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. June 2018, 140(2): 020201.
Paper No: EP-18-1022
https://doi.org/10.1115/1.4039660
Published Online: May 9, 2018
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Topics: Telecommunications
Journal Articles

Special Section on InterPACK 2015

Satish Chaparala, Ashish Gupta, Mehdi Asheghi, Jeffrey Suhling, Toru Ikeda, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. March 2016, 138(1): 010201.
Paper No: EP-16-1019
https://doi.org/10.1115/1.4032748
Published Online: March 10, 2016
View Article titled, Special Section on InterPACK 2015
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Topics: Packaging, Thermal analysis, Electronic packaging, Electronics, Microchannels, Fluids, Printed circuit boards
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Letter From the Editors

Bahgat G. Sammakia, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. September 2014, 136(3): 030201.
Paper No: EP-14-1067
https://doi.org/10.1115/1.4028063
Published Online: July 24, 2014
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Topics: Actuators, Biomedicine, Computers, Data centers, Design, Electronic packaging, Electronics, Energy / power systems, Engineering teachers, Feedback
Journal Articles

Reviewer Acknowledgment for the Journal of Electronic Packaging

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. September 2014, 136(3): 038001.
Paper No: EP-14-1051
https://doi.org/10.1115/1.4027628
Published Online: May 20, 2014
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Topics: Electronic packaging
Journal Articles

Special Issue on Thermodynamics, Flow, and Heat Transfer in MEMS

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. June 2014, 136(2): 020301.
Paper No: EP-14-1048
https://doi.org/10.1115/1.4027498
Published Online: April 30, 2014
View Article titled, Special Issue on Thermodynamics, Flow, and Heat Transfer in MEMS
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Topics: Flow (Dynamics), Heat transfer, Microelectromechanical systems, Thermodynamics
Journal Articles

Reviewer Acknowledgment for the Journal of Electronic Packaging

Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. March 2013, 135(1): 011101.
Paper No: EP-13-1005
https://doi.org/10.1115/1.4023806
Published Online: March 26, 2013
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Topics: Electronic packaging
Journal Articles

Special Issue Dedicated to Professor Avi Bar-Cohen in Celebration of His 65th Birthday

Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. June 2012, 134(2): 020201.
https://doi.org/10.1115/1.4006849
Published Online: June 11, 2012
View Article titled, Special Issue Dedicated to Professor Avi Bar-Cohen in Celebration of His 65th Birthday
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Topics: Engineering teachers
Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. September 2010, 132(3): 030201.
https://doi.org/10.1115/1.3493694
Published Online: September 30, 2010
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Topics: Electronic packaging, Cooling, Reliability
Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2008, 130(4): 040201.
https://doi.org/10.1115/1.3039759
Published Online: November 17, 2008
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Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells
Journal Articles

Special Issue on Poly’2000, London

Bernd Michel,, Guest Editor, Poly’2000 Co-chair, Kikuo Kishimoto,, Guest Editor, Poly’2000 Co-chair
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2002, 124(4): 317.
https://doi.org/10.1115/1.1497626
Published Online: December 12, 2002
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Topics: Adhesion, Adhesives, Fracture mechanics, Integrated circuit packaging, Packaging, Polymers, Reliability, Stress, Thermal management, Workshops (Work spaces)
Journal Articles

The Future of Microelectronics and Photonics and the Role of Mechanics and Materials

E. Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. March 1998, 120(1): 1–11.
https://doi.org/10.1115/1.2792280
Published Online: March 1, 1998
View Article titled, The Future of Microelectronics and Photonics and the Role of Mechanics and Materials
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Topics: Microelectronic devices, Photonics
Journal Articles

Notes on the First International Symposium on Microelectronic Package and PCB Technology, Beijing P. R. China

Zeng-Yuan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 1994, 116(4): 241.
https://doi.org/10.1115/1.2905693
Published Online: December 1, 1994
View Article titled, Notes on the First International Symposium on Microelectronic Package and PCB Technology, Beijing P. R. China
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Topics: China
Journal Articles

Notes on the ASME International Electronics Packaging Conference

Peter A. Engel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 1993, 115(4): 345.
https://doi.org/10.1115/1.2909342
Published Online: December 1, 1993
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Topics: Electronic packaging
Journal Articles

Editorial

Ephraim Suhir
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. March 1990, 112(1): 1.
https://doi.org/10.1115/1.2904334
Published Online: March 1, 1990
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Journal Articles

Editorial

Peter Engel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. March 1989, 111(1): 1.
https://doi.org/10.1115/1.3226502
Published Online: March 1, 1989
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