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Keywords: Glass
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 300–306.
Published Online: November 29, 2006
...Luke M. Thompson; Michael R. Maughan; Karl K. Rink; Donald M. Blackketter; Robert R. Stephens Cracks have been observed in the insulating glass of bridge-wire initiators that may allow moisture to penetrate the assembly, potentially leading to the corrosion and degradation of the bridge wire...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 120–123.
Published Online: April 30, 2004
...Hong-Seok Min; Young-Chang Joo; Oh-Sung Song We studied cleaning and annealing effects in glass/Si direct bonding using 4 inch Pyrex glass and silicon wafers. SPM cleaning (sulfuric-peroxide mixture, H 2 SO 4 : H 2 O 2 = 4 : 1 , 120 ° C ) , RCA cleaning ( NH 4 OH : H 2 O 2 : H 2 O = 1 : 1 : 5 , 80...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 602–608.
Published Online: December 15, 2003
...John H. Lau, Fellow ASME; Steve Erasmus; Yida Zou An exact analysis is presented for the stresses and deflections of circular plates (glass windows) elastically restrained along its edge in a photonic device’s housing subjected to the pressure and temperature loadings. Dimensionless curves...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 64–69.
Published Online: July 13, 2000
...Zongrong Liu; D. D. L. Chung Air-firable glass-free metal electrically conductive thick film pastes of different compositions were developed by using a titanium alloy component, and tin and zinc metal substitutes for glass frit used in traditional thick film pastes. The effect of different...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. December 2001, 123(4): 401–404.
Published Online: January 3, 2000
.../glass interfaces bonded with the silane coupling agent 3-aminopropyltriethoxysilane (3-APES) was studied under static and cyclic loading at 23°C and in either dry or humid conditions using the double cleavage drilled compression (DCDC) test. Crack growth rates under cyclic loading were significantly...