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Keywords: LED
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011001.
Paper No: EP-13-1112
Published Online: March 10, 2016
...S. Shanmugan; O. Zeng Yin; P. Anithambigai; D. Mutharasu All solid-state lighting products produce heat which should be removed by use of a heat sink. Since the two mating surfaces of light emitting diode (LED) package and heat sink are not flat, a thermal interface material (TIM) must be applied...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041005.
Paper No: EP-13-1106
Published Online: September 19, 2014
.... 17 09 2013 15 08 2014 The movement to light-emitting diode (LED) lighting systems worldwide is accelerating quickly as energy savings and reduction in hazardous materials increase in importance. Government regulations and rapidly lowering prices help to further this trend. Today's...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2014, 136(3): 034502.
Paper No: EP-13-1099
Published Online: May 12, 2014
... for 3-W green light emitting diode (LED). The thermal transient curve was recorded for given LED attached with bare Cu and AlN-coated Cu substrate at three different driving currents. LED attached on AlN/Cu showed the reduced raise in junction temperature (T J ) by 2.59 °C at 700 mA. The LED/TIM/AlN/Cu...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011002.
Paper No: EP-13-1047
Published Online: November 22, 2013
... liquid cooling techniques, for high power LED lighting modules. Kim and Bar-Cohen et al. have reported a direct submount cooling technique using FC-72 as a working fluid [ 3 ]. Wang et al. have reported the development of a vapor chamber based plate for 30 W high power LEDs [ 4 ]. Liu et al. have...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041009.
Published Online: December 9, 2011
..., this method is expected to be flexibly useful for heat dissipation of light-emitting diode (LED) street lamp, desk computer and radio remote unit (RRU), where confined space, efficient cooling, low energy consumption, dust-proof and water-proof are critically requested. The ambient temperature was around 23...