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Keywords: Resistivity
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 64–69.
Published Online: July 13, 2000
... components on the electrical resistivity and bonding between the thick film and the alumina substrate was investigated. Thick films with low electrical resistivity and good bonding to the alumina substrate were obtained by using silver, zinc, tin, and TiCu alloy powders in the pastes. The addition of zinc...