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Keywords: Sensors
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
Published Online: June 26, 2018
... for the force control type and not for the displacement control type. Microelectromechanical systems (MEMS) have been widely used in many sensor applications. They can be miniaturized and integrated into the standard CMOS process. Most MEMS structures are moveable and easily generate cyclic deflection...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031002.
Paper No: EP-17-1053
Published Online: May 11, 2018
...Aaron Knobloch; Chris Kapusta; Jason Karp; Yuri Plotnikov; Jason B. Siegel; Anna G. Stefanopoulou This paper details the fabrication and testing of a combined temperature and expansion sensor to improve state of charge (SOC) and state of health (SOH) estimation for Li-ion batteries. These sensors...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2018, 140(2): 020301.
Paper No: EP-18-1012
Published Online: May 9, 2018
... issue. Broadly, these papers cover topics across all the five tracks of the conference and include papers on advanced interconnect technologies, 3D-printing, microscale heat transfer, data center cooling technologies, sensors for health monitoring, and reliability challenges in automotive electronics...
Journal Articles
David Eric Schwartz, Clinton J. Smith, Joseph Lee, Shakthi Priya Gowri, George Daniel, Christopher Lalau-Keraly, Quentin Baudenon, J. R. M. Saavedra
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020904.
Paper No: EP-17-1108
Published Online: May 9, 2018
...David Eric Schwartz; Clinton J. Smith; Joseph Lee; Shakthi Priya Gowri; George Daniel; Christopher Lalau-Keraly; Quentin Baudenon; J. R. M. Saavedra PARC, a Xerox Company, is developing a low-cost system of peel-and-stick wireless sensors that will enable widespread building environmental sensor...
Topics:
Sensors
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. March 2018, 140(1): 017001.
Paper No: EP-17-1111
Published Online: March 2, 2018
...Richard C. Jaeger; Mohammad Motalab; Safina Hussain; Jeffrey C. Suhling 16 10 2017 11 12 2017 Electronic Sensors Fig. 1 Analysis by superposition: ( a ) diagonal current excitation; ( b ) and ( c ) equivalent circuits for superposition Unfortunately...
Journal Articles
Taoran Le, Ziyin Lin, Rushi Vyas, Vasileios Lakafosis, Li Yang, Anya Traille, Manos M. Tentzeris, Ching-ping Wong
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011007.
Paper No: EP-12-1030
Published Online: March 26, 2013
.... annealing CNT conductive silver ink direct write electrical design flexible circuits graphene inkjet-printed electronics low temperature bonding paper-based electronics microwave organic electronics sensors SOP The current era of passive RF electronic circuits depends heavily...