1-1 of 1
Keywords: SnAgCu
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
Published Online: March 1, 2015
... assemblies has been fabricated and tested under Joint Electron Device Engineering Council (JEDEC) JESD22-B111 specified condition for mechanical shock. Model predictions have been correlated with experimental data. high strain rate lead-free solder SnAgCu Electronic products are generally...