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Keywords: SnAgCu
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
Published Online: March 1, 2015
... assemblies has been fabricated and tested under Joint Electron Device Engineering Council (JEDEC) JESD22-B111 specified condition for mechanical shock. Model predictions have been correlated with experimental data. high strain rate lead-free solder SnAgCu Electronic products are generally...
