... in the tensile region is different from that in the compressive region is employed for the fatigue test. Different fatigue lives due to different strain rates in the tensile and compression regions originate from the difference of development behaviors of creep strain generated in the cyclic loading. This paper...

... published an article ( 47 ) that correlated the number of cycles to crack initiation, N 0 , and the crack growth rate per cycle, d a / d N , to the strain-energy density (plastic work per unit volume), Δ W , using thermal fatigue test data and ANSYS ® 5.0 FEA software...

... electronics packaging fatigue testing flip-chip devices life testing nanostructured materials passivation reliability silicon compounds thermal shock thermomechanical treatment Underfill materials are used in flip chip assemblies to enhance the thermomechanical reliability of the solder bumps...

... solder joint containing microelectronic packages. Material parameters relevant to the model are estimated via a coupled experimental and numerical technique. 05 01 2007 20 08 2007 15 04 2008 copper alloys creep fatigue cracks fatigue testing fracture mechanics integrated...

...John H. L. Pang; F. X. Che Isothermal three-point and four-point cyclic bend fatigue test methods have been developed for Sn–Ag–Cu solder joints. Reported bend tests from the literature were conducted at room temperature (25°C) and there is lack of data for lead-free solder joints. In this study...

... accelerated thermal cycling. 20 09 2006 13 02 2007 ball grid arrays electronics packaging fatigue testing heat treatment integrated circuit reliability light interferometry solders accelerated thermal cycling laser moiré interferometry Microelectronic packaging industry...

... to be 77 J ∕ m 2 . A thermo-mechanical fatigue test was conducted and a model for underfill delamination propagation has been developed. Based on the study, the propagation of delamination in actual flip-chip assemblies with nano-filled, no-flow underfill materials under monotonic and fatigue can...

.... A. , “ Impact of Ball via Configuration on Solder Joint Reliability in Tape Based Chip Scale Packages ,” ChipPack, Inc. 23 10 2004 21 09 2006 thermal management (packaging) solders printed circuits thermal expansion fatigue testing...

... initiation HASMAP Moiré interferometry ball grid arrays integrated circuit packaging durability fatigue testing fatigue cracks solders deformation 09 02 2006 05 07 2006 2007 American Society of Mechanical Engineers ...

... stress conditions were imposed to investigate the effects of multiaxial stresses on deformation behavior. The effects of frequency and temperature on cyclic deformation and fatigue facture were investigated for lead-free Sn 3.8 Ag 0.7 Cu and Sn – Pb eutectic solder. Fractography of fatigue tested samples...

... integrated circuit interconnections life testing fatigue testing reliability temperature distribution tin alloys copper alloys silver alloys current density electromigration solder bump flip-chip reliability electrothermal coupling analysis Electromigration is responsible...

... cylinder specimen tested in millimeters Reversed torsion low cycle fatigue tests were carried out using the four strain waves shown in Fig. 2 . The first was the symmetrical triangular wave at a strain rate of 0.5 % ∕ s on von Mises base (pp test); the second was the slow-fast strain...

...Tae-Sang Park; Soon-Bok Lee To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were conducted with 63 Sn ∕ 37 Pb and Sn ∕ 3.5 Ag ∕ 0.75 Cu solder joints in room...

...Ki-Ju Kang; Seon-Ho Choi; Tae-Sung Bae Fatigue tests were performed using single lap-joint specimens to obtain near-threshold fatigue crack growth data of solder joint under mode-II load. Attention was focused on the effect of high temperature aging and microstructures separately from...

... with a commercial finite element code. In addition, isothermal fatigue tests have been performed to obtain the relationship between the number of cycle-to-failure and the strain energy density. Thus, by combining the finite element results and the isothermal fatigue test results, the average thermal-fatigue life...

... 15, 2001. Associate Editor: Yi-Hain Pao. 15 March 2001 lead alloys tin alloys soldering thermal expansion thermal stresses vibrations fatigue life testing fatigue testing semiconductor device reliability integrated circuit reliability packaging finite element analysis...

... joint failure in electronic assemblies 1 . This problem has become more important during the last decade with the switch to surface mount techniques from through-hole assembly, where some strain accommodation from leads is no longer available. thermomechanical treatment fatigue testing...