... shock. Industry migration to lead-free solders has resulted in proliferation of a wide variety of solder alloy compositions. One of the popular tin-silver-copper alloys is Sn3Ag0.5Cu. The high strain rate properties of lead-free solder alloys are scarce. Typical material tests systems are not well...

...Hung-Jen Chang; Chau-Jie Zhan; Tao-Chih Chang; Jung-Hua Chou In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn 4.0 Ag 0.5 Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed circuit board (PCB) by using Sn 1.0 Ag...

...M. Meilunas; P. Borgesen The mandated switch of the overwhelming part of microelectronics assembly to lead-free soldering has left the manufacturers of many high reliability products, which are still exempt from the requirement to change, with a choice between imperfect alternatives. One...

... for 6.35 × 6.35 × 0.6 mm 3 flip chips and flip chips (“SiMAF;” Siemens AG) with lead-free solder bumps. Oresjo , S. , 2002 , “ New Study Reveals Component Defect Levels ,” Circuits Assembly , May, pp. 39 – 43 . Semmens , J. E. , 2000 , “ Flip Chips and Acoustic Micro Imaging...

...Mohd F. Abdulhamid; Cemal Basaran Thermomigration experiments were conducted to study the change in mechanical properties of 95.5Sn–4Ag–0.5Cu (SAC405) lead-free solder joint under high temperature gradients. This paper presents some observations on samples that were subjected to 1000 ° C / cm...

.... , 2003 , “ Effect of Voids on the Reliability of BGA/CSP Solder Joints ,” Microelectron. Reliab. 0026-2714 , 43 ( 12 ), pp. 2077 – 2086 . Kim , D. S. , Yu , K. , and Shinutani , T. , 2004 , “ Effect of Void Formation on Thermal Fatigue Reliability of Lead-Free Solder Joints...