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Journal Articles

Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias

Pradeep Lall, Jinesh Narangaparambil, Ved Soni, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021117.
Paper No: EP-21-1066
https://doi.org/10.1115/1.4053766
Published Online: March 11, 2022
..., Oct. 6–9, pp. 512 – 515 . 10.1109/EuMC.2014.6986483 1 Corresponding author. e-mail:  lall@auburn.edu 31 03 2021 01 02 2022 11 03 2022 multi-layer micro-vias dielectric polyimide substrate additive printing resistance shear load to failure aerosol jet...
View Article titled, Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias
Open the PDF for Process-Recipe Development for Printing of Multilayer Circuitry With Z -Axis Interconnects Using Aerosol-Jet Printed Dielectric Vias in another window
Topics: Aerosols, Failure, Inks, Printing, Shear (Mechanics), Sintering, Stress, Vehicles, Temperature, Silver
Journal Articles

Impact of Printed Circuit Board Via and Micro-Via Structures on Component Thermal Performances

Valentin Bissuel, Michel Brizoux, Arnaud Grivon, Eric Monier-Vinard, Fabrice Pires
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031013.
https://doi.org/10.1115/1.4004830
Published Online: September 30, 2011
... planes. So, to optimize board cooling, the designer has more and more to deal with PCB architecture including high density interconnect (HDI) technology, which relies on small diameter laser drilled micro-vias. Compared with conventional PCB technologies, HDI creates denser interconnect substrates...
View Article titled, Impact of Printed Circuit Board Via and <span class="search-highlight">Micro</span>-<span class="search-highlight">Via</span> Structures on Component Thermal Performances
Open the PDF for Impact of Printed Circuit Board Via and <span class="search-highlight">Micro</span>-<span class="search-highlight">Via</span> Structures on Component Thermal Performances in another window
Topics: Boundary-value problems, Cooling, Density, Design, Genetic algorithms, Heat, Junctions, Modeling, Printed circuit boards, Temperature