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Journal Articles

Characterization of a Rack-Level Thermosyphon-Based Cooling System

R. Khalid, S. G. Schon, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031007.
Paper No: EP-23-1068
https://doi.org/10.1115/1.4064524
Published Online: March 11, 2024
... application. 1 Corresponding author. 02 08 2023 20 12 2023 11 03 2024 data center rack-level thermosyphon energy efficiency heat recovery environmental benefits National Science Foundation 10.13039/100000001 1738782 Cooling and other...
View Article titled, Characterization of a <span class="search-highlight">Rack</span>-<span class="search-highlight">Level</span> Thermosyphon-Based Cooling System
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Topics: Condensers (steam plant), Cooling, Cooling systems, Data centers, Fluids, Heat, Heat recovery, Refrigerants, Stress, Temperature