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1-6 of 6
Keywords: response surface methodology
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021005.
Published Online: April 1, 2009
... 07 01 2009 01 04 2009 finite volume methods heat sinks heat transfer laminar flow microchannel flow Navier-Stokes equations polynomial approximation quadratic programming response surface methodology thermal resistance trapezoidal microchannel electronic cooling...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 411–420.
Published Online: January 25, 2007
... the least effect on heat-transfer performance for both stationary and rotating cases. Furthermore, the comparisons between the predictions by using the quadratic response surface methodology and the experimental data for both stationary and rotating cases are made with a satisfactory agreement. Finally...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 9–18.
Published Online: September 21, 2006
... the simulation time significantly for
approximating a huge number of simulations to find the optimum point in the design
space and is recommended for optimization study. This study shows that CCD based
response surface methodology satisfies all goodness-of-fit...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 410–422.
Published Online: January 24, 2005
... performance analyzers for PPF heat sinks have been developed. A screening experimental design using the Taguchi method is performed to determine key factors that are critical to the design and screen out unimportant design factors; and a Response Surface Methodology is then applied to establish analytical...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 237–246.
Published Online: July 8, 2004
... mechanical compliance may not have good electrical performance. Therefore, a trade off is needed. Using response surface methodology (RSM), an optimization has been done. Furthermore, reliability of the optimized G-helix interconnects in a silicon-on-organic substrate assembly has been assessed, which...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 490–497.
Published Online: December 15, 2003
.... 01 Nov 2002 15 12 2003 response surface methodology integrated circuit packaging cracks finite element analysis failure analysis integrated circuit reliability Thermo-mechanical reliability of electronic packages is one of the major concerns in the electronic industry...