The paper describes the successful amalgamation of the thermoelectric and the adsorption cycles into a combined electro-adsorption chiller (EAC). The symbiotic union produces an efficiency or COP (coefficient of performance) more than threefold when compared with their individual cycles. The experiments conducted on the bench-scale prototype show that it can meet high cooling loads, typically with an evaporator foot print of , that is at the heated surface temperature of , which is well below that of the room temperature. The COPs of the EAC chiller vary from 0.7 to 0.8, which is comparable to the theoretical maximum of about 1.1 at the same operating conditions. With a copper-foam cladded evaporator, the high cooling rates have been achieved with a low temperature difference. In addition to meeting high cooling rates, the EAC is unique as (i) it has almost no moving parts and hence has silent operation, (ii) it is environmentally friendly as it uses a nonharmful adsorbent (silica gel), and (iii) water is used as the refrigerant.
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e-mail: mpengkc@nus.edu.sg
e-mail: bidyutb@cm.kyushu-u.ac.jp
e-mail: koyama@cm.kyushu-u.ac.jp
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September 2006
This article was originally published in
Journal of Heat Transfer
Research Papers
The Electro-Adsorption Chiller: Performance Rating of a Novel Miniaturized Cooling Cycle for Electronics Cooling
K. C. Ng,
K. C. Ng
Mechanical Engineering Department,
e-mail: mpengkc@nus.edu.sg
National University of Singapore
, 10 Kent Ridge Crescent, Singapore 119260
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M. A. Sai,
M. A. Sai
Mechanical Engineering Department,
National University of Singapore
, 10 Kent Ridge Crescent, Singapore 119260
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A. Chakraborty,
A. Chakraborty
Mechanical Engineering Department,
National University of Singapore
, 10 Kent Ridge Crescent, Singapore 119260
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B. B. Saha,
B. B. Saha
Interdisciplinary Graduate School of Engineering Sciences,
e-mail: bidyutb@cm.kyushu-u.ac.jp
Kyushu University
, Kasuga-koen, 6-1, Kasuga-shi, Fukuoka 816-8580, Japan
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S. Koyama
S. Koyama
Interdisciplinary Graduate School of Engineering Sciences,
e-mail: koyama@cm.kyushu-u.ac.jp
Kyushu University
, Kasuga-koen, 6-1, Kasuga-shi, Fukuoka 816-8580, Japan
Search for other works by this author on:
K. C. Ng
Mechanical Engineering Department,
National University of Singapore
, 10 Kent Ridge Crescent, Singapore 119260e-mail: mpengkc@nus.edu.sg
M. A. Sai
Mechanical Engineering Department,
National University of Singapore
, 10 Kent Ridge Crescent, Singapore 119260
A. Chakraborty
Mechanical Engineering Department,
National University of Singapore
, 10 Kent Ridge Crescent, Singapore 119260
B. B. Saha
Interdisciplinary Graduate School of Engineering Sciences,
Kyushu University
, Kasuga-koen, 6-1, Kasuga-shi, Fukuoka 816-8580, Japane-mail: bidyutb@cm.kyushu-u.ac.jp
S. Koyama
Interdisciplinary Graduate School of Engineering Sciences,
Kyushu University
, Kasuga-koen, 6-1, Kasuga-shi, Fukuoka 816-8580, Japane-mail: koyama@cm.kyushu-u.ac.jp
J. Heat Transfer. Sep 2006, 128(9): 889-896 (8 pages)
Published Online: February 7, 2006
Article history
Received:
June 26, 2005
Revised:
February 7, 2006
Citation
Ng, K. C., Sai, M. A., Chakraborty, A., Saha, B. B., and Koyama, S. (February 7, 2006). "The Electro-Adsorption Chiller: Performance Rating of a Novel Miniaturized Cooling Cycle for Electronics Cooling." ASME. J. Heat Transfer. September 2006; 128(9): 889–896. https://doi.org/10.1115/1.2241786
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