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Volume 127, Issue 1

January 2005

This article was originally published in

Journal of Heat Transfer

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ISSN 0022-1481

EISSN 1528-8943

Foreword

Cristina Amon, Dereje Agonafer

J. Heat Transfer. January 2005, 127(1): 1. doi: https://doi.org/10.1115/1.1862670

Extract

View articletitled, Foreword

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Topics: Cooling , Heat conduction , Heat sinks , Heat transfer , Packaging , Thermal management , Computers , Computer cooling , Inventions , Design

Next Generation Devices for Electronic Cooling With Heat Rejection to Air

Ralph L. Webb

J. Heat Transfer. January 2005, 127(1): 2–10. doi: https://doi.org/10.1115/1.1800512

Abstract

View articletitled, Next Generation Devices for Electronic Cooling With Heat Rejection to Air

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Topics: Cooling , Fluids , Heat , Heat sinks , Design , Forced convection , Microchannels , Water

Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls

Donald C. Price, Life Fellow, ASME Principal Fellow,, B. Elliott Short,, Jr., Mem., ASME Senior Principal Mechanical Engineer,

J. Heat Transfer. January 2005, 127(1): 11–17. doi: https://doi.org/10.1115/1.1839583

Abstract

View articletitled, Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls

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Topics: Computers , Design , Flow (Dynamics) , Printed circuit boards , Temperature , Thermal management , Cooling , Electronics , Flight

A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating

Lan Tang, Yogendra K. Joshi

J. Heat Transfer. January 2005, 127(1): 18–26. doi: https://doi.org/10.1115/1.1852495

Abstract

View articletitled, A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating

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Topics: Flow (Dynamics) , Forced convection , Heat , Heat conduction , Junctions , Mixed convection , Modeling , Printed circuit boards , Temperature , Thermal analysis

A DOS-Enhanced Numerical Simulation of Heat Transfer and Fluid Flow Through an Array of Offset Fins With Conjugate Heating in the Bounding Solid

Ephraim M. Sparrow, John P. Abraham, Paul W. Chevalier

J. Heat Transfer. January 2005, 127(1): 27–33. doi: https://doi.org/10.1115/1.1800531

Abstract

View articletitled, A DOS-Enhanced Numerical Simulation of Heat Transfer and Fluid Flow Through an Array of Offset Fins With Conjugate Heating in the Bounding Solid

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Topics: Boundary-value problems , Computer simulation , Fins , Fluid dynamics , Fluids , Friction , Heat transfer , Pressure drop , Simulation , Heating

Coupled Field Analyses in MEMS With Finite Element Analysis

Ravi Chandra Sikakollu, Lemmy Meekisho, Andres LaRosa

J. Heat Transfer. January 2005, 127(1): 34–37. doi: https://doi.org/10.1115/1.1804204

Abstract

View articletitled, Coupled Field Analyses in MEMS With Finite Element Analysis

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Topics: Actuators , Boundary-value problems , Finite element analysis , Microelectromechanical systems , Dimensions , Thermal stresses , Temperature

A Comparative Study of Cooling of High Power Density Electronics Using Sprays and Microjets

Matteo Fabbri, Shanjuan Jiang, Vijay K. Dhir

J. Heat Transfer. January 2005, 127(1): 38–48. doi: https://doi.org/10.1115/1.1804205

Abstract

View articletitled, A Comparative Study of Cooling of High Power Density Electronics Using Sprays and Microjets

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Topics: Cooling , Heat transfer , Jets , Nozzles , Sprays , Drops , Temperature , Water , Heat

Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures

Jae-Mo Koo, Sungjun Im, Linan Jiang, Kenneth E. Goodson

J. Heat Transfer. January 2005, 127(1): 49–58. doi: https://doi.org/10.1115/1.1839582

Abstract

View articletitled, Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures

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Topics: Circuits , Convection , Cooling , Heat sinks , Microchannels , Temperature , Thermal resistance , Heat , Boiling , Flow (Dynamics)

Heat Transfer in Water-Cooled Silicon Carbide Milli-Channel Heat Sinks for High Power Electronic Applications

C. Bower, A. Ortega, P. Skandakumaran, R. Vaidyanathan, T. Phillips

J. Heat Transfer. January 2005, 127(1): 59–65. doi: https://doi.org/10.1115/1.1852494

Abstract

View articletitled, Heat Transfer in Water-Cooled Silicon Carbide Milli-Channel Heat Sinks for High Power Electronic Applications

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Topics: Extruding , Flow (Dynamics) , Friction , Heat , Heat exchangers , Heat sinks , Heat transfer , Manufacturing , Silicon , Water

Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics

Cristina H. Amon, S.-C. Yao, C.-F. Wu, C.-C. Hsieh

J. Heat Transfer. January 2005, 127(1): 66–75. doi: https://doi.org/10.1115/1.1839586

Abstract

View articletitled, Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics

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Topics: Coolants , Cooling , Drops , Electronics , Engineering prototypes , Flow (Dynamics) , Flux (Metallurgy) , Heat , Heat flux , Heat transfer

An Assessment of Module Cooling Enhancement With Thermoelectric Coolers

R. E. Simons, M. J. Ellsworth, R. C. Chu

J. Heat Transfer. January 2005, 127(1): 76–84. doi: https://doi.org/10.1115/1.1852496

Abstract

View articletitled, An Assessment of Module Cooling Enhancement With Thermoelectric Coolers

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Topics: Cooling , Temperature , Thermoelectric coolers , Thermoelectric cooling , Heat , Multi-chip modules , Geometry , Water

Effect of the Location and the Properties of Thermostatic Expansion Valve Sensor Bulb on the Stability of a Refrigeration System

Veerendra Mulay, Amit Kulkarni, Dereje Agonafer, ASME Fellow, Roger Schmidt, ASME Fellow

J. Heat Transfer. January 2005, 127(1): 85–94. doi: https://doi.org/10.1115/1.1839584

Abstract

View articletitled, Effect of the Location and the Properties of Thermostatic Expansion Valve Sensor Bulb on the Stability of a Refrigeration System

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Topics: Refrigeration , Sensors , Temperature , Valves , Stability , Refrigerants , Flow (Dynamics) , Cooling , Thermal resistance , Stress

Impact of Area Contact Between Sensor Bulb and Evaporator Return Line on Modular Refrigeration Unit: Computational and Experimental

Saket Karajgikar, Nikhil Lakhkar, Dereje Agonafer, Fellow ASME, Roger Schmidt, Fellow ASME

J. Heat Transfer. January 2005, 127(1): 95–100. doi: https://doi.org/10.1115/1.1839585

Abstract

View articletitled, Impact of Area Contact Between Sensor Bulb and Evaporator Return Line on Modular Refrigeration Unit: Computational and Experimental

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Topics: Refrigeration , Sensors , Stress , Temperature , Vapors , Compression , Valves , Heat , Refrigerants , Cooling

On the Nature of Critical Heat Flux in Microchannels

A. E. Bergles, Honorary Member, ASME,, S. G. Kandlikar, Fellow, ASME,

J. Heat Transfer. January 2005, 127(1): 101–107. doi: https://doi.org/10.1115/1.1839587

Abstract

View articletitled, On the Nature of Critical Heat Flux in Microchannels

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Topics: Boiling , Critical heat flux , Flow (Dynamics) , Microchannels

Thermal Transport in Nanostructured Solid-State Cooling Devices

Deyu Li, Scott T. Huxtable, Alexis R. Abramson, Arun Majumdar

J. Heat Transfer. January 2005, 127(1): 108–114. doi: https://doi.org/10.1115/1.1839588

Abstract

View articletitled, Thermal Transport in Nanostructured Solid-State Cooling Devices

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Topics: Alloys , Cooling , Electromagnetic scattering , Nanostructures , Nanowires , Phonons , Semiconductors (Materials) , Superlattices , Thermal conductivity , Temperature

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Foreword

Next Generation Devices for Electronic Cooling With Heat Rejection to Air

Thermal Design of an Airborne Computer Chassis With Air-Cooled, Cast Pin Fin Coldwalls

A Multi-Grid Based Multi-Scale Thermal Analysis Approach for Combined Mixed Convection, Conduction, and Radiation Due to Discrete Heating

A DOS-Enhanced Numerical Simulation of Heat Transfer and Fluid Flow Through an Array of Offset Fins With Conjugate Heating in the Bounding Solid

Coupled Field Analyses in MEMS With Finite Element Analysis

A Comparative Study of Cooling of High Power Density Electronics Using Sprays and Microjets

Integrated Microchannel Cooling for Three-Dimensional Electronic Circuit Architectures

Heat Transfer in Water-Cooled Silicon Carbide Milli-Channel Heat Sinks for High Power Electronic Applications

Microelectromechanical System-Based Evaporative Thermal Management of High Heat Flux Electronics

An Assessment of Module Cooling Enhancement With Thermoelectric Coolers

Effect of the Location and the Properties of Thermostatic Expansion Valve Sensor Bulb on the Stability of a Refrigeration System

Impact of Area Contact Between Sensor Bulb and Evaporator Return Line on Modular Refrigeration Unit: Computational and Experimental

On the Nature of Critical Heat Flux in Microchannels

Thermal Transport in Nanostructured Solid-State Cooling Devices

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