A new thermocouple fixation method for grinding temperature measurement is presented. Unlike the conventional method using a welded thermocouple, this new method uses epoxy for affixing the embedded thermocouple within a blind hole in the workpiece subsurface. During grinding, the thermocouple junction is exposed and bonded to provide direct contact with the ground surface by the smearing of the workpiece material. Experiments were conducted to evaluate this simplified thermocouple fixation method including the effect of thermocouple junction size. Heat transfer models were applied to calculate the energy partition for grinding under dry, wet, and minimum quantity lubrication (MQL) conditions. For shallow-cut grinding of cast iron using a vitreous bond aluminum oxide wheel, the energy partition using a small wheel depth of cut of was estimated as 84% for dry grinding, 84% for MQL grinding, but only 24% for wet grinding. Such a small energy partition with wet grinding can be attributed to cooling by the fluid at the grinding zone. Increasing the wheel depth of cut to for wet grinding resulted in a much bigger energy partition of 92%, which can be attributed to fluid film boiling and loss of cooling at the grinding zone.
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October 2008
Research Papers
Thermocouple Fixation Method for Grinding Temperature Measurement
Bin Shen,
Bin Shen
Department of Mechanical Engineering,
University of Michigan
, Ann Arbor, MI 48109
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Guoxian Xiao,
Guoxian Xiao
Manufacturing Systems Research Laboratory,
General Motors R&D
, Warren, MI 48092
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Changsheng Guo,
Changsheng Guo
United Technologies Research Center
, East Hartford, CT 06108
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Stephen Malkin,
Stephen Malkin
Department of Mechanical and Industrial Engineering,
University of Massachusetts
, Amherst, MA 01003
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Albert J. Shih
Albert J. Shih
Department of Mechanical Engineering,
University of Michigan
, Ann Arbor, MI 48109
Search for other works by this author on:
Bin Shen
Department of Mechanical Engineering,
University of Michigan
, Ann Arbor, MI 48109
Guoxian Xiao
Manufacturing Systems Research Laboratory,
General Motors R&D
, Warren, MI 48092
Changsheng Guo
United Technologies Research Center
, East Hartford, CT 06108
Stephen Malkin
Department of Mechanical and Industrial Engineering,
University of Massachusetts
, Amherst, MA 01003
Albert J. Shih
Department of Mechanical Engineering,
University of Michigan
, Ann Arbor, MI 48109J. Manuf. Sci. Eng. Oct 2008, 130(5): 051014 (8 pages)
Published Online: September 11, 2008
Article history
Received:
September 22, 2007
Revised:
June 10, 2008
Published:
September 11, 2008
Citation
Shen, B., Xiao, G., Guo, C., Malkin, S., and Shih, A. J. (September 11, 2008). "Thermocouple Fixation Method for Grinding Temperature Measurement." ASME. J. Manuf. Sci. Eng. October 2008; 130(5): 051014. https://doi.org/10.1115/1.2976142
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