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Keywords: Semiconductor Manufacturing
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Journal Articles

Heterogeneous Transfer Learning of Electrohydrodynamic Printing Under Zero-Gravity Toward In-Space Manufacturing

Rayne Wolf, Liangkui Jiang, Khawlah Alharbi, Pengyu Zhang, Chao Wang, Hantang Qin
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. December 2024, 146(12): 121002.
Paper No: MANU-24-1229
https://doi.org/10.1115/1.4066097
Published Online: September 19, 2024
... learning domain shift electrohydrodynamic inkjet printing in-space manufacturing additive manufacturing process engineering semiconductor manufacturing sensing monitoring and diagnostics National Aeronautics and Space Administration 10.13039/100000104 80NSSC2XK1188 80MSFC23PA012...
View Article titled, Heterogeneous Transfer Learning of Electrohydrodynamic Printing Under Zero-Gravity Toward In-Space Manufacturing
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Topics: Electrohydrodynamics, Gravity (Force), Machine learning, Manufacturing, Printing, Flight, Additive manufacturing, Physics, Testing
Journal Articles

Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis

Kuan Lu, Zhikun Wang, Heebum Chun, ChaBum Lee
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070908.
Paper No: MANU-23-1366
https://doi.org/10.1115/1.4065639
Published Online: June 10, 2024
... Root Cause and Yield Analysis ,” Proceedings of the Advanced Semiconductor Manufacturing Conference (ASMC'16) , Saratoga Springs, NY , May 16–19 . [3] Zhu , J. , Liu , J. , Xu , T. , Yuan , S. , Zhang , Z. , Jiang , H. , Gu , H. , Zhou , R. , and Liu , S...
View Article titled, Wafer Edge Metrology and Inspection Technique Using Curved-Edge Diffractive Fringe Pattern Analysis
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Topics: Diffraction patterns, Imaging, Inspection, Metrology, Semiconductor wafers, Feature extraction, Particulate matter
Journal Articles

Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies

Fengfeng Zhou, Xingyu Fu, Siying Chen, Changheon Han, Martin B. G. Jun
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070907.
Paper No: MANU-23-1611
https://doi.org/10.1115/1.4065523
Published Online: June 3, 2024
... . 10.1007/s00170-023-11888-y [3] Nishi , Y. , and Doering , R. , 2000 , Handbook of Semiconductor Manufacturing Technology , CRC Press , New York . [4] Mayyas , M. , Wafer Surface Reconstruction and Characterization for Motion Compensation in a Femtosecond Laser Micromachining...
View Article titled, Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies
Open the PDF for Three-Dimensional Profile Reconstruction and Internal Defect Detection of Silicon Wafers Using Cascaded Fiber Optic Fabry–Pérot Interferometer and Leaky Field Detection Technologies in another window
Topics: Fibers, Flaw detection, Interferometers, Semiconductor wafers, Leakage, Optical fiber, Refractive index, Wavelength
Journal Articles

Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation

Changheon Han, Heebum Chun, Jiho Lee, Fengfeng Zhou, Huitaek Yun, ChaBum Lee, Martin B.G. Jun
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070906.
Paper No: MANU-23-1591
https://doi.org/10.1115/1.4065276
Published Online: May 9, 2024
...@purdue.edu 24 09 2023 29 03 2024 01 04 2024 09 05 2024 Graphical Abstract Figure semiconductor wafer inspection automated visual inspection autonomous data annotation defect localization metrology semiconductor manufacturing sensing monitoring and diagnostics...
View Article titled, Hybrid Semiconductor Wafer Inspection Framework via Autonomous Data Annotation
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Topics: Resolution (Optics), Semiconductor wafers, Inspection
Journal Articles

Auto-Labeling for Pattern Recognition of Wafer Defect Maps in Semiconductor Manufacturing

Shu-Kai S. Fan, Pei-Chen Chen, Chih-Hung Jen, Kanchana Sethanan
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070904.
Paper No: MANU-23-1598
https://doi.org/10.1115/1.4065118
Published Online: April 22, 2024
.... Y. , 2019 , “ A Voting Ensemble Classifier for Wafer Map Defect Patterns Identification in Semiconductor Manufacturing ,” IEEE Trans. Semicond. Manuf. , 32 ( 2 ), pp. 171 – 182 . 10.1109/TSM.2019.2904306 [16] Tsai , T. H. , and Lee , Y. C. , 2020 , “ A Light-Weight Neural...
View Article titled, Auto-Labeling for Pattern Recognition of Wafer Defect Maps in <span class="search-highlight">Semiconductor</span> <span class="search-highlight">Manufacturing</span>
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Topics: Semiconductor wafers, Integrated circuit fabrication
Journal Articles

Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels

Hyuck Lee, Hyeonwoo Kim, Heeyoung Kim
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070902.
Paper No: MANU-23-1590
https://doi.org/10.1115/1.4065226
Published Online: April 22, 2024
...@kaist.ac.kr 1 Corresponding author. Email: heeyoungkim@kaist.ac.kr 24 09 2023 22 03 2024 26 03 2024 22 04 2024 Graphical Abstract Figure semiconductor manufacturing weakly supervised semantic segmentation National Research Foundation of Korea 10.13039...
View Article titled, Classification of Chip-Level Defect Types in Wafer Bin Maps Using Only Wafer-Level Labels
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Topics: Cams, Image segmentation, Semantics, Semiconductor wafers, Trains
Journal Articles

Few-Shot Classification of Wafer Bin Maps Using Transfer Learning and Ensemble Learning

Hyeonwoo Kim, Heegeon Yoon, Heeyoung Kim
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. July 2024, 146(7): 070903.
Paper No: MANU-23-1525
https://doi.org/10.1115/1.4065255
Published Online: April 22, 2024
... learning semiconductor manufacturing transfer learning wafer bin map Graphical Abstract Figure 24 08 2023 29 03 2024 29 03 2024 22 04 2024 1 Corresponding author. Email: heeyoungkim@kaist.ac.kr For MatchingNet, we used the adam optimizer with a batch...
View Article titled, Few-Shot Classification of Wafer Bin Maps Using Transfer Learning and Ensemble Learning
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Topics: Semiconductor wafers, Trains, Feature extraction, Algorithms, Ablation (Vaporization technology)
Journal Articles

Order-of-Magnitude Increase in Carbon Nanotube Yield Based on Modeling Transient Diffusion and Outgassing of Water From Reactor Walls

Golnaz Tomaraei, Moataz Abdulhafez, Mostafa Bedewy
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Research Papers
J. Manuf. Sci. Eng. April 2024, 146(4): 041001.
Paper No: MANU-23-1378
https://doi.org/10.1115/1.4063965
Published Online: February 26, 2024
... engineering semiconductor manufacturing Directorate for Engineering 10.13039/100000084 1825772 The growth process of VACNT forests from substrate-bound catalyst nanoparticles by CVD involves several atomic-scale processes that control the formation and self-organization of carbon atoms...
View Article titled, Order-of-Magnitude Increase in Carbon Nanotube Yield Based on Modeling Transient Diffusion and Outgassing of Water From Reactor Walls
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Topics: Carbon nanotubes, Modeling, Water, Water vapor, Diffusion (Physics), Chemical vapor deposition
Journal Articles

Multicultural Diversity Workforce and Global Technology Collaboration Empowered Semiconductor Manufacturing Excellence in Taiwan: A Manufacturing Engineer’s Perspective

Albert J. Shih
Journal: Journal of Manufacturing Science and Engineering
Publisher: ASME
Article Type: Review Articles
J. Manuf. Sci. Eng. September 2023, 145(9): 090801.
Paper No: MANU-23-1179
https://doi.org/10.1115/1.4062729
Published Online: June 30, 2023
...Albert J. Shih This paper summarizes the perspectives from a manufacturing engineer on how the government policy, global partnership, and diversity of the United States (US), Japanese, European, and traditional Chinese cultures in Taiwan have created a workforce of semiconductor manufacturing...
View Article titled, Multicultural Diversity Workforce and Global Technology Collaboration Empowered <span class="search-highlight">Semiconductor</span> <span class="search-highlight">Manufacturing</span> Excellence in Taiwan: A Manufacturing Engineer’s Perspective
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Topics: Integrated circuit fabrication, Manufacturing, Semiconductors (Materials), Cultural diversity, Collaboration