Fig. 1 Typical microelectronic package design. The surrogate metal frame is introduced to keep the package flat during processing and operation. The induced stresses in the package materials could be quite high. More

Fig. 2 The segment in the middle of the assembly is equilibrated by the normal stresses only, while the segment at the assembly end needs interfacial shearing and peeling stresses to be equilibrated More

Fig. 3 If the induced stresses are already high, they do not increase with the further increase in the assembly size, if the product kl of the parameter k of the interfacial shearing stress and half the assembly length l exceeds the level kl ≈ 2.5 More

Fig. 4 The interfacial shearing stress increases at the assembly mid-portion from zero at the assembly mid-cross section to its yield value, and then remains equal to the yield stress in shear More

Fig. 5 Bi-material assembly bonded at the ends More

Fig. 6 Structural element idealized as a simply supported beam (on the left) experiences, as a result of drop tests, high accelerations. These are proportional to the frequency of vibrations squared, and the frequency of the drop induced vibrations is high. The induced stresses are, however, low. ... More

Fig. 7 Experimental setup for drop tests More

Fig. 8 Combined action of tensile and bending deformations and the recorded normal strains on both sides of the PCB More

Fig. 9 Analytical versus FEA data for the nonlinear dynamic response of a PCB to a drop impact More

Fig. 10 Nonlinear response of a PCB to a sudden acceleration applied to its support contour More

Fig. 11 Stretchable (large area) electronics More

Fig. 12 Calculated pressures and measured added optical losses versus temperature in jacketed optical fibers More

Fig. 13 The mid-portion of the bonded bi-material assembly subjected to the combined action of thermal and mechanical loading More

Fig. 14 Tunguska meteorite More

Fig. 1 Constitutive relationships and sign convention for tension and compression used in this work More

Fig. 2 Simulated geometry and input (waveguide) port alignment for the two geometrical cases studied: ( a ) horizontal port alignment and ( b ) vertical port alignment More

Fig. 3 Computational model flowchart More

Fig. 4 Relative permittivity showing ( a ) real ( ε ′ ) and ( b ) imaginary ( ε ″ ) components as functions of temperature More