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Proceedings Papers

Hazardous Area Classification for Surface Well Testing Equipment

Proc. ASME. IOGPC2017, ASME 2017 India Oil and Gas Pipeline Conference, V001T04A003, April 20–22, 2017

Paper No: IOGPC2017-2422

DOI: https://doi.org/10.1115/IOGPC2017-2422

View Paper titled, Hazardous Area Classification for Surface Well Testing Equipment

Topics: Explosives, Fire prevention, Ignition, Risk assessment, Well testing services

Journal Articles

Use of a Gel Finger to Feel the Skin Temperatures of a Smartphone

Akshay Sripada, Morgan Rohlfing, Raymond Vijaendreh, Brenden Spetzler, Ramsey Abdulhamid, Aaron Porras, Y. C. Lee, Ashish Gupta, Enisa Harris

J. Electron. Packag. September 2016, 138(3): 031001.

Paper No: EP-15-1085

DOI: https://doi.org/10.1115/1.4033376

Published Online: May 16, 2016

View Article titled, Use of a Gel Finger to Feel the Skin Temperatures of a Smartphone

Topics: Aluminum, Skin, Temperature

Journal Articles

Special Section on InterPACK 2015

Satish Chaparala, Ashish Gupta, Mehdi Asheghi, Jeffrey Suhling, Toru Ikeda, Xiaobing Luo

J. Electron. Packag. March 2016, 138(1): 010201.

Paper No: EP-16-1019

DOI: https://doi.org/10.1115/1.4032748

Published Online: March 10, 2016

View Article titled, Special Section on InterPACK 2015

Topics: Packaging, Thermal analysis, Electronic packaging, Electronics, Microchannels, Fluids, Printed circuit boards

Proceedings Papers

Challenges and Opportunities in Thermal Management of Multi-Chip Packages

Hemanth K. Dhavaleswarapu, Chandra Mohan Jha, Susan F. Smith, Shrenik Kothari, Baris Bicen, Sanjoy K. Saha, Ashish Gupta

Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A084, July 6–9, 2015

Paper No: IPACK2015-48362

DOI: https://doi.org/10.1115/IPACK2015-48362

View Paper titled, Challenges and Opportunities in Thermal Management of Multi-Chip Packages

Topics: Density, Manufacturing, Reliability, Signals, Thermal management

Proceedings Papers

Thermal-Mechanical Impact of Thermal Solutions in Handheld Devices

Tannaz Harirchian, Zuyang Frank Liang, Kyle Yazzie, Michael A. Schroeder, Ashish Gupta, Alan C. Mcallister

Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T04A019, July 6–9, 2015

Paper No: IPACK2015-48367

DOI: https://doi.org/10.1115/IPACK2015-48367

View Paper titled, Thermal-Mechanical Impact of Thermal Solutions in Handheld Devices

Topics: Boundary-value problems, Data collection, Design, Junctions, Reliability, Simulation, Skin, Solder joints, Stress, Temperature

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

View Article titled, Special Section on InterPACK 2013

Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

An Approach for Automated and Optimized Selection of Weldguns for Spot Welding in Automotive Body Shop

Ashish Gupta, Gopalakrishna K. Shastry, Narahari K. Hunsur, Wayne Cai, Robert Tilove

J. Manuf. Sci. Eng. June 2012, 134(3): 034501.

DOI: https://doi.org/10.1115/1.4005795

Published Online: April 25, 2012

View Article titled, An Approach for Automated and Optimized Selection of Weldguns for Spot Welding in Automotive Body Shop

Topics: Design, Manufacturing, Welding, Geometry, Automobiles, Automotive industry, Integer programming, Production planning, Vacuum, Vehicles

Proceedings Papers

Characterization of Maximum Current Capacity for Microprocessor Sockets

David Song, Ashish Gupta, Chia-Pin Chiu

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1371-1374, July 17–22, 2005

Paper No: IPACK2005-73035

DOI: https://doi.org/10.1115/IPACK2005-73035

View Paper titled, Characterization of Maximum Current Capacity for Microprocessor Sockets

Topics: Computer simulation, Modeling, Pressure, Risk assessment, Temperature

Journal Articles

Effect of Forced Convection on the Skin Thermal Expression of Breast Cancer

Lu Hu, Ashish Gupta, Jay P. Gore, Lisa X. Xu

J Biomech Eng. April 2004, 126(2): 204–211.

DOI: https://doi.org/10.1115/1.1688779

Published Online: May 4, 2004

View Article titled, Effect of Forced Convection on the Skin Thermal Expression of Breast Cancer

Topics: Cancer, Forced convection, Skin, Temperature distribution, Tumors, Air flow, Temperature, Flow (Dynamics), Wind tunnels, Blood